<< مقالات لاتين فني مهندسي >>
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1
Chinese Servant Leadership: A Qualitative Investigation
2
Chinese shallow parsing using different phase systems
3
Chinese Sign Language Animation System on Mobile Devices
4
Chinese sign language recognition based on gray-level co-occurrence matrix and other multi-features fusion
5
Chinese sign language recognition based on video sequence appearance modeling
6
Chinese Sign Language Recognition for a Vision-Based Multi-features Classifier
7
Chinese sign language recognition with 3D hand motion trajectories and depth images
8
Chinese Signature Identification Based on Dynamic Studying System
9
Chinese signature verification with moment invariants
10
Chinese skin detection in different color spaces
11
Chinese Small-Scale Quarterly Macroeconomic Model under Indirect Regulation of Monetary Policy
12
Chinese Smart Phone Market Competition Analysis Based on AHP
13
Chinese SNS blog classification using semantic similarity
14
Chinese Social Media Analysis for Disease Surveillance
15
Chinese Spam Filter Based on Relaxed Online Support Vector Machine
16
Chinese spam filtering based on online active learning methods
17
Chinese speech recognition system with very large vocabulary
18
Chinese speech understanding system
19
Chinese spelling checker in reading machine for visually impaired persons
20
Chinese Spelling Errors Detection Based on CSLM
21
Chinese spoken document retrieval based on syllable neighbor posterior probability matrix
22
Chinese Spoken Document Summarization Using Probabilistic Latent Topical Information
23
Chinese spoken language understanding with conditional random fields
24
Chinese sports channel for the insurance industry marketing problems and suggestions
25
Chinese stock bid-ask spread estimation and industry analysis
26
Chinese students´ conceptions on a Sino-Finnish joint program of International Design Business Management
27
Chinese style car showroom design
28
Chinese Subcategorization Annotation Based on Machine Learning
29
Chinese subjectivity detection using a sentiment density-based naive Bayesian classifier
30
Chinese syllable-to-character conversion with recurrent neural network based supervised sequence labelling
31
Chinese symbols in POP fashion art
32
Chinese Synthesized Term Structure of Interest Rate
33
Chinese tag analysis for foreign movie contents
34
Chinese Temporal Relation Resolution Based on Chinese-English Parallel Corpus
35
Chinese Term Recognition and Extraction Based on Hidden Markov Model
36
Chinese Terminology Extraction Using Bilingual Web Resources
37
Chinese Text Automatic Summarization Based on Affinity Propagation Cluster
38
Chinese text categorization based on CCIPCA and SMO
39
Chinese Text Categorization Based on Fuzzy Association Rules
40
Chinese text categorization study based on CBM learning
41
Chinese Text Categorization study based on feature weight learning
42
Chinese text categorization using the character N-gram
43
Chinese Text Chunking Using Divide-Conquer Model
44
Chinese text chunking using lexicalized HMMs
45
Chinese Text Classification Based on Extended Naïve Bayes Model with Weighed Positive Features
46
Chinese text classification based on improved domain ontology graph model-DOG
47
Chinese Text Classification Based on Summarization Technique
48
Chinese Text Classification Based on the BVB Model
49
Chinese text classification method based on NMF
50
Chinese Text Classification Using Key Characters String Kernel
51
Chinese Text Classification without Automatic Word Segmentation
52
Chinese Text Clustering Method Based on Semantics and Special Domain
53
Chinese text compression algorithm based on LZW
54
Chinese text detection and location for images in multimedia messaging service
55
Chinese text digital watermarking algorithm based on the edges number of junction in the Chinese characters
56
Chinese text emotion classification based on emotion dictionary
57
Chinese text extraction for video scene by multiframe corner matching and heuristic rules
58
Chinese text feature extraction method based on bigram
59
Chinese Text Information Hiding Based on Paraphrasing Technology
60
Chinese text mining based on distributed SMO
61
Chinese text mining based on subspace clustering
62
Chinese text orientation analysis based on phrase
63
Chinese text retrieval: an adjacency matrix based approach
64
Chinese text sentiment analysis based on fuzzy semantic model
65
Chinese text sentiment classification based on granule network
66
Chinese text sentiment orientation identification based on Chinese-characters
67
Chinese Text Watermarking Based on Occlusive Components
68
Chinese Text Zero-Watermark Based on Sentence´s Entropy
69
Chinese Text Zero-Watermark Based on Space Model
70
Chinese Textual Entailment recognition model based on lexical and semantic matching
71
Chinese textual entailment with Wordnet semantic and dependency syntactic analysis
72
Chinese traditional architectural landscape and ecological consciousness
73
Chinese Traditional Opera database for Music Genre Recognition
74
Chinese Traffic Police Gesture Recognition in Complex Scene
75
Chinese Trust Judgment: A Risk Control Approach
76
Chinese Typed Collocation Extraction using Corpus-based Syntactic Collocation Patterns
77
Chinese university students´ English learning satisfaction evaluation
78
Chinese unknown word identification as known word tagging
79
Chinese Unknown Word Recognition Based on Functional Applications of Type Theory
80
Chinese Unknown Word Recognition Using Improved Conditional Random Fields
81
Chinese Unknown Words Extraction Based on Word-Level Characteristics
82
Chinese Verb Sense Disambiguation Using AdaBoosting
83
Chinese Verb Subcategorization Acquisition from Noisy Data on Sentence Level
84
Chinese Verb´s Subcategorization Frame Acquisition from Unreliably Parsed Corpus
85
Chinese video characters recognition based on cluster and multi neural network
86
Chinese Visible Human Brain Image Segmentation
87
Chinese Visible Human Project: Dataset Acquisition and Its Primary Applications
88
Chinese Wall security model and conflict analysis
89
Chinese wall security policies information flows in business cloud
90
Chinese wall security policy-an aggressive model
91
Chinese wall security policy-revisited a short proof
92
Chinese Web Comments Clustering Analysis with a Two-phase Method
93
Chinese Web Information Retrieval Based on Shallow Parsing
94
Chinese Web Infrastructure Building: Challenges and Our Roadmap
95
Chinese Web page classification based on self-organizing mapping neural networks
96
Chinese web page classification based on statistical word segmentation
97
Chinese Web page classification using noise-tolerant support vector machines
98
Chinese Web Text Classification System Model Based on Naive Bayes
99
Chinese Web Text Outlier Mining Based on Domain Knowledge
100
Chinese Web-page Classification Study
101
Chinese whispers. Semiotically mediating between idea and program
102
Chinese Wine Classification through Micrograph Using Combined Feature and Fuzzy Cluster
103
Chinese Wine Classification Using BPNN through Combination of Micrographs´ Shape and Structure Features
104
Chinese word classification based on statistics
105
Chinese word recognition and understanding with information feedback
106
Chinese Word Segmentation and Out-of-Vocabulary Words Detection Using Suffix Array
107
Chinese Word Segmentation as POC-NLW Tagging
108
Chinese word segmentation based on A-priori and adjacent characters
109
Chinese word segmentation based on the improved Particle Swarm Optimization neural networks
110
Chinese Word Segmentation with Minimal Linguistic Knowledge: An Improved Conditional Random Fields Coupled with Character Clustering and Automatically Discovered Template Matching
111
Chinese word sense disambiguation by combining pseudo training data
112
Chinese word similarity computing
113
Chinese Writer Identification Based on the Distribution of Character Skeleton
114
Chinese Yuan exchange exposures and hedge ratios for international portfolios
115
Chinese/Kanji Text and Data Processing
116
Chinese-character printer with electrostatic recording
117
Chinese-English bilingual phone modeling for cross-language speech recognition
118
Chinese-English bilingual speech recognition
119
Chinese-English Chunk Alignment Based on Anchor Chunk
120
Chinese-English Cross-Lingual Information Retrieval based on Domain Ontology Knowledge
121
Chinese-English mixed-lingual keyword spotting
122
Chinese-English Phone Set Construction for Code-Switching ASR Using Acoustic and DNN-Extracted Articulatory Features
123
Chinese-English quasi-equivalent noun phrase definition and automatic identification
124
Chinese-English SMT for cross-language dialogue agent support
125
Chinese-English transliteration using weighted finite-state transducers
126
Chinese-Uighur Sentence Alignment Based on Hybrid Strategy with Mistake Spread Suppression
127
Chinese-uyghur statistical machine translation: The initial explorations
128
CHIP — Cultural heritage image processing tool
129
Chip — Module — Package interfaces
130
Chip Alignment Templates for Multichip Module Assembly
131
Chip analysts predict bust as boom arrives
132
Chip and antenna impedance measurement for the design of passive UHF RFID tag
133
Chip and board-scale integrated Photonic Networks for next-generation computers
134
Chip and dechirp technique in spotlight mode SAR imaging
135
Chip and package co-design for high performance mixed IC
136
Chip and package co-design technique for clock networks
137
Chip and PIN is Broken
138
Chip and Skim: Cloning EMV Cards with the Pre-play Attack
139
Chip and system characteristics of a 2048-bit MNOS-BORAM LSI circuit
140
Chip antenna for 5.2 GHz wireless LAN
141
Chip Antenna Using Three Branch Structures and Interdigitated Gap Feeding
142
Chip architectures for parallel processing
143
Chip area estimation method for VLSI chip floor plan
144
Chip Assemblers: Concepts and Capabilities
145
Chip assembly in the PLAYOUT VLSI design system
146
Chip attach for silicon hybrid multi-chip modules
147
Chip bumping for rework on FCOB assembly line
148
Chip business looks for cheaper entry
149
Chip Business Under Pressure
150
Chip cards-the application revolution
151
Chip Carrier Applications
152
Chip Carrier Packaging Applications
153
Chip Carriers as a Means for High-Density Packaging
154
Chip Carriers Mounted on Large Thick Film Multilayer Boards
155
Chip Carriers-Their Application and Future Direction
156
Chip Challenge
157
Chip champs [IEEE??s International Solid- State Circuits Conference]
158
Chip clustering with mutual information on multiple clock tests and its application to yield tuning
159
Chip code manipulation for interference rejection in DS/SS systems
160
Chip combining to migrate narrowband jamming of FH/DPSK systems
161
Chip complexity requires signal and power integrity
162
Chip cooling with carbon nanotube heat sink
163
Chip cracks during assembly: Finding and eliminating the critical defect
164
Chip Crystal Resonator with Load Capacitors
165
Chip Design and Analysis based on a LRC Speech Algorithm
166
Chip design for high-performance DSP
167
Chip design for intelligent data classification algorithms and implementation on an FPGA: A case study to classify EMG signals
168
Chip design for monobit receiver
169
Chip Design Hardwires Security
170
Chip Design in an Advanced CMOS Technology
171
Chip design of 10 GHz low phase noise and small chip area PLL
172
Chip Design of 5.1~6 GHz Colpitts QVCO for WIMAX
173
Chip design of 5.2 GHz frequency synthesizer with a gate-to-source feedback Colpitts VCO
174
Chip design of a 10-MHz switched capacitor low-pass filter for wireless application
175
Chip design of a 12-bit 5MS/s fully differential SAR ADC with resistor-capacitor array DAC technique for wireless application
176
Chip design of a 24 GHz band low-power phase-locked loop using an injection frequency divider circuit and integrated system for biomedical application
177
Chip design of a 5.6-GHz 1-V wide tuning range frequency synthesizer with Gm-boosting Colpitts VCO for biomedical application
178
Chip design of a bandpass sigma-delta modulator
179
Chip design of a field programmable VLSI processor using memory-based cells
180
Chip design of a high performance LC-VCO and mixer charge-injection signal processing for WiMAX communication and internet application
181
Chip Design of a Wave-Pipelined PRNG
182
Chip design of an 8 MHz CMOS switched-capacitor low-pass filter for signal receiver applications
183
Chip Design of an UWB, High Gain and Low Noise Amplifier for Wireless Applications
184
Chip design of fuzzy neural networks for face recognition in mobile-robots
185
Chip design of low-power phase-locked loop for FMCW MMW radar and sensor application
186
Chip Design of LPC-cepstrum for Speech Recognition
187
Chip design of mel frequency cepstral coefficients for speech recognition
188
Chip design of memory-architecture-based minimum-classification-error
189
Chip design of phase-locked loop for ISM band applications
190
Chip design of portable speech memopad suitable for persons with visual disabilities
191
Chip Design of Three-Phase BLDC Motor Brake Driver IC
192
Chip design of WuRx front-end and IF Gm-C bandpass filter with antenna to near infrared charging for biomedical application
193
Chip design thwarts sneak attack on data
194
Chip Designed Health Transducer and Wireless Sensor for Intelligent Networking Application
195
Chip designers
196
Chip designs: myths, ideas and opportunities
197
Chip detectives [reverse engineering]
198
Chip Diode Phase Shifters for 5.1 and 15.5 GHz
199
Chip discrimination for large near far power ratios in UWB networks
200
Chip Discrimination for UWB Impulse Radio Networks in Multipath Channels
201
Chip Embedded Wafer Level Packaging Technology for Stacked RF-SiP Application
202
Chip embedding technology developments leading to the emergence of miniaturized system-in-packages
203
Chip embedding technology developments leading to the emergence of miniaturized system-in-packages
204
Chip embedding technology for power applications
205
Chip EOS issue analysis in board-level application
206
Chip equalisation for third generation MIMO high data rate applications
207
Chip Equalization Using Subband Adaptive Decomposition in Downlink MIMO DS-UWB
208
Chip Error Pattern Analysis in IEEE 802.15.4
209
Chip Error Pattern Analysis in IEEE 802.15.4
210
Chip fabrication services for universities in North America and Europe
211
Chip for linearisation of RF power amplifiers using digital predistortion
212
Chip for linearisation of RF power amplifiers using power feedback
213
Chip for wideband digital predistortion RF power amplifier linearisation
214
Chip form classification and main cutting force prediction of cast nylon in turning operation using artificial neural network
215
Chip Formation when Turning Inconel 718 in High Cutting Speed
216
Chip formation with a developed plastic-deformation zone
217
Chip forming stability increase through adaptation of rake face topography to wheel turning conditions
218
Chip geometry based tool force variation model for dynamic error correction in diamond turning
219
Chip Hardware-in-the-Loop simulation coupling optimization through new algorithm analysis technique
220
Chip Health Monitoring Using Machine Learning
221
Chip Identification using the Characteristic Dispersion of Transistor
222
Chip ignition in research on high-speed face milling AM50A magnesium alloy
223
Chip impedance characterization for contactless proximity personal cards
224
Chip impedance matching For UHF-band RFID TAG
225
Chip Implementation of a 1.5-GHz Gain-Control Phase Shifter
226
Chip implementation of a coarse-grained reconfigurable architecture supporting floating-point operations
227
Chip implementation of AJC jitter reduction technology
228
Chip implementation of high-efficient light-emitting diode dimming driver for high-power light-emitting diode lighting system
229
Chip implementation on high-speed packet buffers in network system
230
Chip implementation with combined temperature sensor and reference devices based on DZTC principle
231
Chip Improvements for Future IGBT Modules
232
Chip in disc for optical storage
233
CHIP in plain logic
234
Chip In Wafer for Integrated System
235
Chip industry correction "will be short-lived"
236
Chip industry needs EDA collaboration [News]
237
Chip integrated DFB-EAM for directly phase modulation performance improvement in UDWDM-PON
238
Chip integration of Sea of Leads compliant I/O interconnections for the ultimate enabling of chips with low-k interlayer dielectrics
239
Chip interleaved cdma2000 with space time block code
240
Chip interleaved turbo codes for DS-CDMA in a Rayleigh fading channel with diversity reception
241
Chip interleaved turbo codes for DS-CDMA mobile radio in fading channel
242
Chip interleaving for performance improvement of coded DS-CDMA systems in Rayleigh fading channels
243
Chip interleaving in direct sequence CDMA systems
244
Chip layer assignment method for analytical placement of 3D ICs
245
Chip layout design of a Josephson LSI circuit for examining high-speed operability by using a standard cell automatic placement and routing technique
246
Chip Layout Optimization Using Critical Path Weighting
247
Chip level decision feedback equaliser for CDMA downlink with space-time coding
248
Chip Level EMI Approach for LCD TV Panels
249
Chip Level Equalization for DS-CDMA Systems using Iterative Pilot Signals Enhancement
250
Chip level fault location using X-algorithm
251
Chip Level Impatt Combining At 40 Ghz
252
Chip Level IMPATT Combining at 40 GHz
253
Chip level layout and bias considerations for preventing neighboring I/O cell interaction-induced latch-up and inter-power supply latch-up in advanced CMOS technologies
254
Chip Level Modeling of LSI Devices
255
Chip level packaging for MEMS using silicon cap
256
Chip level power supply partitioning for I
DDQ
testing using built-in current sensors
257
Chip Level Reliability of MANOS Cells under Operating Conditions
258
Chip level reliability on SOI embedded memory
259
Chip level security: Why ? How ?
260
Chip level signal integrity analysis and crosstalk prediction using artificial neural nets
261
Chip level simulation of the downlink in UTRA-FDD
262
Chip Level Techniques for EMI Reduction in LCD Panels
263
Chip level thermal profile estimation using on-chip temperature sensors
264
Chip makers hit heat barrier
265
Chip makers turn to multicore processors
266
Chip making to dye for
267
Chip making´s singular future
268
Chip making´s wet new world
269
Chip manufacturing: matching production plan with customer requirements
270
Chip market bounces back - Analysis [Briefing in Depth]
271
Chip master planning: An efficient methodology to improve design closure and complexity management of ultra large chips
272
Chip multilayer antenna for 2.45 GHz-band application using LTCC technology
273
Chip multiprocessor architecture: A programmability-driven approach
274
Chip Multiprocessor Design Space Exploration through Statistical Simulation
275
Chip Multi-Processor Generator
276
Chip multithreading: opportunities and challenges
277
Chip network goes mobile
278
Chip off the old block
279
Chip Off the Old Block
280
Chip on board (COB) multichip modules design possibilities and manufacturing
281
Chip on board (COB) versus board on chip (BOC) memory packages
282
Chip on Board 3–10-GHz Impulse Radio Ultra Wideband Transmitter With Optimized Die to Antenna Wire Bond Transition
283
Chip on Board development for a novel MEMS accelerometer for seismic imaging
284
Chip On Board packaging of light emitting diodes and thermal characterizations
285
Chip on Board Technology for Low Cost Multi-Chip-Modules
286
Chip on chip (COC) and chip on board (COB) assembly on flex rigid printed circuit assemblies
287
Chip on chip (COC) and chip on board (COB) assembly on flex rigid printed circuit assemblies
288
Chip on glass technology for large capacity and high resolution LCD
289
Chip on suspension MR head
290
Chip on tape qualification and reliability
291
Chip Optimization Through STI-Stress-Aware Placement Perturbations and Fill Insertion
292
Chip organization of Bloch line memory
293
Chip Organization Of Bloch Line Memory With Thermomagnetically Written Domain Patterns
294
Chip organization of Bloch line memory with thermomagnetically written domain patterns
295
Chip oriented target impedance for digital power distribution network design
296
Chip package co-design of a heterogeneously integrated 2.45 GHz CMOS VCO using embedded passives in a silicon package
297
Chip package co-design of receiver front-end for 4G mobile phones
298
Chip package co-design of the RF front end with an integrated antenna on multilayered organic material
299
Chip package interaction (CPI) reliability of Cu/low-k/ultra-low-k interconnect
300
Chip package interaction (CPI) reliability of low-k/ULK interconnect with lead free technology
301
Chip package interaction (CPI): Thermo mechanical challenges in 3D technologies
302
Chip package interaction analysis for 20-nm technology with thermo-compression bonding with non-conductive paste
303
Chip Package Interaction analysis for Cu/Ultra low-k large die Flip Chip Ball Grid Array
304
Chip Package Interaction and mechanical reliability impact on Cu/ultra low-k interconnects in Flip Chip package
305
Chip package interaction evaluation for a high performance 65nm and 45nm CMOS Technology in a stacked die package with C4 and wirebond interconnections
306
Chip Package Interaction for 65nm CMOS Technology with C4 Interconnections
307
Chip package interaction in micro bump and TSV structure
308
Chip Package Interaction in Ultra Low-k/Copper Interconnect Technology
309
Chip package interaction induced ILD integrity issues in fine pitch flip chip packages
310
Chip Package Interaction with fine pitch Cu pillar bump using mass reflow and thermal compression bonding assembly process for 20nm/16nm and beyond
311
Chip Package Interaction(CPI) risk assessment on 28nm Back End of Line(BEOL) stack of a large I/O chip using compact 3D FEA modeling
312
Chip package interaction: A stress analysis on 3D IC´s packages
313
Chip Package Interaction: An Experiment Study on White Bump Mitigation Using Flat Laminates
314
Chip Package Interactions: Package effects on copper pillar bump induced BEoL delaminations & associated numerical developments
315
Chip package-system co-design
316
Chip packing efficiency in bubble modules
317
Chip pad migration is a key component to high performance MCM design
318
Chip Parasitic Extraction And Signal Integrity Verification
319
Chip Partitioning Aid: A Design Technique for Partitionability and Testability in VLSI
320
Chip PIFA antenna em compatible with metallic I/O connectors for mobile phones
321
Chip pirates: Beware the law: A new Federal statute is written to protect semiconductor chip designs; the law, however, contains ambiguities that have yet to be tested
322
Chip power current source modeling method applicable to arbitrary data patterns
323
Chip power density and module cooling technology projections for the current decade
324
Chip Power Interconnection
325
Chip Power Model - A New Methodology for System Power Integrity Analysis and Design
326
Chip Pulse Shaping in Asynchronous Chaos-Based DS-CDMA
327
Chip rate and symbol rate MMSE functionalities for CDMA receivers
328
Chip rate estimation of DS/FH hybrid spread spectrum signal
329
Chip rate estimation of weak DSSS signals based on improved delay-multiply in non-cooperative communication systems
330
Chip rate hopping provides low probability of detection for direct sequence signals
331
Chip refiner motor load adaptive control using a nonlinear Laguerre model
332
Chip Researchers on Brink of Next-Gen Breakthroughs
333
Chip sales forecast pushed up
334
Chip sales to soar despite lull
335
Chip scale atomic magnetometer based on SERF
336
Chip Scale Atomic Magnetometers
337
Chip Scale Camera Module (CSCM) using Through-Silicon-Via (TSV)
338
Chip scale integration of optical microresonator sensors with digital microfludics systems
339
Chip Scale Module Package for WLAN Module Application
340
Chip Scale Optical Microresonator Sensors Integrated With Embedded Thin Film Photodetectors on Electrowetting Digital Microfluidics Platforms
341
Chip scale package (CSP) "a lightly dressed LSI chip"
342
Chip scale package (CSP) solder joint reliability and modeling
343
Chip scale package (CSP) solder joint reliability and modeling
344
Chip Scale Package Design for Thermal Performance in Mobile Handsets
345
Chip scale package for SAW filter on the oxidized porous silicon using flip-chip bonding and Cu plated metal wall
346
Chip scale package implementation challenges
347
Chip scale package of a MEMS microphone and ASIC stack
348
Chip Scale Package Using Standard Lead Frame Technology
349
Chip scale package versus direct chip attach (CSP vs. DCA)
350
Chip scale package with low cost substrate evaluation and characterization
351
Chip scale package: “a lightly dressed LSI chip”
352
Chip scale packaging and redistribution
353
Chip scale packaging for memory devices
354
Chip scale packaging for modern electronics - Book Review
355
Chip scale packaging of a MEMS accelerometer
356
Chip scale packaging of piezoresistive pressure sensors using dry-film shielding
357
Chip scale packaging of piezoresistive pressure sensors using the dry-film shielding
358
Chip scale packaging reliability
359
Chip Scale Packaging Solution with the Flip-Chip Technologies for CMOS Image Sensor
360
Chip scale packaging techniques for RF SAW devices
361
Chip scale packaging using chip-on-flex technology
362
Chip scale packaging with surface mountable solder ball terminals for microsensors
363
Chip scale photonic interconnects for energy-performance optimized computing
364
Chip scale polymer stud grid array packaging and reliability based on low cost flip chip processing
365
Chip scale studies of BCB based polymer bonding for MEMS packaging
366
Chip scale topography evolution model for CMP process optimization
367
Chip sector booming - but for how long?
368
Chip Self-Organization and Fault Tolerance in Massively Defective Multicore Arrays
369
Chip set design for 10GB/s optical transceiver
370
Chip set for high performance lossless image compression and entropy coding
371
Chip shots
372
Chip signal analysis by using adaptive short-time fractional Fourier transform
373
Chip size BGA packaging for high performance memory
374
Chip size estimation based on wiring area
375
Chip Size Estimation for SOC Design Space Exploration
376
Chip Size Optically Controlled 12kV Switch on Silicon
377
Chip size packages with wafer-level ball attach and their reliability
378
Chip space-time block coding using iterative channel estimation with inter-antenna interference cancellation for W-CDMA systems using long scrambling codes
379
Chip Substrate Resistance Modeling Technique for Integrated Circuit Design
380
Chip synchronization of M-PSK signals on nonselective fading channels for bandlimited DS/SS CDMA systems
381
Chip synchronization performance affected by non-ideal interpolation of bandlimited direct-sequence spread-spectrum signals
382
Chip TDM-A new orthogonal downlink transmission technique for CDMA cellular mobile radio
383
Chip Technologies as the Engine for IT Revolution
384
Chip technologies for Entertainment Robots - present and future
385
Chip Temperature Selfregulation for Digital Circuits Using Polymorphic Electronics Principles
386
Chip test - Physical connection
387
Chip test optimization using defect clustering information
388
Chip Thickness Analysis Based on Tooth Trajectory for Different End Milling Processes
389
Chip timing recovery in digital modems for continuous-phase CDMA radio communications
390
Chip timing synchronization in an all-digital band-limited DS/SS modem
391
Chip to carrier C4 technology challenges with Pb free solders
392
Chip to chip bonding using micro-cu bumps with sn capping layers
393
Chip to chip communications for terabit transmission rates
394
Chip to chip hermetic bonding and multi-chip stacking using CuSn bonding technology
395
Chip to chip interconnection for system in packaging using Cu stud bump
396
Chip to wafer bonding for three-dimensional integration of copper low K Chip by stacking process
397
Chip to wafer copper direct bonding electrical characterization and thermal cycling
398
Chip to wafer direct bonding technologies for high density 3D integration
399
Chip to wafer temporary bonding with self-alignment by patterned FDTS layer for size-free MEMS integration
400
Chip type spiral broadside coupled directional couplers and baluns using low temperature co-fired ceramic
401
Chip ultra-thinning and embedding technology for autonomous sensors array applications
402
Chip voltage: Why less is better: A reduced power-supply standard is in the offing as manufacturers and designers grapple with the tradeoffs of submicrometer devices
403
Chip Warpage Induced by Tapered Through-Silicon Vias: A Numerical Analysis
404
Chip waveform design for DS/SSMA systems with aperiodic random spreading sequences
405
Chip waveform design for DS/SSMA systems with aperiodic random spreading sequences
406
Chip waveform selection in asynchronous DS-CDMA systems with interference suppression
407
Chip waveform shaping for band-limited MC-DS-CDMA
408
Chip–Package Interaction and Reliability Improvement by Structure Optimization for Ultralow-
Interconnects in Flip-Chip Packages
409
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs
410
Chip/Package Design and Technology Trade-offs in the 65nm Cell Broadband Engine
411
Chip/package interactions on advanced flip-chip packages: Mechanical investigations on copper pillar bumping
412
Chip/Package Mechanical Stress Impact on 3-D IC Reliability and Mobility Variations
413
CHiP: A Profiler to Measure the Effect of Cache Contention on Scalability
414
CHIPAIDE: a new approach to analogue integrated circuit design
415
Chip-architecture planning based on expert knowledge
416
Chip-Asynchronous Binary Optical CDMA: An Optimum Signaling Scheme for Random Delays
417
Chip-based clinical assays: towards analysis of physiological samples
418
Chip-Based Design for Real-Time Moving Object Detection Using a Digital Camera Module
419
Chip-based electrical detection of DNA
420
Chip-based frequency comb with microwave repetition rate
421
Chip-based frequency conversion by four-wave-mixing Bragg scattering in Si
3
N
4
microrings
422
Chip-based hetero-integration technology for high-performance 3D stacked image sensor
423
Chip-Based High-Sensitivity Detection of Multiple Disease Biomarkers
424
Chip-Based Integrated Filterless Multi-Wavelength Optoelectronic Bio-Chemical Sensors
425
Chip-based joint processing antenna diversity and equalizer for ds-cdma packet mobile communication systems
426
Chip-based optical interactions with Rubidium vapor
427
Chip-Based Scanning Nano-Calorimeter for Protein Stability Analysis in Biosensor Membranes
428
Chip-based silica microspheres for cavity optomechanics
429
Chip-Bonding on Copper by Pressureless Sintering of Nanosilver Paste Under Controlled Atmosphere
430
Chip-capacitor loaded dual-band microstrip antenna
431
ChipCE™: A silicon microsystem for migration, separation and detection of DNA
432
Chipcflow- A dynamic dataflowmachine using dynamic reconfigurable hardware
433
Chip-delay locked matched filter for DS-CDMA systems using long sequence spreading
434
Chip-dependent leakage Power-Aware Placement algorithm for FPGAs
435
CHIPDESIGN-a novel project-oriented microelectronics course
436
Chip-equalised UMTS downlink for fast fading channels
437
ChipEst-FPGA: a tool for chip level area and timing estimation of lookup table based FPGAs for high level applications
438
Chip-free singulation for medical application
439
CHIPIC: A highly efficient code for electromagnetic PIC modeling and simulation
440
CHIPIC: An Efficient Code for Electromagnetic PIC Modeling and Simulation
441
Chip-independent Error Correction in main memories
442
Chip-in-flex technology for flexible electronics applications
443
Chip-in-polymer: volumetric packaging solution using PCB technology
444
Chip-in-substrate package, CiSP, technology
445
Chip-interleaved block-spread CDMA for the downlink with inter-cell interference and soft hand-off
446
Chip-Interleaved Block-Spread CDMA or DS-CDMA for cellular downlink?
447
Chip-interleaved block-spread CDMA versus DS-CDMA for cellular downlink: a comparative study
448
Chip-interleaved block-spread code division multiple access
449
Chip-interleaved decorrelation in asynchronous DS CDMA
450
Chip-interleaved Multi-rate CDMA with 2-dimensional OVSF Spreading
451
Chip-interleaved self-encoded multiple access with iterative detection in fading channels
452
Chip-interleaved WCDMA with parallel-interference-cancellation receiver in multipath Rayleigh fading channels
453
Chip-in-the-loop learning algorithm for Boltzmann machine
454
CHIPIX65: Developments on a new generation pixel readout ASIC in CMOS 65 nm for HEP experiments
455
Chipkit?an electronics kit from the Polytechnic of Wales
456
Chip-last Embedded Active for System-On-Package (SOP)
457
Chip-last embedded actives and passives in thin organic package for 1–110 GHz multi-band applications
458
Chip-last fan-out package with embedded power ICs in ultra-thin laminates
459
Chipless frequency signature based RFID transponders
460
Chipless Frequency Signature Based RFID Transponders
461
Chipless identification applied to human body
462
Chipless millimeter wave identification (MMID) tag at 30 GHz
463
Chipless Radio Frequency Identification (RFID) Device
464
Chipless radio frequency identification by remote measurement of complex impedance
465
Chipless Radio Frequency Identification by Remote Measurement of Complex Impedance
466
Chipless RF liquid sensor
467
Chipless RFID based high resolution crack sensing through SWB technology
468
Chipless RFID based on group delay encoding
469
Chipless RFID for intelligent traffic information system
470
Chipless RFID for space applications
471
Chipless RFID multiresonators fabricated by Fill until Full (FuF) technique
472
Chipless RFID Reader: Low-cost wideband printed dipole array antenna.
473
Chipless RFID SAW sensor system-level simulator
474
Chipless RFID strain sensors: A novel feasibility analysis in terms of conventional patch antennas
475
Chipless RFID System Based on Group Delay Engineered Dispersive Delay Structures
476
Chipless RFID system based on magnetoinductive-wave (MIW) delay lines
477
Chipless RFID Systems for Car-to-Infrastructure Communication
478
Chipless RFID tag based on meandered line resonator
479
Chipless RFID tag based on space angle information
480
Chipless RFID tag based on split-wheel resonators
481
Chipless RFID tag design and detection with adaptive direct path cancellation
482
Chipless RFID tag for light sensing
483
Chipless RFID Tag Localization
484
Chipless RFID Tag Using Hybrid Coding Technique
485
Chipless RFID Tag Using Multiple Microstrip Open Stub Resonators
486
Chipless RFID tag using RF MEMS switch
487
Chipless RFID tag with an improved RCS response
488
Chipless RFID tag with integrated resistive and capacitive sensors
489
Chipless RFID tag with integrated sensor
490
Chipless RFID tags based on magneto-inductive or electro-inductive delay lines
491
Chipless RFID tags based on multiple band-rejected planar log-periodic antennas
492
Chipless RFID tags for passive wireless sensor grids
493
Chipless RFID trasponders by using multi-resonant High-Impedance Surfaces
494
Chipless RFID using stacked multilayer patches
495
Chipless RFID with artificial impedance surfaces
496
Chipless RFID: Bar Code of the Future
497
Chipless RFIDs by using metasurfaces
498
Chipless RFIDs for Metallic Objects by Using Cross Polarization Encoding
499
Chipless substrate integrated waveguide tag for millimeter wave identification
500
Chipless tags for RF and THz identification
501
Chipless UWB RFID Tag Detection Using Continuous Wavelet Transform
502
Chipless wireless sensor node
503
Chip-Level 1
2 Optical Interconnects Using Polymer Vertical Splitter on Silicon Substrate
504
Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate
505
Chip-level 2-D RAKE receiver with symbol-level searcher beamforming
506
Chip-Level Adaptive Equalization for LAS CDMA Downlink
507
Chip-level adaptive equalization supervised by a time-multiplexed common pilot sequence in CDMA systems
508
Chip-level and board-level CDM ESD tests on IC products
509
Chip-level and Input/Output Interconnects for Gigascale SOCs: Limits and Opportunities
510
Chip-level and package-level seamless interconnect technologies for advanced packaging
511
Chip-level and package-level thermal constraints in power semiconductor switch modules
512
Chip-level anti-reverse engineering using transformable interconnects
513
Chip-level beamforming vs. symbol-level beamforming in coherent CDMA adaptive antenna array systems
514
Chip-level calibration method using improved NFP and CPPs and MPs for the NFS standardization
515
Chip-level Channel Equalization with Automatic Depth Determination for Downlink WCDMA Systems
516
Chip-level Channel Equalization with Rake-like Structures for Multicode Downlink WCDMA Communications
517
Chip-level charged-device modeling and simulation in CMOS integrated circuits
518
Chip-Level Coordinated Interference-Aware Beamforming for MIMO-CDMA in Frequency-Selective Broadcast Channels
519
Chip-level design and optimization for digital microfluidic biochips
520
Chip-Level Design Constraints to Comply With Conducted Electromagnetic Emission Specifications
521
Chip-level detection in optical code division multiple access
522
Chip-level detector with optimum comparator threshold and correlation receiver with an electrical hard-limiter for optical cdma
523
Chip-level diagnostic strategy for full-scan designs with multiple faults
524
Chip-level differential encoding/detection of spread-spectrum signals for CDMA radio transmission over fading channels
525
Chip-level differential space-time block coded direct-sequence spread-spectrum communication
526
Chip-Level DS-CDMA Downlink Interference Suppression With Optimized Finger Placement
527
Chip-level electromigration measurement technique for multi-segmented interconnect test structures
528
Chip-level electro-thermal simulation of bipolar transistor circuits
529
Chip-level ESD simulation for fail detection and design guidance
530
Chip-level Kalman filter equalization for the UMTS-FDD WCDMA downlink with multiple base stations
531
Chip-Level LMMSE Based HARQ Chase Combining for HSUPA
532
Chip-level LMMSE equalization for downlink MIMO CDMA in fast fading environments
533
Chip-level microarchitecture trends
534
Chip-level MMSE equalization at the edge of the cell
535
Chip-level MMSE equalization in the forward link of UMTS-FDD: a low complexity approach
536
Chip-level modeling and analysis of electrical masking of soft errors
537
Chip-level modeling with HDLs
538
Chip-Level Modulated BPPM Fiber-Optic Code Division Multiple Access
539
Chip-Level Multiple Quantum Well Modulator-Based Optical Interconnects
540
Chip-Level Optical Interconnects Using Polymer Waveguide Integrated With Laser/PD on Silicon
541
Chip-level performance improvement using triple damascene wiring design concept for 0.13 /spl mu/m CMOS devices
542
Chip-level performance maximization using ASIS (application-specific interconnect structure) wiring design concept for 45 nm CMOS devices
543
Chip-level power-performance optimization through thermally-driven across-chip variation (ACV) reduction
544
Chip-level programming of heterogeneous multiprocessors
545
Chip-level receivers in optical overlapping PPM-CDMA
546
Chip-Level Redundancy in Distributed Shared-Memory Multiprocessors
547
Chip-level reliability study of barrier engineered (BE) floating gate (FG) Flash memory devices
548
Chip-level simulation for CDM failures in multi-power ICs
549
Chip-Level Simultaneous Switching Current Measurement in Power Distribution Network Using Magnetically Coupled Embedded Current Probing Structure
550
Chip-level soft error estimation method
551
Chip-level spray cooling of an LD-MOSFET RF power Amplifier
552
Chip-Level Substrate Noise Analysis with Emphasis of Vertical Impurity Profile for Isolation
553
Chip-level substrate noise analysis with network reduction by fundamental matrix computation
554
Chip-level Synchronization for Ad Hoc Enabled UTRA-TDD Networks
555
Chip-level thermal simulator to predict VLSI chip temperature
556
Chip-Level Thermoelectric Power Generators Based on High-Density Silicon Nanowire Array Prepared With Top-Down CMOS Technology
557
Chip-level three-dimensional stacking for free-space optical interconnects
558
Chip-level TSV integration for rapid prototyping of 3D system LSIs
559
Chip-level vacuum packaging of micromachines using NanoGetters
560
Chip-level verification for parasitic coupling effects in deep-submicron digital designs
561
Chip-level waveguide-mirror-pillar optical interconnect structure
562
Chip-locked space-time filtering for maximizing SINR in asynchronous DS-CDMA systems
563
Chipmakers ARM for Battle in Traditional Computing Market
564
Chipmakers bet on a stacked deck
565
Chipmakers delay the inevitable
566
Chipmakers given a glimmer of hope [analysis]
567
Chipmakers to open up on yield secrets [News]
568
Chipmakers under financial pressure
569
Chip-making in China
570
Chip-microcomputer based safety tester for medical equipment
571
Chip-Module Package Interfaces
572
Chip-multiprocessing and beyond
573
Chip-on-board (COB) wafer level packaging of LEDs using silicon substrates and chemical foaming process(CFP)-made glass-bubble caps
574
Chip-on-board packaging of high-speed optical transceiver applying silicon photonics integrated chips
575
Chip-on-CAPS (cable-patterned suspension)
576
Chip-on-carrier microwave mount for semiconductor optical amplifier measurements
577
Chip-on-chip 3D optical interconnect with passive alignment
578
Chip-on-chip technology with copper through-plug for 0.15 μm SRAM
579
Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering
580
Chip-on-mud: Ultra-low power ARM-based oceanic sensing system powered by small-scale benthic microbial fuel cells
581
ChipOS: Open power-management platform to overcome the power crisis in future LSIs
582
CHIPPAC-interconnect technology development in Europe. A European collaborative project within ESPRIT
583
Chip-Package and Antenna Co-Design of a Tunable UWB Transmitter in System-on-Package with On-Chip versus Off-Chip Passives
584
Chip-package codesign flow for mixed-signal SiP designs
585
Chip-package co-design for high performance and reliability off-chip communications
586
Chip-package codesign for high-frequency circuits and systems
587
Chip-package co-design for high-speed transmitter in serial links application
588
Chip-package co-design for mixed SoC
589
Chip-package co-design for suppressing parallel resonance and power supply noise
590
Chip-package co-design methodology for global co-simulation of re-distribution layers (RDL)
591
Chip-Package co-design of 10 GHz bandwidth low noise active front-end interface
592
Chip-package co-design of a 4.7 GHz VCO
593
Chip-package co-design of a 5 GHz RF front-end for WLAN
594
Chip-package co-design of a concurrent LNA in system-on-package for multi-band radio applications
595
Chip-package codesign of a low-power 5-GHz RF front end
596
Chip-package co-design of common emitter LNA in system-on-package with on-chip versus off-chip passive component analysis
597
Chip-package codesign of integrated voltage-controlled oscillator in LCP substrate
598
Chip-package co-design of power distribution network for system-in-package applications
599
Chip-package codesign of receiver front end modules for RF/wireless applications
600
Chip-package co-design of RF mixed signal microsystems
601
Chip-package codesign with redistribution layer
602
Chip-package codesign-challenges and directions
603
Chip-package Co-implementation of a triple DES Processor
604
Chip-Package Co-modeling & Verification of Noise Coupling & Generation in CMOS DC/DC Buck Converter
605
Chip-package co-simulation with multiscale structures
606
Chip-package electrical interaction in organic packages with embedded actives
607
Chip-Package Hierarchical Power Distribution Network Modeling and Analysis Based on a Segmentation Method
608
Chip-package hybrid clock distribution network and DLL for low jitter clock delivery
609
Chip-package interaction: Challenges and solutions to mechanical stability of Back end of Line at 28nm node and beyond for advanced flip chip application
610
Chip-package interactions: Some combined package effects on copper/low-k interconnect delaminations
611
Chip-package interactions: Some investigations on copper/Low-k interconnect delaminations
612
Chip-package power delivery network resonance analysis and co-design using time and frequency domain analysis techniques
613
Chip-package thermal co-simulation technique for thermally aware chip design
614
Chip-package-board co-design - a DDR3 system design example from circuit designers’ perspective
615
Chip-package-board co-design for complex System-on-Chip (SoC)
616
Chip-package-board co-design for complex system-on-chip (SoC)
617
Chip-package-board co-design of a 45nm 8-core enterprise Xeon processor
618
Chip-Package-Board Codesign of Highly Linear 3G-CDMA Upconverter Modules
619
Chip-Package-Interaction Modeling of Ultra Low-k/Copper Back End of Line
620
Chip-package-PCB co-design for optimization of wireless receiver performance
621
Chip-package-PCB co-design: Dealing with harmonic desensitization in RF SoC/SiP
622
Chip-package-PCB co-simulation for power integrity design at the early design stage
623
Chip-package-PCB thermal co-design for hot spot analysis in SoC
624
Chip-packaging interaction in Cu/very low-k interconnect
625
Chippe: a system for constraint driven behavioral synthesis
626
CHIPPER: A low-complexity bufferless deflection router
627
Chipping away at long-distance data
628
Chipping free process for combination of narrow saw street (60um) and thick wafer (600um) sawing process
629
Chip-planning, placement, and global routing of macro/custom cell integrated circuits using simulated annealing
630
ChipPower: an architecture-level leakage simulator
631
Chip-powered ERNIE 4 makes its debut
632
Chip-rate adaptive two-stage receiver for scrambled multirate CDMA downlink
633
Chip-rate hopping counters chip-rate detection of direct sequence spread spectrum signals
634
Chip-rate processing for software defined radios
635
Chip-removing metal working an international survey
636
Chips control street lighting
637
Chips down for Euro semiconductor makers
638
Chips feel the crunch
639
Chips for discovering the Higgs boson and other particles at CERN: Present and future
640
Chips for everyone
641
Chips for Everyone: A Multifaceted Approach in Electrical Engineering Outreach
642
Chips for graphics - making the pixels fly
643
Chips go vertical [3D IC interconnection]
644
Chips head for the big freeze
645
Chips in 3D
646
Chips in space
647
Chips off of the old block [Packet-Switched Brain Models, and Cognitive Computiing]
648
Chips off the old block - my way
649
Chips that do things [The Last Byte]
650
Chips will be down for Trilogy in 1985
651
CHIPS: Custom Hardware Instruction Processor Synthesis
652
Chip-scale aerosol impactor with integrated resonant mass balances for real time monitoring of airborne particulate concentrations
653
Chip-scale analog optical signal processing
654
Chip-Scale Atomic Clock - [Book Review]
655
Chip-scale atomic devices based on microfabricated alkali vapor cells
656
Chip-Scale Atomic Devices Based on Microfabricated Alkali Vapor Cells
657
Chip-scale atomic devices: From atomic clocks to brain imaging and beyond
658
Chip-scale atomic magnetometer
659
Chip-scale broadband optical isolation via Bragg scattering four-wave mixing
660
Chip-scale cavity-optomechanical accelerometer
661
Chip-scale DC/DC power converter
662
Chip-scale electrodynamic synthetic jet actuators
663
Chip-scale frequency comb sources for terabit communications
664
Chipscale GHz ultrasonic channels for fingerprint scanning
665
Chip-scale hermetic feedthroughs for implantable bionics
666
Chip-scale High-speed Fourier-transform Spectrometer Based on a Combination of a Michelson and a Fabry-Perot Interferometer
667
Chip-scale IMU using folded-mems approach
668
Chip-scale integrated tuning of slow-light in all-optical multi-EIT analogue in photonic crystal cavities
669
Chip-Scale Integration of Data-Gathering Microsystems
670
Chip-Scale Localized Synthesis of Carbon Nanotubes on Copper Microstructures via Inductive Heating
671
Chip-scale magnetic sensing and control of nanoparticles and nanorods
672
Chipscale mmW Switches
673
Chip-scale multiple quantum well based optical interconnects
674
Chip-scale multiwavelength hybridly modelocked semiconductor laser
675
Chip-scale nanophotonic chemical and biological sensors using CMOS process
676
Chip-scale optical cross-connect for WDM LAN nodes with high extinction ratio reconfiguration
677
Chip-scale optical interconnects based on hybrid integrated multiple quantum well devices
678
Chip-scale packaging
679
Chip-scale packaging for bioelectronic implants
680
Chip-scale packaging of hybrid-integrated Si photonic transceiver: Optical I/O core
681
Chip-scale packaging of power devices and its application in integrated power electronics modules
682
Chip-scale packaging of power devices and its application in integrated power electronics modules
683
Chip-Scale Photonic Crystal Spectrometers with High Resolution for Lab-on-a-chip Sensing Applications
684
Chip-scale photonic routing fabrics for avionic and satellite applications
685
Chip-scale photonics with plasmonic components
686
Chip-scale physical interconnect models (Tutorial)
687
Chip-Scale Quadrupole Mass Filters for Portable Mass Spectrometry
688
Chip-scale reconfigurable phased-array sonic communication
689
Chip-scale RF optical systems
690
Chip-scale sonic communication using AlN transducers
691
Chip-scale source of photonic entanglement
692
Chip-scale thermal energy harvester using Bi
2
Te
3
693
Chip-scale wavelength-division multiplexed integrated sensor arrays
694
Chip-scale-packaging applied to optical transceivers
695
ChIP-seq Data Plays an Important Role in a Cytosine-Based DNA Methylation Prediction Model
696
Chipset development for Digital Radio Mondiale (DRM)
697
Chipset for a coherent polarization-multiplexed QPSK receiver
698
Chipset for Flexible and Scalable High-Performance Gate Drivers for 1200 V-6500 V IGBTs
699
Chipset for PALplus receivers
700
Chip-set for video display of multimedia information
701
Chip-set for video display of multimedia information
702
Chip-side-healing as a basis for robust bare-chip assemblies
703
Chip-size and power consumption of ASICs and digital signal processors for low-power signal-processing
704
Chips-open or wrapped
705
Chip-sparsification and symbol-equalization for WCDMA downlink
706
Chip-to-Board Micromachining for Interconnect Layer Passive Components
707
Chip-to-chip board-level optical data buses
708
Chip-to-chip communication based on capacitive coupling
709
Chip-to-chip communication by optical routing inside a thin glass substrate
710
Chip-to-chip communication using a single flux quantum pulse
711
Chip-to-chip communications using capacitive interconnects
712
Chip-to-chip driver and receiver circuits for a Josephson computer
713
Chip-to-chip fluidic connectors via near-field electrospinning
714
Chip-to-chip half duplex data communication at 135 Mbps over power-supply rails
715
Chip-to-Chip Inductive Wireless Power Transmission System for SiP Applications
716
Chip-To-Chip Interconnection by Mechanical Caulking Using Reflowed Sn Bumps
717
Chip-to-Chip Interconnects Using Integrated Antennas
718
Chip-to-Chip Optical Interconnection for Next-generation High-performance Systems
719
Chip-to-chip optical interconnects
720
Chip-to-Chip Optical Link System Using an Optical Wiring Method
721
Chip-to-chip optical wireless link feasibility using optical phased arrays on silicon-on-insulator
722
Chip-to-chip optoelectronics SOP on organic boards or packages
723
Chip-to-chip photonic packaging by using thin glass based waveguide substrates on board and module level
724
Chip-to-chip plasmonic interconnects and the activities of EU project NAVOLCHI
725
Chip-to-chip quantum entanglement distribution
726
Chip-to-package interaction for a 90 nm Cu / PECVD low-k technology
727
Chip-to-package wireless power transfer and its application to mm-Wave antennas and monolithic radiometric receivers
728
Chip-to-rectangular waveguide transition realized in embedded Wafer Level Ball Grid Array (eWLB) package
729
Chip-to-wafer (C2W) 3D integration with well-controlled template alignment and wafer-level bonding
730
Chip-to-wafer stacking technology for 3D system integration
731
Chip-type LTCC-MLC baluns using the stepped impedance method
732
Chiral 3D Photonic Crystals as Compact Optical Isolators
733
Chiral absorbing material
734
Chiral Ag nanostructure arrays as optical antennas
735
Chiral antenna element as a low backscattering sensor
736
Chiral antennas radiating circularly polarized waves
737
Chiral bio-nanoclays: Synthesis and applications
738
Chiral composites as underwater acoustic attenuators
739
Chiral composites as underwater acoustic attenuators
740
Chiral Coupling in T-shaped Gold Nanodimers
741
Chiral cover effects on microstrip antennas
742
Chiral discrimination by simple gas sensors
743
Chiral Discrimination Performance of a Monolithic CMOS Gas Sensor Microsystem
744
Chiral fiber gratings
745
Chiral Fibers
746
Chiral Fibers: Microformed Optical Waveguides for Polarization Control, Sensing, Coupling, Amplification, and Switching
747
Chiral frequency selective surfaces comprised of multiple conducting strips per unit cell
748
Chiral gratings in optical fiber
749
Chiral gratings-a new class of polarization sensitive metamaterials
750
Chiral hard-surface waveguide mode transformer
751
Chiral interactions of light in complex potentials
752
Chiral layered metallic microstructures
753
Chiral light-matter interactions in resonant metamaterials
754
Chiral low frequency resonance on an anisotropically conductive cylinder with a thin longitudinal slot
755
Chiral Maxwell-Garnett mixing formula
756
Chiral Media Based on Printed-Circuit Board Technology: A Numerical Time-Domain Approach
757
Chiral metal complexes with giant octupolar nonlinearities
758
Chiral metamaterial based circularly polarized microstrip antennas
759
Chiral Metamaterials With Negative Refractive Index Composed by an Eight-Cranks Molecule
760
Chiral metamaterials with strong and dynamically optical activity
761
Chiral metamaterials: A tool for THz polarization control
762
Chiral metamaterials: From negative index to asymmetric transmission
763
Chiral Mode Transformer for Hard Surface Waveguides
764
Chiral mono-crystalline silicon nano-cone fabrication by optical vortex pumping
765
Chiral Photonic Metamaterial
766
Chiral plasmonic activity of cholesteric films formed by gold nanorods and cellulose nanocrystals
767
Chiral plasmonic films and nanoparticles
768
Chiral polarization control using cascaded tensor impedance surfaces
769
Chiral polymeric relief structures fabricated by using optical vortices
770
Chiral properties of lossy n-turn helices in the quasi-stationary approximation using a transmission-line model
771
Chiral slab polarization transformer for aperture antennas
772
Chiral structure control of metal nano-needles fabrictaed by optical vortex laser ablation
773
Chiral THz metamaterial with tunable optical activity
774
Chiral Tunneling-Assisted Over-Barrier Electron Emission From Graphene
775
Chiral-field microwave antennas Chiral microwave near fields for far-field radiation
776
Chirality and bianisotropy effects in plasmonic metasurfaces and their application to realize ultrathin optical circular polarizers
777
Chirality and the transient electromagnetic pulse
778
Chirality as a bulk property retrieved from the dispersion relation
779
Chirality control in metamaterials by geometrical manipulation
780
Chirality Dependence of Absorption in Carbon Nanotubes
781
Chirality dependence of absorption in carbon nanotubes
782
Chirality dependence of Raman cross-section in carbon nanotubes
783
Chirality in neural network systems
784
Chirality Measure for 2D and 3D Meta-Materials
785
Chirality selective synthesis and enrichment of single walled carbon nanotubes for macroelectronics
786
Chirally Coupled Core Fibers at 1550-nm and 1064-nm for Effectively Single-Mode Core Size Scaling
787
Chiral-selective excitation of lattice vibrations in carbon nanotubes using femtosecond pulse shaping
788
Chireix power combining with saturated class-B power amplifiers
789
Chirico-a framework for computerization of medical practice guidelines
790
Chirikov-Taylor Model For Particle Diffusion In Plasma Turbulence
791
Chiro-ferrites for low-loss magnetic photonic crystals
792
CHIRON: An energy-efficient chain-based hierarchical routing protocol in wireless sensor networks
793
Chiron-1: a user interface development system tailored to software environments
794
Chiroshield: a Salisbury/Dallenbach shield alternative
795
Chirosolitons: unique spatial solitons in chiral media
796
Chirosorb as an invisible medium
797
Chirp analysis of wavelength conversion based on quantum-dot semiconductor optical amplifier
798
Chirp and click evoked auditory steady state responses
799
Chirp and Dispersion Tolerance of a Single-Drive Push–Pull Silicon Modulator at 28 Gb/s
800
Chirp and feedback control in semiconductor pigtailed DFB lasers without integrated isolator
801
Chirp and frequency offset tolerant coherent burst-mode receiver using directly modulated DFB lasers for coherent PON systems
802
Chirp and linewidth enhancement factor alpha of current modulated Ga(Al)As-GRINSCH-SQW-MCRW flared waveguide lasers
803
Chirp and linewidth enhancement factor of 1.55 μm VCSEL with buried tunnel junction
804
Chirp and linewidth enhancement factor of tunable, optically-pumped long wavelength VCSEL
805
Chirp and periodic spectral structure in the light reflected from nonlinear mirror
806
Chirp And Self-phase Modulation In Induced-grating Autocorrelation Measurements Of Ultrashort Pulses
807
Chirp and stability of mode-locked semiconductor lasers
808
Chirp and system performance of integrated laser modulators
809
Chirp based method for ADC testing: simulation and evaluation
810
Chirp based multiple access technique using fractional fourier transform
811
Chirp behaviour of high-speed GaInAsP/InP optical intensity modulator
812
Chirp characteristics of 10-Gb/s electroabsorption modulator integrated DFB lasers
813
Chirp characteristics of 40-gb/s directly Modulated distributed-feedback laser diodes
814
Chirp characteristics of a tunable, optically pumped VCSEL
815
Chirp characteristics of dual-drive. Mach-Zehnder modulator with a finite DC extinction ratio
816
Chirp characteristics of optical combs in MZM-based flat comb generator with optical feedback loop
817
Chirp Characteristics of Silicon Mach–Zehnder Modulator Under Small-Signal Modulation
818
Chirp characteristics of silicon Mach-Zehnder modulators
819
Chirp characterization of a high-resolution, low-chirp, ns-pulsed optical parametric oscillator/amplifier system
820
Chirp characterization of a single-arm asymmetric silicon carrier depletion modulator
821
Chirp Characterization of External Modulators With Finite Extinction Ratio Using Linear Optical Sampling
822
Chirp characterization of semiconductor mode-locked laser pulses with a high-sensitivity TPA waveguide detector sonogram
823
Chirp coding for ultrasound imaging of polymer-shelled microbubbles
824
Chirp compensation capability of a semiconductor laser amplifier
825
Chirp compensation in a femtosecond direct space-to-time optical pulse shaper
826
Chirp compensation in mode-locked DFB laser diodes with extended cavity
827
Chirp compensation using four-wave mixing and its application to 10-Gb/s directly modulated signal transmission over SMF
828
Chirp consequences of all-optical RZ to NRZ conversion using cross-phase modulation in an active semiconductor photonic integrated circuit
829
Chirp control and broadband wavelength-tuning of 40-GHz monolithic actively mode-locked laser diode module with an external CW light injection
830
Chirp control of 10 Gbit/s RZ data stream converted by semiconductor optical amplifier using multi-mode inverse optical comb injection
831
Chirp control of 10-GHz harmonic mode-locked weak-resonant-cavity fabry-perot laser diode with reduced end-facet reflectance
832
Chirp control of a single-mode, good beam quality, zigzag dye laser
833
Chirp control of an optical signal using phase modulation in a semiconductor optical amplifier
834
Chirp control of picosecond light pulses generated by mode-locked external cavity multisegment laser diode
835
Chirp controlled pulse self-compression in filaments and its spatio-temporal characterization
836
Chirp controls nonlinear response of excitons in Semiconductor quantum wells
837
CHIRP Doppler radar
838
Chirp effects in high-order harmonics generated from solid surface
839
Chirp Evolution Algorithm of a Dark-Optical-Comb Injection Mode-Locked SOA Fiber Laser Pulses During Soliton Compression
840
Chirp excitation of polydisperse microbubble populations for increasing sonoporation efficiency
841
Chirp excitation of ultrasonic probe for high-rangeability gas flowmetering
842
Chirp excitation of ultrasonic probes and algorithm for filtering transit times in high-rangeability gas flow metering
843
Chirp extraction of wave-breaking-free soliton in a passively mode-locked Yb-doped fiber laser based on STFT and WVD
844
Chirp Fourier transform based on a single SAW filter
845
Chirp Frequency Synchronized Detection for Suppression of Light Interference in Optical Access Networks
846
Chirp Frequency-Translated Reference Ultra-Wideband (UWB) Wireless Communication System
847
Chirp FSK modem for high reliability communication in shallow water
848
Chirp hunting
849
Chirp imaging vibro-acoustography for removing the ultrasound standing wave artifact
850
Chirp Impulse Radio Ultra-Wideband antenna array with low sample-rate digital beam steering
851
Chirp in a mode-locked ring dye laser
852
Chirp in an external-cavity laser diode with an intracavity frequency shifter
853
Chirp in optically-linearized external modulators and its effect on analog transmission
854
Chirp in picosecond pulses from diode lasers: Dependence on the modulation conditions and linewidth enhancement factor
855
Chirp investigation of monolithic mode locked laser diode pulses with a spectral domain interference method
856
Chirp limitation on high-speed wavelength conversion using semiconductor optical amplifiers
857
Chirp limitation on Mach-Zehnder interferometer ultrafast switching employing semiconductor optical amplifiers
858
Chirp managed laser (CML): A compact transmitter for dispersion tolerant 10 Gb/s networking applications
859
Chirp Managed Laser and Applications
860
Chirp Manipulation of Harmonically Mode-Locked Weak-Resonant-Cavity Colorless Laser Diode With External Fiber Ring
861
Chirp measurement and transmission experiment at 10 Gbit/s with Wannier-Stark modulator
862
Chirp measurement of CO
2
TEA laser using interferometric pulse delay techniques
863
Chirp measurement of electro-optic modulators using simple optical spectrum analysis
864
Chirp modulated by Gaussian pulse for synthetic aperture radar imaging
865
Chirp modulated CO
2
waveguide laser
866
Chirp monitoring and fine tuning system for optical pulses based on variable dispersion compensator and peak power monitor
867
Chirp Multiplication by Four Wave Mixing for Wideband Swept-Frequency Sources for High Resolution Imaging
868
Chirp Noise Waveform Aided Fast Acquisition Approach for Large Doppler Shifted TT&C System
869
Chirp Nonlinearity Compensation for Cost Effective Optical FMCW radar
870
Chirp of color-free injection-locked reflective semiconductor optical amplifier transmitter in 200GHz AWG based WDM-PON after 25km metropolitan transmission
871
Chirp optimization of 1550nm InAs/InP Quantum Dash based directly modulated lasers for 10Gb/s SMF transmission up to 65Km
872
Chirp optimization of pulsed parametric amplifier
873
Chirp optimization using piecewise linear approach
874
Chirp optimized 60 GHz millimeter-wave fiber-optic transmission incorporating EA-modulator
875
Chirp parameter estimation from a sample covariance matrix
876
Chirp parameter estimation from tensor decomposition
877
Chirp parameter estimation using rank reduction
878
Chirp Penalty In Wavelength Selective Data Links
879
CHIRP program lessons learned from the contractor program management team perspective
880
Chirp properties induced by SOA for amplification and wavelength conversions measured by an optical tunable bandpass filter
881
Chirp pulse compression in non-coherent Impulse-Radio Ultra-Wideband detection without waveform signature estimation
882
Chirp pulse microwave computed tomography(CP-MCT) equipped with a fan beam scanner for high-speed imaging of a biological target
883
Chirp pulse transmission through a single-mode fibre
884
Chirp radar ambiguity function shaping
885
Chirp rate estimation of speech based on a time-varying quasi-harmonic model
886
Chirp reduction and modulation bandwidth enhancement of transverse coupled cavity VCSEL
887
Chirp Reduction by SPM and XPM Cancellation in DWDM Optical Transmission Systems
888
Chirp Reduction in Directly Modulated Multi-Electrode RSOA Devices in Passive Optical Networks
889
Chirp reduction in directly-modulated semiconductor lasers subject to external optical injection
890
Chirp reduction in wavelength conversion using a laser diode by injection locking
891
Chirp reduction of π/2 alternate-phase pulses by optical filtering
892
Chirp reduction of directly modulated semiconductor lasers at 10 Gb/s by strong CW light injection
893
Chirp reduction using push-pull modulation of three-contact lasers
894
Chirp reduction utilizing phase squeezing property in PPLN-based phase sensitive amplifier
895
Chirp removal from directly modulated laser signals by two-stage fiber cross-phase modulation
896
Chirp reversal power modulation contrast imaging
897
Chirp scaling algorithm for GEO SAR based on fourth-order range equation
898
Chirp scaling algorithm for parallel bistatic SAR data processing
899
Chirp scaling algorithms for SAR processing
900
Chirp scaling based detection of moving targets in SAR images
901
Chirp signal analysis based on PWD in fractional Fourier transform domain
902
Chirp signal correlation in the wavelet domain
903
Chirp signal detection using the Duffing oscillator
904
Chirp signal matching and signal power optimization in pulse-echo mode ultrasonic nondestructive testing
905
Chirp Signal Processing Using Acoustic Surface Wave Filters
906
Chirp signal-based aerial acoustic communication for smart devices
907
Chirp sine and cosine transforms for a split-step propagation algorithm
908
Chirp sonar sediment characterization at the northern Gulf of Mexico Littoral Acoustic Demonstration Center experimental site
909
Chirp sounder measurements for broadband wireless networks and cognitive radio
910
Chirp sounding the shallow water acoustic channel
911
Chirp Spectroscopy Applied to the Characterization of Ferromagnetic Resonance in Magnetic Tunnel Junctions
912
Chirp step-frequency moving object echo real time digital generation methods
913
Chirp sub-bottom profiler for TOBI, a deep ocean survey vehicle
914
Chirp Sub-pulse Stepped Frequency Radar Signal Processing
915
Chirp tailoring in Q-switched InGaAsP lasers using electroabsorption loss section
916
Chirp technique approach for objects´ identification
917
Chirp transform in the nonlinear tracking performance analysis of the LMS adaptive predictors
918
Chirp UWB system with software defined receiver for industrial mobile ranging and autonomous control
919
Chirp Waveform Generation Using Digital Samples
920
Chirp Z-driven split-step propagation algorithms for AOA analysis
921
Chirp z-transform based SPECAN approach for phase-preserving ScanSAR image generation
922
Chirp Z-Transform Filter
923
CHIRP´s potential to introduce a new USAF space acquisition paradigm
924
Chirp-Based Image Watermarking as Error-Control Coding
925
Chirp-based impedance spectroscopy of piezo-sensors
926
Chirp-based piezo-impedance measurement
927
Chirp-coded excitation imaging with a high-frequency ultrasound annular array
928
Chirp-Coded Pulse Excitation for Ultrasound Elasticity Imaging
929
Chirp-compensated 40 GHz semiconductor modelocked lasers integrated with chirped gratings
930
Chirp-compensated 40-GHz mode-locked lasers integrated with electroabsorption modulators and chirped gratings
931
Chirp-compensated 40-GHz mode-locked lasers integrated with electroabsorption modulators and chirped gratings
932
Chirp-Compensated DBR Lasers for TWDM-PON Applications
933
Chirp-Compensated Multichannel Hybrid DWDM/TDM Pulsed Carrier From Optically Injection-Mode-Locked Weak-Resonant-Cavity Laser Diode Fiber Ring
934
Chirp-controlled EA-modulator/SOA/widely-tunable laser transmitter
935
Chirp-controlled soliton fission in tapered optical fibers
936
Chirp-controlled tandem electroabsorption modulator integrated with an SOA and a sampled-grating DBR laser
937
Chirp-Dependent Above-Threshold Ionization
938
Chirp-dependent above-threshold ionization
939
Chirped AM ladar for 3D imaging and range-Doppler tracking at 1550 nm wavelength: Update
940
Chirped amplification of picosecond gain-switched laser pulse by using traveling-wave semiconductor optical amplifier
941
Chirped and apodized silicon gratings efficiently coupled to normally incident fiber array
942
Chirped and tilted fiber Bragg grating edge filter for in-fiber sensor interrogation
943
Chirped Bloch oscillations in InGaAs(P)/InGaAs(P) superlattices
944
Chirped Bragg grating in silicon based rib waveguide
945
Chirped Bragg Grating Waveguides Directly Written Inside Fused Silica Glass With an Externally Modulated Ultrashort Fiber Laser
946
Chirped delay lines in microstrip technology
947
Chirped dual overwritten fiber Bragg grating for dispersion compensation
948
Chirped duobinary transmission (CDBT) for mitigating the self-phase modulation limiting effect
949
Chirped excitation for <-100 dB time sidelobe echo sounding
950
Chirped excitation of optically-dense inhomogeneously broadened media using Eu/sup 3+/: Y/sub 2/SiO/sub 5/
951
Chirped fiber Bragg gratings beamformer for SHF phased-array antenna transmissions
952
Chirped fiber Bragg gratings for electrically tunable time delay lines
953
Chirped fiber Bragg gratings for optical dispersion compensation: how to improve their fabrication accuracy
954
Chirped fiber Bragg gratings for WDM chromatic dispersion compensation in multispan 10-Gb/s transmission
955
Chirped fiber grating characterization with phase ripples
956
Chirped fiber gratings and their applications
957
Chirped fiber gratings for mmW generation and processing
958
Chirped fiber optic Bragg grating esophageal pressure sensor
959
Chirped fiber optic Bragg grating interrogator for a Bragg grating strain sensor
960
Chirped fiber-Bragg grating as self-temperature referenced strain sensor in nonisothermal thermoset processing
961
Chirped fiber-grating-integrated optical limiting amplifier for dispersion compensation
962
Chirped fiber-optic Bragg grating interrogator in a multiplexed Bragg grating sensor configuration
963
Chirped fibre Bragg gratings for phased-array antennas
964
Chirped fibre gratings produced by tilting the fibre
965
Chirped frequency transfer: a tool for synchronization and time transfer
966
Chirped GaAs-AlAs distributed Bragg reflectors for high brightness yellow-green light-emitting diodes
967
Chirped grating DBR lasers using bent waveguides
968
Chirped grating for efficient coupling from a silicon waveguide to a vertical optical fiber
969
Chirped grating lambda /4-shifted distributed feedback laser with uniform longitudinal field distribution
970
Chirped Grating WDM Demultiplexer
971
Chirped gratings for DFB laser diodes using bent waveguides
972
Chirped gratings in integrated optics
973
Chirped gratings produced in photosensitive optical fibres by fibre deformation during exposure
974
Chirped in-fibre Bragg grating dispersion compensators: linearisation of dispersion characteristic and demonstration of dispersion compensation in 100 km, 10 Gbit/s optical fibre link
975
Chirped ladder-type interferometric filter for widely tunable laser diode
976
Chirped laser dispersion spectroscopy for remote sensing of methane at 1.65μm — Analysis of system performance
977
Chirped laser dispersion spectroscopy with baseline-free 2
nd
harmonic detection
978
Chirped laser dispersion spectroscopy with directly modulated quantum cascade laser
979
Chirped Laser Seeding for SBS Suppression in a 100-W Pulsed Erbium Fiber Amplifier
980
Chirped Lidar Using Simplified Homodyne Detection
981
Chirped lidar-radar for medical diagnostics
982
Chirped microwave photonic filter with high frequency tuning capability
983
Chirped Microwave Pulse Compression Using a Photonic Microwave Filter With a Nonlinear Phase Response
984
Chirped Microwave Pulse Generation Based on Optical Spectral Shaping and Wavelength-to-Time Mapping Using a Sagnac Loop Mirror Incorporating a Chirped Fiber Bragg Grating
985
Chirped Microwave Pulse Generation Using a Photonic Microwave Delay-Line Filter With a Quadratic Phase Response
986
Chirped microwave pulse generation using a tilted fiber Bragg grating
987
Chirped Microwave Pulse Generation Using an Integrated SiP Bragg Grating in a Sagnac Loop
988
Chirped mirror to facilitate fabrication of a sub-10-fs Ti:sapphire oscillator
989
Chirped moirés in 3-D displays
990
Chirped moire fiber gratings operating on two-wavelength channels for use as dual-channel dispersion compensators
991
Chirped multilayer hollow waveguides with broadband transmission
992
Chirped multilayer mirrors for dispersion control of femtosecond pulses
993
Chirped optical pulse compression using a silicon channel waveguide
994
Chirped optical solitons: High degree pulse compression
995
Chirped Periodically Poled
Wavelength Converter With Apodization Structure
996
Chirped phase as tool to monitor filamentation
997
Chirped Phase Mask Interferometer for Fiber Bragg Grating Array Inscription
998
Chirped photonic crystal fibers break pulse-duration limits in femtosecond beam delivery
999
Chirped photonic crystal waveguides
1000
Chirped Photonic Crystals for spatial filtering of light beams
