Title :
Ultra-Low Power Radiation Hardened by Design Memory Circuits
Author :
Chen, Tai-Hua ; Chen, Jinhui ; Clark, Lawrence T. ; Knudsen, Jonathan E. ; Samson, Giby
Author_Institution :
Arizona State Univ., Tempe
Abstract :
A 3218 bit ultra-low power radiation-hardened by design (RHBD) register file is fabricated on a 130-nm bulk CMOS technology. Register file readout circuitry allows functionality down to . Dual interlocked cell (DICE) storage provides SEU immunity above in accelerated heavy ion testing. This memory is compared to a larger one using identical ultra low voltage circuit design techniques, but un-hardened, i.e., with conventional latch storage and using only two-edge transistor layout and no guard rings. The un-hardened ultra low voltage memory exhibits 100 lower leakage post-irradiation to 500 krad(Si), when irradiated and measured at , than when irradiated and measured with . Hence, for ultra-low power, ultra-low circuits, TID hardening techniques may be unnecessary. Read energy dissipated by the RHBD memory is 10.3 fJ per bit per operation when operated at 320 mV. The maximum operating frequency is 5 MHz at the same supply voltage.
Keywords :
CMOS memory circuits; elemental semiconductors; radiation hardening; readout electronics; silicon; CMOS technology; SEU immunity; Si; TID hardening techniques; accelerated heavy ion testing; conventional latch storage; design memory circuits; dual interlocked cell; frequency 5 MHz; guard rings; post-irradiation effects; readout circuitry; register file; size 130 nm; two-edge transistor layout; ultra low voltage circuit design techniques; ultra-low power radiation hardening; unhardened ultra low voltage memory; voltage 1.2 V; voltage 320 mV; voltage 500 mV; Application specific integrated circuits; Biomedical measurements; CMOS memory circuits; CMOS technology; Capacitance; Immune system; Low voltage; Radiation hardening; Registers; Threshold voltage; Dual interlocked cell (DICE); radiation hardening; register file; subthreshold circuits; ultra-low power;
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2007.909909