بر اساس عنوان

1
Electro-mechanical energy conversion
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Electromechanical Energy Conversion in Double Cylindrical Structures
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Electromechanical Energy Conversion in nm-Winding Double Cylindrical Structures in Presence of Space Harmonics
4
Electromechanical Energy Conversion in Salient-Pole Structures
5
Electromechanical Energy Conversions in a Cylindrical Pinch Process
6
Electromechanical energy conveter of the wind with maximum power generation
7
Electromechanical Energy Scavenging From Current-Carrying Conductors
8
Electromechanical Equivalent for Use in Power System Stability Studies
9
Electromechanical evaluation of a bondless pressure contact IGBT
10
Electro-mechanical evaluation of Ag trace patterns by ink-jet printing
11
Electromechanical extensions of circuit-based Lyapunov functions with applications to detailed power system models
12
Electro-mechanical feedback for realization of a mechanical spectrum analyzer
13
Electromechanical filter and its performance in d.c. transmission systems
14
Electromechanical Filters for 100-Kc Carrier and Sideband Selection
15
Electromechanical Filters for Single-Sideband Applications
16
Electromechanical flight actuators for advanced flight vehicles
17
Electromechanical flow imaging using ultrasound and electrical capacitance data
18
Electromechanical force analysis of spacecraft transmission lines
19
Electromechanical forces and torque in brushless permanent magnetic machines
20
Electromechanical fuse for storm damage mitigation and outage reduction on distribution line customer service drops
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Electromechanical heart tissue model using cellular automaton
22
Electro-Mechanical Heterogeneous Simulation of the Complex NC Machine Tool from Gear Milling and Hobbing
23
Electro-Mechanical High Impact Wire "Hiwire (TM)" for Severe Mechanical Stress Applications of Ropes and Cables
24
Electromechanical identity recognition as alternative to the coherency identification
25
Electromechanical imaging of biological systems with sub-10 nm resolution
26
Electro-mechanical imaging of the heart using tagged MRI and ECG/MCG arrays
27
Electromechanical imaging of the myocardium at normal and pathological states
28
Electro-mechanical Impedance Modeling for Health Monitoring of a Damaged Thin Plate
29
Electromechanical impedance modeling of cantilever beams with embedded PZT transducers
30
Electromechanical impedance: Analogs and duality
31
Electromechanical Integrated Toroidal Drive
32
Electro-mechanical integration and system architecture strategy for IC engine platform conversion to an electric vehicle
33
Electromechanical interaction in a synchronous reluctance machine
34
Electromechanical investigation into the influence of MWCNT height on the performance of Au/MWCNT composites for electrical contacts
35
Electromechanical Investigation of 2G HTS Twisted Stacked-Tape Cable Conductors
36
Electromechanical Investigation of Different Type YBCO Tapes for Twisted Stacked-Tape Cabling
37
Electro-mechanical manipulation of mammalian cells in suspension
38
Electromechanical means of implementing self-acting gas bearings within free piston Stirling cycle machinery
39
Electro-Mechanical Measurement of Nano Wires -Evaluation of Lambda DNA Wire Coated with Palladium Nano Particles
40
Electromechanical microswitches with thermal actuation
41
Electromechanical Modal Behavior During a 48 Hour Interval Using Nonparametric Methods
42
Electromechanical mode estimation using recursive adaptive stochastic subspace identification
43
Electromechanical Mode Estimation Using Recursive Adaptive Stochastic Subspace Identification
44
Electromechanical mode estimation validation using recursive residual whiteness testing
45
Electromechanical Mode Online Estimation Using Regularized Robust RLS Methods
46
Electromechanical mode on-line estimation using regularized robust RLS methods
47
Electromechanical mode shape estimation based on transfer function identification using PMU measurements
48
Electro-mechanical model for understanding the operation and dynamic behavior of a micro-grid: A case study in Tanzania
49
Electromechanical Model of a Longitudinal Mode Piezoelectric Transformer
50
Electromechanical Model of a Multi-Layer Piezoelectric Cantilever
51
Electromechanical model of an induction machine driven roller conveyor
52
Electromechanical Model of Electrically Actuated Narrow Microbeams
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Electromechanical model of IPMC artificial muscle
54
Electromechanical model-based vibration isolation using a dielectric elastomer actuator
55
Electromechanical modeling and characterization of the electrical breakdown for the capacitive microarrayed ultrasonic transducers
56
Electromechanical modeling and experimental verification of nonlinear hybrid vibration energy harvester
57
Electromechanical modeling and properties of the electret film EMFI
58
Electromechanical Modeling of \\hbox {Nb}_{3}\\hbox {Sn} Superconducting Wires Subjected to Periodic Bending Strain
59
Electromechanical Modeling of a Permanent-Magnet Spherical Actuator Based on Magnetic-Dipole-Moment Principle
60
Electromechanical modeling of actuator dynamics in a load/unload disk drive
61
Electromechanical modeling of actuator dynamics in a load/unload disk drive
62
Electromechanical modeling of biomimmetic actuation behavior of electro-active paper (EAPap)
63
Electromechanical Modeling of Components of a Linear Electromagnetic Accelerator
64
Electromechanical modeling of GNP nanocomposites for stress sensors applications
65
Electromechanical Modeling of Micro Electret Generator for Energy Harvesting
66
Electro-mechanical modeling of the myocardium: coupling and feedback mechanisms
67
Electromechanical modeling using explicit time-domain finite elements
68
Electromechanical modelling and control of a micro-wind generation system for isolated low power DC micro grids
69
Electromechanical Modelling and Reduction of the Electroacoustic Losses in Parallel-Plate Ferroelectric Varactors
70
Electromechanical modelling of high power RF-MEMS switches with ohmic contact
71
Electromechanical modelling of high power RF-MEMS switches with ohmic contact
72
Electro-mechanical modelling of multilayer contacts in electrical connectors
73
Electromechanical modelling of z-pinch plasma lenses with thermal and circuital coupling
74
Electro-mechanical modes in plasma waveguides
75
Electromechanical nonlinearities and losses in piezoelectric sonar transducer materials
76
Electromechanical nonlinearity of ferroelectric ceramics and 90° domain wall motions
77
Electromechanical optical switching and modulation in micromachined silicon-on-insulator waveguides
78
Electromechanical oscillation damping in one hydraulic central [hydropower plant]
79
Electromechanical Parameters Calculation of Permanent Magnet Synchronous Motor Using the Transfer Relations Theorem
80
Electromechanical performance comparison for different CMUT element geometries
81
Electromechanical Performance Comparison for Different Piezoelectric Micromachined Ultrasonic Transducer Element Geometries
82
Electromechanical performance of rails with different cross-section shapes in railgun
83
Electromechanical Performance of Rails With Different Cross-Sectional Shapes in Railgun
84
Electromechanical Piezoelectric Power Harvester Frequency Response Modeling Using Closed-Form Boundary Value Methods
85
Electromechanical Power Conversion
86
Electromechanical power generation for interplanetary space travel beyond low earth orbit
87
Electro-mechanical printed circuit board systems
88
Electromechanical properties of (Pb,La)TiO3 thin films
89
Electromechanical properties of 0-3 vegetable based polyurethane and lead zirconate titanate composite
90
Electro-mechanical properties of a micromachined varactor with a wide tuning range [for VCO]
91
Electromechanical properties of acceptor-doped lead-free piezoelectrics
92
Electromechanical Properties of Bismuth Silicon Oxide (Bi12SiO20)
93
Electromechanical properties of BST for acoustic imaging arrays
94
Electromechanical Properties of Calcium Modified Lead Titanate Ceramics
95
Electromechanical properties of composite electret structures
96
Electromechanical Properties of Ferroelectric Thin Films under Alternating Mechanical and electrical Loadings
97
Electromechanical Properties of Filamentary \\hbox {MgB}_{2} Wires
98
Electromechanical properties of fine-grain, 0.7 Pb(Mg/sub 1/3/Nb/sub 2/3/)O/sub 3/-0.3PbTiO/sub 3/ ceramics
99
Electromechanical properties of high- coupling (1-ξ)Pb(Zn1/3Nb2/3)O3-(ξ)PbTiO3 single crystals for sound projectors
100
Electromechanical properties of high coupling single crystals under large electric drive and uniaxial compression
101
Electromechanical properties of high coupling single crystals under large electric drive and uniaxial compression
102
Electromechanical properties of lead zirconate titanate piezoceramics under the influence of mechanical stresses
103
Electromechanical properties of one dimensinal carbon chains
104
Electromechanical Properties of PbNb2O6and PbTiO3Modified Ceramics Elaborated by a Coprecipitation Process
105
Electromechanical properties of piezoelectric spiral actuators
106
Electromechanical properties of PMN-PT and PZT ceramics at cryogenic temperatures
107
Electromechanical properties of Rainbow devices
108
Electromechanical properties of relaxor ferroelectric P(VDF-TrFE-CFE)-P(VDF-CTFE) blends
109
Electro-mechanical properties of single crystal silicon nano wire
110
Electro-mechanical properties of soft composite materials
111
Electromechanical Properties of Transparent Conducting Substrates for Flexible Electronic Displays
112
Electromechanical properties of wearable strain gauge transducers
113
Electromechanical property characterisation of three-dimensional helical nanobelts by in situ gold nanoink soldering
114
Electro-Mechanical Property Investigation of Striated REBCO Coated Conductor Tapes in Pure Torsion Mode
115
Electromechanical prototype used for physical deployment of Braille characters for digital documents
116
Electromechanical pushbutton switches
117
Electromechanical railgun model
118
Electro-mechanical re-adhesion control simulator for inverter-driven railway electric vehicle
119
Electromechanical regenerative actuator with fault tolerance capability for automotive chassis applications
120
Electromechanical Regenerative Actuator With Fault-Tolerance Capability for Automotive Chassis Applications
121
Electromechanical Relay Panel Replacement Project at TXU Electric Delivery
122
Electromechanical resonances of SiC and AlN beams under ambient conditions
123
Electromechanical resonances of SiC and AlN beams under ambient conditions
124
Electromechanical resonator based bandpass sigma-delta modulator for wireless transceivers
125
Electromechanical resonator detection enhancement by the use of a movable electrode
126
Electromechanical response experiment and study of electroactive dielectric elastomer actuation
127
Electromechanical response of cellular electret films
128
Electromechanical response of silicon nanowires: Bandgap and effective mass
129
Electromechanical response simulation of Film Bulk Acoustic wave resonator
130
Electromechanical Restoration of the Micturition Reflex
131
Electromechanical roller conveyor model with enhanced consideration of roller-belt interaction
132
Electromechanical sensing of charge retention on floating electrodes
133
Electromechanical Sensing of Charge Retention on Floating Electrodes
134
Electromechanical servosystems design: theory and its application
135
Electro-mechanical set-up for automated calibration of current transducers
136
Electromechanical simulator for cardiac catheter positioning: testing device for the intraventricular impedance imaging system
137
Electromechanical Simulator for Weapon System Launching Platform
138
Electromechanical speed map development using FNET/GridEye frequency measurements
139
Electro-Mechanical Spinning: A new manufacturing technique for micro/nano-fabrication of carbon fibers
140
Electromechanical spring stiffness from the small perturbation linearized equations of generalized machine theory
141
Electromechanical Stability of Flexible Nanocrystalline-Silicon Thin-Film Transistors
142
Electromechanical steering, suspension, drive and brake modules
143
Electromechanical stiffness and damping coefficients in the repulsive magnetic levitation system
144
Electromechanical strain at dielectric interfaces
145
Electro-mechanical structures for channel emulation
146
Electro-mechanical studies of skeletal tissues at high resolution
147
Electro-mechanical subsynchronous resonance of a series capacitive compensated line start induction motor drive
148
Electromechanical switching devices: reliability, life and the relevance of circuit design
149
Electromechanical system simulation with models generated from finite element solutions
150
Electromechanical torsional analysis for a generator test bed
151
Electromechanical trade-off analysis of PM-assisted Synchronous reluctance motors
152
Electromechanical Transconductance Properties of a GaN MEMS Resonator With Fully Integrated HEMT Transducers
153
Electro-mechanical transducers
154
Electromechanical transducers in hostile environments
155
Electromechanical transducers to supply an magnetorheological rotary damper: Laboratory testing
156
Electromechanical Transduction with Charged Polyelectrolyte Membranes
157
Electromechanical transient analysis considering the effects of wind turbines connected to the network
158
Electromechanical Transient Behavior Improvement by Coordinated Stabilizers
159
Electromechanical transient characteristics of an actuator by finite elements analysis
160
Electromechanical transient characteristics of an induction actuator by finite element analysis
161
Electromechanical Transient Modeling of Modular Multilevel Converter Based Multi-Terminal HVDC Systems
162
Electromechanical transient modeling of modular multilevel converter based multi-terminal HVDC systems
163
Electromechanical transient modeling research of energy storage system based on power system security and stability analysis
164
Electromechanical transient of series connected three phase slip ring induction motors
165
Electromechanical transient performance of induction motors
166
Electromechanical Transient Performance of Induction Motors
167
Electromechanical transient performance of induction motors
168
Electromechanical transient performance of induction motors
169
Electromechanical transients in a three-phase induction motor during phase failure and plugging
170
Electro-mechanical transients of small plant generators connected to a transmission grid
171
Electromechanical transients simulation on a multicomputer via the VDHN-Maclaurin method
172
Electromechanical Transients Simulation on a Multicomputer via the VDHN-Maclaurin Method
173
Electromechanical tuning of double-membrane Photonic Crystal Cavities
174
Electromechanical Versus Solid-State Control Systems in Packaging and Material Handling: Case Studies
175
Electromechanical vibration generators for autonomous low energy electronic systems
176
Electromechanical Vibration in the Radiation Shield of a Turbogenerator with a Superconducting Field Winding
177
Electro-Mechanical Vibrations in Centrosymmetric Crystals
178
Electromechanical Wave Analysis Through Transient Magnetic Modeling
179
Electromechanical Wave Green´s Function Estimation from Ambient Electrical Grid Frequency Noise
180
Electromechanical Wave Imaging for non-invasive localization and quantification of partially ischemic regions in vivo
181
Electromechanical Wave Imaging of Normal and Ischemic Hearts In Vivo
182
Electromechanical wave propagation in large electric power systems
183
Electromechanical-Filter-Based Bandpass Sigma–Delta Modulator
184
Electromechanically actuated evanescent optical switch and polarization independent attenuator
185
Electromechanically actuating molecules
186
Electromechanically coupled feedback loops for microsystems. Application to volatile organic compounds (VOC) sensors
187
Electromechanically Induced GHz Rate Optical Frequency Modulation in Silicon
188
Electro-mechanically induced GHz rate optical frequency modulation in silicon
189
Electromechanically Stabilized D.C. Amplifier for Use in Transducing and Telemetering of Milli-Voltage and Micro-Ampere Signals
190
Electromechanically steerable directional antenna with floating pillar array
191
Electromechanically switchable diamagnetism for efficient terahertz modulation
192
Electromechanically tunable filter with impedance step
193
Electro-mechanically tunable micro Fabry-Perot filter array
194
Electro-mechanically tunable phase shifter
195
Electromechanically tunable photonic crystal cavities
196
Electromechanically-tunable nanophotonic cavities
197
Electromechanics and Electric Machines
198
Electromechanics and Fluidization Characteristics of Cross Flow Type Electrofluidized Beds
199
Electro-mechanics in biventricular models
200
Electromechanics in the Undergraduate Curriculum
201
Electromechanics modeling of the effects of myocardial infarction on left ventricular function
202
Electromechanics of a Collection of Current Carrying Cantilevered Fibers Sliding against a Plane Moving Surface in a Three Dimensional Magnetic Field
203
Electromechanics of a prolate spheroidal conducting particle on a grounded plane
204
Electromechanics of organic Schottky like contacts, in between piezoelectricity and electrostriction
205
Electromechanics of Precipitated Particulate Layers
206
Electromechano-optically tuned ring resonator in silicon on insulator, monolithically integrated with a microcantilever
207
Electro-mediated damage in the narrowest pore of voltage-gated K channels in frog skeletal muscle membrane
208
Electro-mediated damages in the narrowest pore of the voltage-gated K channels on skeletal muscle membrane
209
Electromedical instrumentation ߝ Indian scene
210
Electrometallurgical applications
211
Electrometallurgical Applications
212
Electrometallurgy in Canada
213
Electrometallurgy of steel and iron
214
Electrometer Measurements of Very Low Ion Densities in Gases
215
Electrometer Tubes for the Measurement of Small Currents
216
Electromganetic field control of electron spin magnetic resonance frequency in silicon donors for solid-state quantum computing
217
Electromigration
218
Electromigration — Induced failure mechanism and lifetime prediction in NiCu thin film
219
Electromigration after stress-induced migration test in quarter-micron Al interconnects
220
Electromigration analyses of open TSVs
221
Electromigration analysis and electro-thermo-mechanical design for semiconductor package
222
Electromigration analysis of full-chip integrated circuits with hydrostatic stress
223
Electromigration analysis of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump
224
Electromigration and 1/f Noise of Aluminum Thin Films
225
Electromigration and adhesion
226
Electromigration and failure in electronics: An introduction
227
Electromigration and low-frequency resistance fluctuations in aluminum thin-film interconnections
228
Electromigration- and obstacle-avoiding routing tree construction
229
Electromigration and stress-induced-voiding in dual damascene Cu/low-k interconnects: a complex balance between vacancy and stress gradients
230
Electromigration and the Current Density Dependence
231
Electromigration and thermal migration in Pb-free interconnects
232
Electromigration and thermomigration in flip chip solder joints
233
Electromigration and thermomigration in Sn3Ag0.5Cu solder joints
234
Electromigration and thermomigration of Pb-free microbumps in three-dimensional integrated circuits packaging
235
Electromigration and voltage drop aware power grid optimization for power gated ICs
236
Electromigration anisotropy and mechanical stress in modern copper interconnect
237
Electromigration Avoidance Aware Net Splitting Algorithm in Analog Circuits
238
Electromigration avoidance in analog circuits: two methodologies for current-driven routing
239
Electromigration aware design for nano-packaging
240
Electro-migration behavior in fine pitch SnBi eutectic solder bump interconnections
241
Electromigration behavior in in-situ Cu6Sn5 reinforced eutectic SnAg composite solder joints
242
Electro-migration behavior in low temperature flip chip bonding
243
Electromigration behavior of 3D-IC TSV interconnects
244
Electromigration behavior of Cu-core/Sn-shell solder joints
245
Electromigration behavior of eutectic SnPb solder
246
Electromigration behavior of flip-chip solder bumps subjected to RF stressing
247
Electromigration behavior of interconnects between chip and board for embedded wafer level ball grid array (eWLB)
248
Electromigration behavior of micro Sn bump under pulsed DC
249
Electromigration behavior of the Ni/SnZn/Cu solder interconnect
250
Electromigration behavior under a unidirectional time-dependent stress
251
Electromigration behaviour of 0.3 μm damascene vs. plasma-etched interconnects: a lifetime and drift analysis
252
Electromigration characteristic of SnAg/sub 3.0/Cu/sub 0.5/ flip chip interconnection
253
Electromigration Characteristic of SnAg _{3.0} Cu _{0.5} Flip Chip Interconnection
254
Electromigration characteristics of Al/W via contact under unidirectional and bidirectional current conditions
255
Electromigration characteristics of copper dual damascene interconnects - line length and via number dependence
256
Electromigration characteristics of copper interconnects
257
Electromigration characteristics of high-temperature sputtered Al-alloy metallization
258
Electromigration characteristics of TiN barrier layer material
259
Electromigration characteristics of tungsten plug vias under pulse and bidirectional current stressing
260
Electromigration characteristics of via chains for multilayered metallization
261
Electromigration characteristics of vias in Ti:W/Al-Cu(2 wt.%) multilayered metallization
262
Electromigration Characterization of DC Magnetron-Sputtered AL-SI Metallization
263
Electromigration characterization of lead-free flip-chip bumps for 45nm technology node
264
Electromigration comparison of selective CVD cobalt capping with PVD Ta(N) and CVD cobalt liners on 22nm-groundrule dual-damascene Cu interconnects
265
Electromigration Control: the Accelerated BEM (Breakdown Energy of Metals) Test
266
Electromigration current limit of high speed SiGe bipolar transistors influenced by device self-heating
267
Electromigration Damage in Al-Cu Thin Films
268
Electromigration Damage in Aluminum Film Conductors
269
Electromigration degradation mechanism analysis of SnAgCu interconnects for eWLB package
270
Electromigration Depletions in Pb-Sn Films
271
Electromigration design rules for bidirectional current
272
Electromigration detection by means of low-frequency noise measurements in thin-film interconnections
273
Electromigration discussion group summary
274
Electromigration discussion group summary
275
Electromigration discussion group summary moderators
276
Electromigration drift and threshold in Cu thin-film interconnects
277
Electromigration early failure distribution in submicron interconnects
278
Electromigration early failure void nucleation and growth phenomena in Cu and Cu(Mn) interconnects
279
Electromigration effect on Cu-pillar(Sn) bumps
280
Electromigration effect on strain and mechanical property change in lead-free solder joints
281
Electromigration effects in power MESFET rectifying and ohmic contacts
282
ELECTROMIGRATION EFFECTS IN VLSI DUE TO VARIOUS CURRENT TYPES
283
Electromigration enhanced growth of intermetallic compound in solder bumps
284
Electromigration Evaluation - MTF Modeling and Accelerated Testing
285
Electromigration extendibility of Cu(Mn) alloy-seed interconnects, and understanding the fundamentals
286
Electromigration extrusion kinetics of Cu interconnects
287
Electromigration failure analysis of flip-chip solder joint by using void growth simulation and synchrotron radiation X-ray microtomography
288
Electromigration failure development in modern dual-damascene interconnects
289
Electromigration failure distribution of contacts and vias as a function of stress conditions in submicron IC metallizations
290
Electromigration Failure Distributions of Cu/Low- k Dual-Damascene Vias: Impact of the Critical Current Density and a New Reliability Extrapolation Methodology
291
Electromigration Failure in A1 Thin Films under Constant and Reversed DC Powering
292
Electromigration Failure in Au Thin-Film Conductors
293
Electromigration Failure in Hieavily Doped Polycrystalline Silicon
294
Electromigration Failure in Thin Film Conductors a perspective
295
Electromigration Failure in Thin Film Silicides and Polysilicon/Silicide (Polycide) Structures
296
Electromigration Failure Mechanism and Lifetime Expectation for Bi-Modal Distribution in Cu/Low-k Interconnect
297
Electromigration failure mechanism comparison between wafer level and package level reliability test on via structure
298
Electromigration failure mechanism of Sn96.5Ag3.5 flip-chip solder bumps
299
Electromigration failure mechanism studies on copper interconnects
300
Electromigration failure mechanisms for different flip chip bump configurations
301
Electromigration failure modes in aluminum metallization for semiconductor devices
302
Electromigration failure of aluminum contact junctions
303
Electromigration failure of circuit - like interconnects: Short length failure time distributions with active sinks and reservoirs
304
Electromigration failure of SnAgCu lead-free BGA package assembled with SnPb solder paste
305
Electromigration Failure Under Pulse Test Conditions
306
Electromigration failure with thermal gradient effect in SnAgCu solder joints with various UBM
307
Electromigration failures at Cu/Sn joint interface
308
Electromigration failures of UBM/bump systems of flip-chip packages
309
Electromigration Feedback Controlled Nanogaps Fabrication Based on MPTMS Adhesion Layer
310
Electromigration for advanced Cu interconnect and the challenges with reduced pitch bumps
311
Electromigration immortality of purely intermetallic micro -bump for 3D integration
312
Electromigration improvement with PDL TiN(Si) barrier in copper dual damascene structures
313
Electromigration improvements with titanium underlay and overlay in Al(Cu) metallurgy
314
Electromigration in a Liquid Bridge before Contact Break
315
Electromigration in a two-level Al-Cu interconnection with W studs
316
Electromigration in advanced Bond Pad structures
317
Electromigration in Al thin films induced by surface acoustic waves: application to imaging
318
Electromigration in Al/Si contacts—Induced open-circuit failure
319
Electromigration in aluminium thin films under pulsed-current conditions
320
Electromigration in Aluminum to Tantalum Silicide Contacts
321
Electromigration In Cu/Sn-58Bi/Cu Interconnects
322
Electromigration in Double-Layer Metallization
323
Electromigration in Dual-Damascene CuMn Alloy IC Interconnects
324
Electromigration in electroplated gold micro contacts
325
Electromigration in eutectic SnPb solder bumps with Ni/Cu UBM
326
Electromigration in eutectic tin-lead solder lines at the device temperature
327
Electromigration in Flip Chip Pb-Free Solder Joints
328
Electromigration in Flip-chip solder joints
329
Electromigration in Giant Magnetoresistance Spin Valve Read Sensors Under Pulsed DC Magnetic Field: An Analytical and Numerical Study
330
Electromigration in hybrid bonding interconnects for 3-D IC impact of the diffusion barrier
331
Electromigration in Large Volume Solder Joints
332
Electromigration in Lead-Free Sn3.8Ag0.7Cu Solder Reaction Couple
333
Electromigration in multi-level interconnects with polymeric low-k interlevel dielectrics
334
Electromigration in Narrow Al(Si) Stripes for VLSI: Comparison between MTF and Resistometric Methods for Life Predictions
335
Electromigration in narrow and large damascene copper lines
336
Electromigration in Ni/Sn intermetallic micro bump joint for 3D IC chip stacking
337
Electromigration in Pb-free bumps with different UBM thickness
338
Electromigration in Pb-free solder bumps with Cu column as flip chip joints
339
Electromigration in Pb-free solders
340
Electromigration in SnPb and Pb-free solder bumps
341
Electromigration in solder bumps: A mean-time-to-failure TCAD study
342
Electromigration in sputtered aluminum films
343
Electromigration in sputtered copper interconnection with polyimide as interlevel dielectric or passivation
344
Electromigration in strapped metal layers with large dimensions for lateral power device applications
345
Electromigration in stress-voided Al alloy conductors
346
Electromigration in the VLSI interconnect metallizations
347
Electromigration in thin gold films
348
Electromigration in thin-film photovoltaic module metallization systems
349
Electromigration in tin thin film
350
Electromigration in Titanium Doped Aluminum Alloys
351
Electromigration Induced Damage and Structure Change in Cr-Al/Cu and Al/Cu Interconnection Lines
352
Electromigration induced evolution of voids in current crowding areas of interconnects
353
Electromigration induced failure in SnAg3.8Cu0.7 solder joints for flip chip technology
354
Electromigration induced failure mechanism: Multiphysics model and correlation with experiments
355
Electromigration induced failure of solder bumps and the role of IMC
356
Electromigration induced incubation, drift and threshold in single-damascene copper interconnects
357
Electromigration Induced Leakage at Shallow Junction Contacts Metallized with Aluminum/Poly-Silicon
358
Electromigration induced resistance increase in open TSVs
359
Electromigration induced stress in open TSVs
360
Electromigration induced stress in through-silicon-via (TSV)
361
Electromigration induced void kinetics in Cu interconnects for advanced CMOS nodes
362
Electromigration instability of cylindrical surface microrelief
363
Electromigration interconnect lifetime under AC and pulse DC stress
364
Electromigration investigations of aluminum alloy interconnects
365
Electromigration Issues in High Current Horn
366
Electromigration lifetime as a function of line length or step number
367
Electromigration lifetime enhancement for lines with multiple branches
368
Electromigration lifetime improvement of copper interconnect by cap/dielectric interface treatment and geometrical design
369
Electromigration Lifetime Optimization by Uniform Designs and a New Lifetime Index
370
Electromigration lifetime prediction of RF-PA transistors
371
Electromigration lifetime statistics for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages
372
Electromigration lifetime sudies of submicrometer-linewidth Al-Cu conductors
373
Electromigration measurements in thin-film IPD and eWLB interconnections
374
Electromigration mechanisms in Cu lines
375
Electromigration mechanisms in Cu nano-wires
376
Electromigration median time-to-failure based on a stochastic current waveform
377
Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs
378
Electromigration modeling for integrated circuit interconnect reliability analysis
379
Electromigration modeling with consideration of hillock formation
380
Electromigration modelling of void nucleation in open Cu-TSVs
381
Electromigration multistress pattern technique for copper drift velocity and Black’s parameters extraction
382
Electromigration noise measurements using a novel AC/DC wafer-level noise measurement system
383
Electromigration of 300 µm diameter Sn-3.0Ag-0.5Cu lead-free bumps in flip chip package
384
Electromigration of 96.5Sn-3Ag-0.5Cu flip-chip solder bumps bonded on substrate pads of Au/Ni/Cu or Cu metallization
385
Electromigration of Al-Si Alloy Films
386
Electromigration of Bias-Sputtered Al and Comparison with Others
387
Electromigration of C4 bumps in ceramic and organic flip-chip packages
388
Electromigration of Cu interconnects under AC, pulsed-DC and DC test conditions
389
Electromigration of Cu-Sn-Cu micropads in 3D interconnect
390
Electromigration of flip chip solder bump on Cu/Ni(V)/Al thin film under bump metallization
391
Electromigration of ionized cluster beam deposited aluminum metallizations
392
Electromigration of magnetic thin films for predicting electrical-failured lifetime of GMR read heads
393
Electromigration of Mobile Defects in CdTe
394
Electromigration of MRAM-customized Cu interconnects with cladding barriers and top cap
395
Electromigration of NiSi poly gated electrical fuse and its resistance behaviors induced by high temperature
396
Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM
397
Electromigration of Pb-Free Solder Flip Chip Using Electroless Ni-P/Au UBM
398
Electromigration of silicon and phosphorus in tantalum polycide interconnections
399
Electro-migration of silver alloy wire with its application on bonding
400
Electromigration of Sn-9Zn solder in contact with Cu
401
Electromigration of SnAg bump with Ni UBM on various substrate pad finishes with SnCu presolder
402
Electromigration of solder balls for wafer-level packaging with different under bump metallurgy and redistribution layer thickness
403
Electromigration of Sputtered Al-Si Alloy Films
404
Electromigration of submicron Damascene copper interconnects
405
Electromigration of TiPdAu Conductors
406
Electromigration performance enhancement of Cu interconnects with PVD Ta cap
407
Electromigration performance for Al/SiO2, Cu/SiO2 and Cu/low-K interconnect systems including Joule heating effect
408
Electromigration performance of Cu pillar bump for flip chip packaging with bump on trace by using thermal compression bonding
409
Electromigration performance of CVD-W/Al-alloy multilayered metallization
410
Electromigration performance of electroless plated copper/Pd-silicide metallization
411
Electromigration performance of laser planarized aluminum alloy films
412
Electromigration performance of printed Sn0.7Cu bumps with immersion tin surface finishing for flip chip applications
413
Electromigration prediction and test for 0.18μm power technology in wafer level reliability
414
Electromigration properties of electroless plated Cu metallization
415
Electromigration recovery and short lead effect under bipolar- and unipolar-pulse current
416
Electromigration reliability and current carrying capacity of various WLCSP interconnect structures
417
Electromigration Reliability and Morphologies of 62Sn–36Pb–2Ni and 62Sn–36Pb–2Cu Flip-Chip Solder Joints
418
Electromigration reliability and morphologies of Cu pillar flip-chip solder joints
419
Electromigration reliability and morphologies of Cu pillar with microbump under high current density stressing
420
Electromigration reliability comparison of Cu and Al interconnects
421
Electromigration reliability enhancement of flip chip interconnects using Cu-doped SnPb solder
422
Electromigration reliability enhancement via bus activity distribution
423
Electromigration reliability evaluation in FCBGA package based on orthogonal experimental design
424
Electromigration reliability for a tungsten-filled via hole structure
425
Electromigration reliability improvement of W-plug vias by titanium layering
426
Electromigration reliability indicators
427
Electromigration reliability issues in dual-damascene Cu interconnections
428
Electromigration Reliability of 60 nm Dual Damascene Cu Interconnects
429
Electromigration reliability of Cu interconnects and effects of low K dielectrics
430
Electromigration reliability of Cu interconnects and the impact of low-k dielectrics
431
Electromigration reliability of cylindrical Cu pillar SnAg3.0Cu0.5 bumps
432
Electromigration reliability of dual damascene copper interconnect with different IMD structures
433
Electromigration reliability of dual damascene Cu/CVD SiOC interconnects
434
Electromigration reliability of low capacitance air-gap interconnect structures
435
Electromigration reliability of Mn-doped Cu interconnects for the 28 nm technology
436
Electromigration reliability of open TSV structures
437
Electromigration reliability of redistribution lines in wafer-level chip-scale packages
438
Electromigration reliability of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy
439
Electromigration reliability of SnAgxCuy flip chip interconnects
440
Electromigration reliability of solder bumps
441
Electromigration reliability of tungsten and aluminum vias and improvements under AC current stress
442
Electromigration Reliability with Respect to Cu Content in Solder Joint System
443
Electromigration Resistance of Fine-Line Al for VLSI Applications
444
Electromigration resistance of TiN-layered Ti-doped Al interconnects
445
Electromigration resistant alternatives to aluminum-copper
446
Electromigration Resistant Power Delivery Systems
447
Electromigration Results with Large Sample Size for Dual Damascene Structures in a Copper/CVD Low-k Dielectric Technology
448
Electromigration simulation at circuit levels
449
Electromigration simulation in Cu-low-K multilevel interconnect segments
450
Electromigration simulation under DC/AC stresses considering microstructure
451
Electromigration simulation with consideration of the atomic concentration gradient
452
Electromigration simulations for small scale structures
453
Electromigration Studies of Cu/Carbon Nanotube Composite Interconnects Using Blech Structure
454
Electromigration studies of lead-free solder balls used for wafer-level packaging
455
Electromigration studies of the role of oxygen defects in YBa/sub 2/Cu/sub 3/O/sub 7- delta / grain boundary weak links
456
Electromigration studies on Sn(Cu) alloy lines
457
Electromigration study for multi-scale power/ground vias in TSV-based 3D ICs
458
Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs
459
Electromigration Study in Flip Chip Solder Joints
460
Electro-Migration Study in Solder Joint and Interconnects of IC packages
461
Electromigration study of 50 µm pitch micro solder bumps using four-point Kelvin structure
462
Electromigration study of Al and Cu metallization using WLR isothermal method
463
Electromigration study of Cu/low k dual-damascene interconnects
464
Electromigration study of eutectic SnPb flip-chip solder joints on ceramic substrates
465
Electromigration study of high lead solders in flip-chip packages using the Wheatstone bridge method
466
Electromigration study of magnetic thin films for the electrical reliability of spin-valve read heads
467
Electromigration study of micro bumps at Si/Si interface in 3DIC package for 28nm technology and beyond
468
Electro-migration study of nano Al doped lead- free Sn-58Bi on Cu and Au/Ni/Cu ball grid array (BGA) packages
469
Electromigration study of SnCu0.7 solder joints with Ag added by different methods
470
Electromigration Study of the Al-Cu/Ti/Al-Cu System
471
Electromigration study on Cu-Sn interconnections
472
Electromigration Study on Micro-vias of Multi-layer Anodic Alumina Substrate with a Thermal Compensated on-line Measurement Scheme
473
Electromigration study on the interconnects of high density power modules
474
Electromigration test on via line structure with a self-heated method
475
Electromigration Test on Void Formation and Failure Mechanism of FCBGA Lead-Free Solder Joints
476
Electromigration test structure designed to identify via failure modes
477
Electromigration Testing of Al-Alloy Films
478
Electromigration Testing of Ti/Al-Si Metallization for Integrated Circuits
479
Electromigration testing of wire bonds
480
Electromigration testing on via line structures with a SWEAT method in comparison to standard package level tests
481
Electromigration testing on via line structures with fast wafer level tests in comparison to standard package level tests
482
Electromigration testing using modulated reflectance imaging
483
Electromigration tests for critical stress and failure mechanism evaluation in Cu/W via/Al hybrid interconnect
484
Electromigration threshold for Cu/low k interconnects
485
Electromigration threshold in copper interconnects and consequences on lifetime extrapolations
486
Electromigration threshold in single-damascene copper interconnects with SiO/sub 2/ dielectrics
487
Electromigration threshold length effect in dual damascene copper-oxide interconnects
488
Electromigration Time to Failure Simulation for Solder Bumps of a Chip Scale Package
489
Electromigration wafer level reliability test and analysis methodology
490
Electromigration—A brief survey and some recent results
491
Electromigration, fuse and thermo-mechanical performance of solder bump versus Cu pillar flip chip assemblies
492
Electromigration, Thermal Analysis and Die Attach--A Case History
493
Electromigration: the time bomb in deep-submicron ICs
494
Electromigration-aware and IR-Drop avoidance routing in analog multiport terminal structures
495
Electromigration-aware design
496
Electromigration-aware physical design of integrated circuits
497
Electromigration-aware rectilinear Steiner tree construction for analog circuits
498
Electromigration-aware redundant via insertion
499
Electromigration-aware routing for 3D ICs with stress-aware EM modeling
500
Electromigration-based deposition enabled by nanorobotic manipulation inside a transmission electron microscope
501
Electromigration-dependent parametric yield estimation
502
Electromigration-induced accelerated consumption of Cu pad in flip chip Sn2.6Ag solder joints
503
Electromigration-induced compressive stresses in encapsulated thin-film conductors
504
Electromigration-induced copper interconnect degradation and failure: the role of microstructure
505
Electromigration-induced damage of Au conductor lines
506
Electromigration-induced degradation around electrode of GaN light-emitting diode in water vapour
507
Electromigration-Induced Extrusions in Multi-Level Technologies
508
Electromigration-induced failure analysis of VLSI interconnection components
509
Electromigration-Induced Failure Characteristics of Spin-Valve Multilayers for Metallic-Based Spintronic Devices
510
Electromigration-induced failure of GaN multi-quantum well light emitting diode
511
Electromigration-induced failure of Ni/Sn3.0Ag0.5Cu/ENEPIG flip chip solder joint
512
Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces
513
Electromigration-Induced Failures in VLSI Interconnects
514
Electromigration-induced integration limits on the future ULSI´s and the beneficial effects of lower operation temperatures
515
Electromigration-induced interfacial reactions in line-type Cu/Sn/ENIG interconnect
516
Electromigration-Induced Short Circuit Failure
517
Electromigration-limited lifetime of aluminum bond pads
518
Electromigration-limited reliability of advanced metallization for memory devices
519
Electromigrationreliability of Cu interconnects and impact of low K dielectrics
520
Electromigration-resistance enhancement with CoWP or CuMn for advanced Cu interconnects
521
Electromobility and carsharing/carpooling services at the University of Deusto: A preliminary exploratory survey
522
Electromobility potential index
523
Electromobility Studies Based on Convex Optimization: Design and Control Issues Regarding Vehicle Electrification
524
Electromodulated third harmonic generation: a new window on surface /spl chi//sup (4)/
525
Electro-modulation of plasmonic and photonic-metamaterial structures
526
Electro-modulation spectroscopy on excitons in /spl beta/-carotene and related polyenes
527
Electromodulation-Absorption Type Spectroscopy of Semiconductor Structures Applied in Telecommunication Lasers
528
Electromolding for 3D cell culture
529
Electromorphic ceramics in extreme environment parametric device applications
530
Electromotive force generation induced by cyclotron resonance in semiconductors
531
Electromotive force induced by domain wall propagation in cylindrical magnetic microwire
532
Electromotive Force Induced in and Inductance of an Electrically Small Circular Loop Antenna
533
Electromotive Force Wave-Shape in Alternators
534
Electromotive force wave-shape in alternators
535
Electromotive power and locomotion
536
Electromotive Triggering and Single Sweep Analysis of Vestibular Evoked Myogenic Potentials (VEMPs)
537
Electromygraphy (EMG) signal based hand gesture recognition using artificial neural network (ANN)
538
Electromyogram (EMG) amplitude estimation and joint torque model performance
539
Electromyogram (EMG) based fingers movement recognition using Neighborhood Preserving Analysis with QR-decomposition
540
Electromyogram (EMG) based fingers movement recognition using neighborhood preserving analysis with QR-decomposition
541
Electromyogram (EMG) feature reduction using Mutual Components Analysis for multifunction prosthetic fingers control
542
Electromyogram amplitude estimation with adaptive smoothing window length
543
Electromyogram Bandwidth Requirements When the Signal is Whitened
544
Electromyogram control algorithms for the Upper Limb Single-DOF Powered Exoskeleton
545
Electromyogram data compression using single-tree and modified zero-tree wavelet encoding
546
Electromyogram decomposition using the single-lineage clustering algorithm and wavelets
547
Electromyogram decomposition via unsupervised dynamic multi-layer neural network
548
Electromyogram Pattern Classification Based On Heuristic Rules
549
Electromyogram recording of the diaphragm: modeling, simulation, and experimental comparison
550
Electromyogram signal analysis and movement recognition based on wavelet packet transform
551
Electromyogram signal based human emotion classification using KNN and LDA
552
Electromyogram signal enhancement in FMRI noise using spectral subtraction
553
Electromyogram signal processing by using M-transform
554
Electromyogram Whitening for Improved Classification Accuracy in Upper Limb Prosthesis Control
555
Electromyogram-triggered inspiratory event detection algorithm
556
Electromyograph and keystroke dynamics for spoof-resistant biometric authentication
557
Electromyograph data acquisition and application using Cypress Programmable System on Chip
558
Electromyographic activity using Elastic Resistance and Nautilus Machine exercises
559
Electromyographic analysis of a human powered stepper bike
560
Electromyographic analysis of transient postural responses to anterior-posterior platform translations
561
Electromyographic analysis of upper extremity muscles during overhead work
562
Electromyographic analysis of voluntary elbow movements in subjects with spasticity
563
Electromyographic assessment of muscle fatigue during isometric vibration training at varying frequencies
564
Electromyographic behavior of the hamstrings muscles during ramp isometric contractions test
565
Electromyographic evaluation of muscle recovery after isometric fatigue
566
Electromyographic evaluation of operator performance in manual control tracking
567
Electromyographic evaluation of therapeutic massage effect using multi-finger robot hand
568
Electromyographic frequency response of robotic laparoscopic training
569
Electromyographic hyperactivation of skeletal muscles by time-modulated mechanical stimulation
570
Electromyographic mapping of finger stiffness in tripod grasp: a proof of concept
571
Electromyographic Measurements Of Lumbar Muscle Activity During Isoforce Loading Exercises
572
Electromyographic movement pattern recognition based on random forest algorithm
573
Electromyographic signal compression based on preprocessing techniques
574
Electromyographic signal compression based on two-dimensional techniques
575
Electromyographic signal integrated robot hand control for massage therapy applications
576
Electromyographic signals processing for robotic assistance tools in the rural population
577
Electromyographic study in 5 muscles during an isometric fatiguing protocol
578
Electromyography
579
Electromyography (EMG) based signal analysis for physiological device application in lower limb rehabilitation
580
Electromyography (EMG) signal compression using sinusoidal segmental model
581
Electromyography (EMG)-based Chinese voice command recognition
582
Electromyography (EMG)-based thump-tip force estimation for prosthetic thumb
583
Electromyography analysis and fatigue evaluation of rectus abdominis muscle during core exercise
584
Electromyography analysis for pre-clinical trials of hand rehabilitation tasks using design of experiments
585
Electromyography microcontroller leg brace processing software
586
Electromyography of the human uterus
587
Electromyography on surgeons during urological operations
588
Electromyography sensor based control for a hand exoskeleton
589
Electromyography signal analysis using spectrogram
590
Electromyography signal bridge and motor function rebuilding of paralyzed limbs based on principles of communication of body-sensor network
591
Electromyography signals acquisition and real-time classification
592
Electromyography: Physiology, Engineering, and Noninvasive Applications [Book Review]
593
Electromyography-Based Locomotion Pattern Recognition and Personal Positioning Toward Improved Context-Awareness Applications
594
Electron
595
Electron - beam annealing of B-, P-, As-, Sb-, and Ga-implanted silicon by multiple-scan method
596
Electron ablation as a method of condensed matter surface profiling
597
Electron absorption of elastic waves in low-dimensional conductors
598
Electron Acceleration Based on an Elongated Plasma Channel
599
Electron acceleration behind the dipolarization fronts in the magnetotail
600
Electron acceleration by a plasma wave in a density modulated plasma
601
Electron acceleration by fast electrostatic waves moving orthogonally across a magnetic field
602
Electron acceleration by laser wakefields in tapered plasma densities
603
Electron Acceleration in a Homogenious Disc Loaded Guide with Beam Loading Effect
604
Electron acceleration in a single-cycle terahertz field
605
Electron acceleration in a system of inverse synchrotron radiation
606
Electron acceleration in relativistic plasma waves generated by a single frequency short-pulse laser
607
Electron Acceleration Inside a Circular and Elliptical Plasma Waveguide With Metallic Rod
608
Electron Acceleration Using High Gradient Single Cell Resonators
609
Electron accelerator based on repetitive pulsed Marx generator
610
Electron accelerator for transmutation of fission products and nuclear fuel cycle actinides
611
Electron accelerator is placed in operation
612
Electron accelerator options for photo-detection of fissile materials
613
ELECTRON ACCELERATOR POWERED BY INDUCTIVE STORAGE BASED ON INDUCTION PLASMA INJECTORS
614
Electron accelerator with inductive storage for vircator load
615
Electron accelerator with superconductive inductive storage
616
Electron accelerator´s production of technetium-99m for nuclear medicine
617
Electron accelerators driven by modulated intense relativistic electron beams
618
Electron Accelerators for Electron Microscopy in the 1 MeV Range
619
Electron Affinities - Theoretical
620
Electron Analog Tests of Proton Linear Accelerator Structure
621
Electron and atomic force microscopy studies of femtosecond laser machining of Si, GaAs and InP
622
Electron and Chemical Kinetics in the Low-Pressure RF Discharge Etching of Silicon in SF6
623
Electron and exciton spectra in opened nanoheterosystems
624
Electron and exciton-phonon interaction in quantum dots and wires: the peculiarities of Raman spectrum
625
Electron and hole charge separation with a dual channel transistor
626
Electron and hole conduction in amorphous CVD siliconnitride layers
627
Electron and hole contribution to thermal noise in short-channel MOSFETs
628
Electron and Hole Current Characteristics of n-i-p-Type Semiconductor Quantum Dot Transistor
629
Electron and hole drift velocity measurements in silicon and their empirical relation to electric field and temperature
630
Electron and hole impact ionization rates in GaAs
631
Electron and hole impact ionization rates in InP/Ga0.47In0.53As superlattice
632
Electron and hole lifetimes in electron-irradiated Si P+-n-n+ diodes
633
Electron and hole mobilities in inversion layers on thermally oxidized silicon surfaces
634
Electron and hole mobilities in silicon as a function of concentration and temperature
635
Electron and hole mobility enhancement in strained SOI by wafer bonding
636
Electron and hole mobility enhancement in strained-Si MOSFET´s on SiGe-on-insulator substrates fabricated by SIMOX technology
637
Electron and hole mobility enhancements in sub-10 nm-thick strained silicon directly on insulator fabricated by a bond and etch-back technique
638
Electron and hole mobility in anthracene
639
Electron and hole mobility in silicon at large operating temperatures. I. Bulk mobility
640
Electron And Hole Nobilities In Multiple Quantum Well Semiconductors From Spin And Population Gratings
641
Electron and hole photocurrent effects on impatt oscillators
642
Electron and hole quantization and their impact on deep submicron silicon p- and n-MOSFET characteristics
643
Electron and Hole Real Space Transfer in InAlAs/InGaAs Heterostructure Device
644
Electron and hole trapping in doped oxides
645
Electron and hole trapping in irradiated SIMOX, ZMR and BESOI buried oxides
646
Electron and hole trapping in the buried oxide of Unibond wafers
647
Electron and hole traps in SiO2 films thermally grown on Si substrates in ultra-dry oxygen
648
Electron and Ion Acceleration in the Bubble Regime
649
Electron and ion beam generation from a pseudospark
650
Electron and ion beam research at NRL
651
Electron and ion beam transport to fusion targets
652
Electron and ion emission from liquid metal surfaces
653
Electron and ion emission from liquid metals
654
Electron and ion energies over 100 keV in a dense plasma focus: results, theory and prospects
655
Electron and ION flow in pinch diodes, stability and pinch size
656
Electron and Ion Kinetics in a DC Microplasma at Atmospheric Pressure
657
Electron and ion magnetohydrodynamic effects in plasma opening switches
658
Electron and ion magnetohydrodynamic effects in plasma opening switches
659
Electron and ion noise in microwave tubes
660
Electron and ion noise in microwave tubes
661
Electron and Ion Source ECR Plasma for Electric Propulsion Applications
662
Electron and Ion Tracks in Silicon: Spatial and Temporal Evolution
663
Electron and ion transport in dense gases
664
Electron and ion transport in dense rare gases
665
Electron and neutron radiation damage effects on a two-phase CCD
666
Electron and neutron radiation-induced order effect in gallium arsenide
667
Electron and Optical Pulse Shape Measurement on a Far-Infared Free-Electron Laser Using Differential Optical Grating
668
Electron and Photon Energy Measurement up to 4 BeV
669
Electron and photon responses of Gd2SiO5(Ce3+) and BaF2
670
Electron and plasma flow in a relativistic diode subjected to a crossed magnetic field
671
Electron and positron swarms: Collision and transport data and kinetic phenomena
672
Electron and Proton Acceleration from Solid Targets by High-intensity Table-top Lasers
673
Electron and Proton Beam Diagnostics with Synchrotron Radiation
674
Electron and proton damage coefficients for heteroepitaxial InP solar cells
675
Electron and Proton Damage Coefficients in Low-Resistivity Silicon
676
Electron and proton irradiation effects on substrate-type amorphous silicon solar cells
677
Electron and proton irradiation of GaSb infrared solar cells
678
Electron and proton radiation effects in the high temperature superconductor YBa2Cu3O7-δ
679
Electron and proton radiation effects on GaAs and CuInSe2 thin film solar cells
680
Electron and role trapping parameters of low-temperature-grown GaAs
681
Electron angular distribution from ultrahigh-intensity-laser and solid targets interaction
682
Electron angular distribution in an opening-switch-driven coaxial diode
683
Electron aspects
684
Electron aspects
685
Electron aspects
686
Electron aspects
687
Electron aspects
688
Electron aspects
689
Electron aspects
690
Electron aspects
691
Electron aspects
692
Electron aspects
693
Electron aspects
694
Electron aspects
695
Electron aspects
696
Electron aspects
697
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698
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699
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700
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701
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702
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703
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704
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705
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706
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707
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708
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709
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710
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711
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712
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713
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714
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715
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716
Electron aspects
717
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718
Electron aspects
719
Electron aspects
720
Electron aspects
721
Electron aspects
722
Electron aspects
723
Electron aspects
724
Electron aspects
725
Electron aspects
726
Electron aspects
727
Electron aspects
728
Electron aspects
729
Electron aspects
730
Electron aspects
731
Electron aspects
732
Electron aspects
733
Electron aspects
734
Electron aspects
735
Electron aspects
736
Electron aspects
737
Electron aspects
738
Electron aspects
739
Electron aspects
740
Electron aspects
741
Electron aspects
742
Electron aspects
743
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744
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745
Electron aspects
746
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747
Electron aspects
748
Electron aspects
749
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750
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751
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752
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753
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754
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755
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756
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757
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758
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759
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760
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761
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762
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763
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764
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765
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766
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767
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768
Electron aspects
769
Electron aspects
770
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771
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772
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773
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774
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775
Electron aspects
776
Electron aspects
777
Electron aspects
778
Electron aspects
779
Electron aspects
780
Electron aspects
781
Electron aspects
782
Electron aspects
783
Electron attachment and ionic recombination in a kinestatic charge detector for digital radiography
784
Electron Attachment to Medium-Energy Ions
785
Electron Attachment: A New Approach to H 2 Fluxless Solder Reflow for Wafer Bumping
786
Electron Avalanche Assisted by Preionization of Electron Beam in Ar
787
Electron Avalanche Injection in Thin Nitrided Sio2 Films
788
Electron Avalanche Mechanism in the Pressboard-insulating Oil Combination, in Power Applications
789
Electron avalanches in argon gas
790
Electron avalanches in liquid xenon induced by space charge
791
Electron avalanches influenced by detachment and conversion processes
792
Electron Avalanches Near a Charged Insulator
793
Electron avalanches visualized: Heinz Raether (1909-1986)
794
Electron avalanches. I. Statistics of partial microdischarges in their pre-streamer stage
795
Electron avalanches. II. Fractal morphology of partial microdischarge spots on dielectric barriers
796
Electron Back-Bombardment and Mitigation in a Short Gap, Thermionic Cathode RF Gun
797
Electron Backscatter Diffraction Analysis on {\\hbox {Nb}}_{3}{\\hbox {Sn}} and