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1
P3A-5 Two Methods for Catheter Motion Correction in IVUS Palpography
2
P3A-6 Non-Invasive Micro-Vascular Ultrasound Elastography: Comparisons with M-Mode Strain Measurements in Rat Models of Hypertension
3
P3A-6 The Effect of Including Fiber Orientation in Simulated 3D Ultrasound Images of the Heart
4
P3A-7 Real-Time High-Resolution 3D Imaging Method Using 2D Phased Arrays Based on Sparse Synthetic Focusing Technique
5
P3ARM: Privacy-Preserving Protocol for Association Rule Mining
6
P3B-1 Experimental Demonstration of Improvements to Operator Splitting Method Using Field II
7
P3B-2 Clutter From Multiple Scattering and Aberration in a Nonlinear Medium
8
P3B-3 Comparison of an Angular Spectrum Method and a Green´s Function Method for Nonlinear Propagation of Pulsed Acoustic Fields from Medical Phased Array Transducers
9
P3B-3 Staining Doppler Audio
10
P3B-4 Coded Excitation and Nonlinear Pulse Compression in Pulse-Inversion Fundamental Imaging
11
P3B-4 In Vitro Investigation of Blood-Flow Velocity Patterns Near a Fine Mesh
12
P3B-5 A Feasibility Study of Tissue Harmonic Generation with 3f0 Transmit Phasing
13
P3B-5 Investigation of Doppler Ultrasound Velocity-Based Indices for Carotid Plaque Ulcerations Using In Vitro Flow Models
14
P3B-6 A Novel US Method for the Assessment of Maternal, Placental and Fetal Circulation during Pregnancy
15
P3B-6 Implications of Mode Conversion on Transcranial Ultrasound Imaging
16
P3B-7 Study on Harmonic Pulse Compression Imaging with Consideration of Harmonic Property
17
P3B-8 Signed Echo Imaging with High Axial Resolution
18
P3C: A Robust Projected Clustering Algorithm
19
P3C-1 A Matrix Pencil Estimator with Adaptive Rank Selection: Application to in Vivo Flow Studies
20
P3C-1 Modelling of In Vivo Liver Motion on HIFU Treatments: A Combined Method
21
P3C-10 Towards a Reflex Transmission Method For Ultrasound Thermometry
22
P3C-12 Combining Spectral and Intensity Data to Identify Regions of Cavitation in Ultrasound Images; Application to HIFU
23
P3C-2 A Frequency Splitting Method for CFM Imaging
24
P3C-2 Ultrasound Energy Rapidly Labels Stem/Progenitor Cells with Nanoparticle Beacons without Disrupting Membrane Integrity
25
P3C-3 In-Vivo Vector Velocity Imaging Using Directional Cross-Correlation
26
P3C-4 Effect of Various Ultrasound Insonifications on the ABeta-Induced Apoptotic Neurons
27
P3C-4 Motion Compensated Beamforming in Synthetic Aperture Vector Flow Imaging
28
P3C-5 Split-Focused Ultrasound for Breast Tumor Thermal Surgery with Multidirectional Heating
29
P3C-6 Power Ultrasonics in Oral Implantology
30
P3C-6 Role of Ultrasonic Velocity Estimation Errors in Assessing Inflammatory Response and Vascular Risk
31
P3C-7 Investigation of Dual Curved Ultrasound Phased Arrays for Breast Tumor Thermal Therapy
32
P3C-7 Microvascular Imaging of Chronic Total Occlusions
33
P3C-8 Imaging of Tumor Boundary Using Motion Vector Mapping
34
P3C-8 Techniques for Real-Time Monitoring and Control for HIFU (High Intensity Focused Ultrasound) Ablationin Porcine Brains In Vitro Studies
35
P3C-9 Simulation and Experiment Results of a 1D High Intensity Focused Ultrasound Array for Acoustic Hemostasis Applications
36
P3-CABAC: A Nonstandard Tri-Thread Parallel Evolution of CABAC in the Manycore Era
37
P3D - Privacy-Preserving Path Discovery in Decentralized Online Social Networks
38
P3D: A Lisp-based format for representing general 3D models
39
P3D: A parallel 3D coordinate visualization for advanced network scans
40
P3D-1 An Analysis of Refraction Artifacts in Time-of-Flight Tomography Regarding their Impact on Image Definition and Contrast Resolution
41
P3D-1 Coherence-Based Adaptive Breast Imaging with Clinical Data
42
P3D-2 Phase Aberration Correction for 3D Ultrasound Computer Tomography Images
43
P3D-2 ROC Analysis of Ultrasound Elasticity Imaging of Breast Abnormalities
44
P3D-3 Strain Image Contrast for Differentiating In Vivo Breast Lesions
45
P3D-3 Transmission Ultrasound Imaging to Guide Thermal Therapy
46
P3D-4 3D Breast Elastography with a Combined Ultrasound/Tomography System
47
P3D-4 Two-Dimensional Ultrasonic Computed Tomography of Growing Bones
48
P3D-5 Aperture Optimization for 3D Ultrasound Computer Tomography
49
P3D-5 Real Time Optical Tomography of Biological Tissue by Detection of Ultrasonic Velocity Change Due to Light Illumination
50
P3D-6 Simulation, Fabrication, and Characterization of a Novel Flexible, Conformal Ultrasound Transducer Array
51
P3-DCF: service differentiation in IEEE 802.11 WLANs using per-packet priorities
52
P3E-1 Properties of Coagulating Blood Under Steady Flow Detected by Statistical Analysis of Backscattered Signals
53
P3E-1 Torsional Wave Transduction in a Rotating Shaft Using Magnetostrictive Patch Array
54
P3E-2 Generalized Simulation of Ultrasonic Backscattering Based on Three-dimensional Modeling of Random Heterogeneous Media: Application to Blood
55
P3E-3 Finite Element Modeling of Ultrasound Scattering by Spherical Objects and Cells
56
P3E-4 Transducer Design for Liquid Custody Transfer Ultrasonic Flowmetering
57
P3E-5 Attenuation Estimations from B-Mode Image Data Derived using Bandpass Filtering
58
P3E-5 Evaluation of Fatigue Specimens Using Emats For Nonlinear Ultrasonic Wave Detection
59
P3E-6 3D Tissue Characterization of the Equine Superficial Digital Flexor Tendons From In Vivo Ultrasound Images
60
P3E-6 Ultrasound Attenuation Spectroscopy for Highly Dissipative Fluids - A Novel Approach Focussing Process Applications
61
P3E-7 A New Feature For Detection Of Prostate Cancer Based On RF Ultrasound Echo Signals
62
P3E-8 Technique for Automatic Characterisation of an Amputee´s Residual Limb
63
P3E-9 Ultrasound Speckle Detection Using Low Order Moments
64
P3F-1 Lamb Wave Generation with an Air-Coupled Piezoelectric Array Using Different Square Chirp Modulation Schemes
65
P3F-1 Nonlinear Ultrasound Detection of Osteoporosis
66
P3F-2 Nonlinear Resonant Ultrasound Spectroscopy for Micro Damage Assessment in Human Bone
67
P3F-4 Ultrasonic Consequence of Different Common Sterilization Treatments Applied to Human Bone Before Transplantation
68
P3F-5 An Ultrasonic Through-Wall Communication System with Power Harvesting
69
P3F-5 Ultrasonic Transmission Device Based On Crossed Beam Forming
70
P3F-6 Acoustic Emission Based Online Valve Leak Detection and Testing
71
P3F-6 Characterization of Human Cancellous Bone Specimens in Terms of Biot´s Theory
72
P3F-7 Impact of Microstructure on Elastic Behavior of Cortical Bone
73
P3F-8 Elastic Anisotropy and Crystallites Orientation in Bovine Cortical Bone
74
P3FSM: Portable Predictive Pattern Matching Finite State Machine
75
P3G-1 3D Time-Domain Modeling of Nonlinear Medical Ultrasound with an Iterative Green´s Function Method
76
P3G-1 The Evaluation of Nonpermanent Acoustic Bonding Materials Incorporating Micron Size Particles
77
P3G-10 A Quantitative Study of the Time Delay Correction for Full Angle Spatial Compounding
78
P3G-11 Generation and Aberration of Second-Harmonic Ultrasound Beams in Heterogeneous Tissue
79
P3G-2 Effect of Ultrasound Exposure in Standing Wave Sound Field on Isoelectric Point of Nanometer Sized Diamond Particles for Abrasive Agent
80
P3G-3 The "N-Shot" Maximum Brightness Algorithm: An Efficient and Robust Delay-Aberration Estimator
81
P3G-4 Signal to Noise Gains for Evaluating Beamforming Strategies
82
P3G-5 Distortion-Free Delta-Sigma Beamforming with Dynamic Delays
83
P3G-5 Fluid Motion Induced by Acoustic Field in Microchannel
84
P3G-6 Error-Free Pulse Compression Method for Ultrasound Beamforming Using Sigma-Delta Modulation
85
P3G-7 Adaptive Field-of-View Imaging for Efficient Phase Rotation Beamforming
86
P3G-8 Random Thinning of Segmented Annular Arrays
87
P3G-9 Reconstruction of Ultrasonic Sound Velocity and Attenuation Coefficient Using Linear Arrays: Clinical Assessment
88
P3H-1 High Frame-Rate and High Resolution Medical Imaging Using Adaptive Beamforming
89
P3H-1 Tunable Solidly Mounted Resonators
90
P3H-2 Improved Beamforming for Lateral Oscillations in Elastography Using Synthetic Aperture Imaging
91
P3H-3 Parametric Beamformer for Synthetic Aperture Ultrasound Imaging
92
P3H-3 Thin Film Stack Transducer for Simultaneous Generation of Longitudinal and Shear Waves at Same Frequency
93
P3H-4 Formation of Desired Waveform and Focus Structure by Time Reversal Acoustic Focusing System
94
P3H-4 The Finite Element Analysis of Quartz Crystal Resonators with Mindlin Plate Theory and Parallel Computing Techniques on Computer Clusters
95
P3H-5 Adaptive Beam Steering for Improved Imaging of Carotid Sinus
96
P3H-6 An Integrated Circuit with Transmit Beamforming and Parallel Receive Channels for Real-Time Three-Dimensional Ultrasound Imaging
97
P3H-7 Volumetric Imaging Using Fan-Beam Scanning with Reduced Redundancy 2D Arrays
98
P3H-8 A Scalable Parallel Implementation of a k-Space Method for Large-Scale Ultrasound Imaging Simulations
99
P3HT-PS blend nanofiber FET based on electrospinning
100
P3I-1 Effect of Gamma and Neutron Radiation on Quartz SAW Resonators
101
P3I-1 Functional Ultrasound Contrast of Renal Tumors in a Mouse Model
102
P3I-2 A High Resolution Digital Ultrasound System for Imaging of Zebrafish
103
P3I-2 Cavityless Wafer Level Packaging of SAW Devices
104
P3I-3 A Real-Time High Frame Rate High Frequency Ultrasonic System for Cardiac Imaging in Small Animals
105
P3I-3 Wafer Level Chip Size Packaging of SAW Devices Using Low Temperature Sacrifice Process
106
P3I-4 Multidimensional Segmentation of a Mouse Left Ventricle
107
P3I-5 A 3D Registration Method for US/PET Multi-Modality Small Animal Tumor Imaging
108
P3I-5 Study on SAW Characteristics of Amorphous- TeO2/128°Y-X LiNbO3 Structures
109
P3I-6 Interface Leaky Longitudinal Waves in Lithium Niobate and Lithium Tantalate
110
P3J-1 A Novel Multi-Focus Image Reconstruction Technique in High Frequency Ultrasound
111
P3J-1 Direct Observation of Surface Acoustic Wave Interaction with a Phononic Crystal
112
P3J-2 Laser-Interferometric Analysis of Rayleigh Wave Radiation from a LLSAW Resonator
113
P3J-2 Mismatched-Filter Design for Biphase-Coded Pulse for High Frequency Ultrasound Imaging
114
P3J-3 Implementation of High Frame Rate Digital Scan Converter for High Frequency Ultrasound Mechanical Sector Scanner
115
P3J-3 SAW Method for Measuring of Relaxation Process in Ferroelectric Ceramics
116
P3J-4 Binary Waveform Design for Coded Excitation in High Frequency Ultrasound
117
P3J-5 High-Frequency Pulsed-Wave Ultrasound Doppler System for Biomedical Applications with PMN-PT Needle Transducer and 30 MHz Linear Array
118
P3K-1 Coupled Modes on a Rectangular Grating
119
P3K-1 Low Sound Speed and Acoustic Attenuation Silicone Rubber Lens Based on Heavy Density Ceramic Nanopowder Composite for Medical Array Probe
120
P3K-2 Fabrication and Characterization of Nanocrystalline TiO2-Polymer Composite Matching Layers
121
P3K-3 Investigation of Low Glass Transition Temperature Epoxy Resin Blends for Lossy, yet Machineable, Transducer Substrates
122
P3K-3 Surface Acoustic Waves in an Infinite Plate of Functionally Graded Materials
123
P3K-4 Utilizing a Ray Technique to Calculate Multiple Reflections and Transmitted Waves from Layered Plates and Examine the Detection of Critical Disbonds, and Lamb Modes Generated
124
P3K-5 Passive Materials for High Frequency Ultrasound Components
125
P3L-1 Elastic Moduli, and their Temperature Coefficients, of Piezoelectric and Nonpiezoelectric Polycrystalline Aggregates
126
P3L-2 The Evaluation of Nonpermanent Acoustic Bonding Agents
127
P3L-3 Viscosity Measurement of Newtonian Liquids Using The Complex Reflection Coefficient
128
P3L-4 BAW Phase Velocity Measurements by Conventional Pulse Echo Techniques with Correction for Couplant Effect
129
p3m: A Kernel Space Tool for Multimedia Stream Monitoring
130
P3M: A Virtual Machine Approach to Massively Parallel Computing
131
P3M-1 Effect of Enhancing Amplitude in a Tip of Fine Outstanding Leg on a Vibrator and its Application to a Very Thin Linear Ultrasonic Motor
132
P3M-2 Dynamic Analysis and Optimal Design of a Novel Small 2-D Planar Ultrasonic Motor
133
P3M-4 Phase Shift of Traveling Rayleigh Wave by a Surface Acoustic Wave Motor Slider
134
P3M-6 Dynamical Modelling and Position Control of Ultrasonic Piezoelectric Positioning Stage
135
P3M-7 A Multi-Degrees-of-Freedom Ultrasonic Motor Design for Robotics Applications
136
P3MCF: Practical Privacy-Preserving Multi-domain Collaborative Filtering
137
P3N-1 Direct Writing Of High Frequency Surface Acoustic Waves Using Focus Ion Beam Etching
138
P3N-2 Packaging of SAW Devices with Small, Low Profile and Hermetic Performance
139
P3O-1 5GHz SAW Devices Based on AlN/Diamond Layered Structure
140
P3O-2 Fast Evaluation of Piezoelectric Aluminum Nitride Films by Infrared Optical Techniques
141
P3O-3 Wideband Layer Mode Acoustic Devices on GaN/Sapphire Substrate
142
P3O-4 SiO2/Grooved Al-Electrodes/LiTaO3 Structures Having Large Reflection Coefficient, Large Coupling Factor, and Excellent Temperature Characteristics Even with Thick Al Electrode
143
P3O-5 High Frequency and High Temperature SAW Devices Based on Nanocrystalline Diamond Film on Langasite Substrate
144
P3O-6 Basic Study on SAW Device with Semiconductor Layer as IDTs and Control Means for Variable Operation
145
P3O-7 Theoretical Investigation of PSAW Generation and Propagation in AlN/Isotropic Diamond/Si Structure
146
P3P Adoption on E-Commerce Web sites: A Survey and Analysis
147
P3P and P2P problems with known camera and object vertical directions
148
P3P: making privacy policies more useful
149
P3P-1 Vibro-Acoustography: The Most Promising Approaches and Inferred Needs for Transducers and Arrays (Invited)
150
P3P-2 Dual Element Transducers for High Frequency Harmonic Imaging
151
P3P-4 Optimizing the Design of a 2D Array Piezoelectric Micromachined Ultrasound Transducer for 3D Echo Particle Image Velocimetry
152
P3P-5 Fundamental Study on Array Type Medical Ultrasound Probe with Hydrothermally Synthesized PZT Poly-Crystalline Film
153
P3P-6 Modeling and Design of a Linear Actuator by Langevin Vibrators
154
P3P-7 Modeling of Lens Focused Piezoelectric Transducer for Medical Imaging
155
P3P-8 Strongly Curved Short Focus Annular Array For Therapeutic Applications
156
P3P-9 1-3 Piezocomposite Autoclavable Transducers for Medical and Industrial Applications
157
P-3PC: a point-to-point communication model for automatic and optimal decomposition of regular domain problems
158
P3PO: An information system for supporting installation procedures at PETRA III
159
P3Q-1 Ultra Precision Grinding in the Fabrication of High Frequency Piezocomposite Ultrasonic Transducers
160
P3Q-2 Development and Evaluation of a 20MHz Array for Ultrasonic Detection of Middle Ear Effusion
161
P3Q-3 Curved Piezoelectric Thick Films for High Resolution Medical Imaging
162
P3Q-4 Nanocomposite Matching Layers for High Frequency Ultrasound Transducers
163
P3Q-5 Hydrothermal Polycrystalline PZT Thick Film Transducer for High Intensity Ultrasound Radiation at Over 20 MHz
164
P3R-3 Design and Characterization of Air Coupled Ultrasonic Transducers Based on MUMPs
165
P3R-4 Stagger Tuned cMUT Array for Wideband Airborne Applications
166
P3R-5 Novel Capacitive Ultrasonic Transducers Fabricated Using Microstereolithography
167
P3R-6 A Lumped Circuit Model for the Mutual Radiation Impedance of Acoustic Array Elements
168
P4 probe card-a solution for at-speed, high density, wafer probing
169
P-4 process. A novel high-density, low-cost multilayer planar thin-film PWB technology
170
P4.24: Design and test of a high efficiency energy recovery pulse modulator
171
P4-1: Electron gun with cold cathode for THz devices
172
P4-10: Distributed discharge limiter studies for X-band high power microwaves
173
P4-11: Secondary electron emission database
174
P4-12: Asymmetric coupling cavity with electromagnetic band gap
175
P4-13: 50 keV Electrons energy loss distribution in multi-layer targets
176
P4-14: Compensation of wave H
01
reflection from a dielectric window on to the horn aperture
177
P4-15: High current X-ray source technology for medical imaging
178
P4-16: High-effective switching and power amplifier tubes with electrons deceleration and their application in power electronics
179
P4-17: Recent advances on electrical contact resistance: Theory and experiment
180
P4-18: Cold testing platform for Electromagnetic Band Gap waveguide
181
P4-19: Tracing backscattered electrons in full energy range
182
P4-2: Permanent magnet for HiFIVE sheet beam transport
183
P4-20: Development of a miniature magnetic sector mass spectrometer
184
P4-21: The analysis research of design the magnetic field of the solenoid
185
P4-22: Electrostatic focusing of electrons off a large-area reticulated vitreous carbon (RVC) field emission source
186
P4-23: Determination of the field enhancement factor distribution of field emitter nanoemission matrix from emission investigation
187
P4-3: Two-dimensional millimeter wave photonic crystals fabricated by wet etching of silicon
188
P4-4: Design and analysis of a microfabricated ladder type slow-wave structure for a millimeter-wave traveling-wave tube
189
P4-5: The sheet electron beam interaction with the in-phase mode in the opposing combs
190
P450-mediated electrochemical sensing of drugs in human plasma for personalized therapy
191
P450scc mutant nanostructuring for optimal assembly
192
P4-6: Single-mode transmission in planar photonic crystal folded waveguide
193
P4-8: Folded waveguide TWT frequency characteristics in the range 600-3000 GHZ
194
P4-9 high power RF transmitters for test stands
195
P4A-1 Automated Contour Tracking For High Frame-Rate, Full-View Myocardial Elastography In Vivo
196
P4A-2 An In-Vivo Study of Frame Rate Optimization for Myocardial Elastography
197
P4A-3 3D Myocardial Strain Imaging: Improvement of Accuracy and Contrast by Dynamic Grid Interpolation
198
P4A-4 Evaluation of Cardiac Dyssynchrony Using Strain Imaging
199
P4A-5 3D Cardiac Strain Estimation Using Spatio-Temporal Elastic Registration: In Silico Validation
200
P4B-1 Characterization of a Multiscale Variational Optical Flow Method for Elastography
201
P4B-2 Beamforming Techniques for Motion Estimation in Ultrasound Elastography
202
P4B-3 Displacement Estimation Using a Slant Correlation Coefficient Filter for Large Strains
203
P4B-4 Local Harmonic Motion for In Vivo Focused Ultrasound Surgery Monitoring
204
P4B-5 The Role of Local Center Frequency Estimation in Doppler-Based Strain Imaging
205
P4B-6 Error Analysis of Axial Displacement Estimation in Elasticity Imaging
206
P4C-1 Tumor Enhanced Imaging and Treatment with Targeted Phase-Change Nano Particles
207
P4C-2 Contrast Enhanced US for Monitoring the Effect of VEGF Trap on Melanoma Tumor Vascularity
208
P4C-3 Dynamics of Ultrasound Contrast Agents within Rat Cecum Vessels
209
P4C-4 In Vitro Investigation of Thrombosis Dissolution with Microbubble-Induced Continuous Acoustic Activities
210
P4D-1 Development of a Finite Element Model of Ultrasound Contrast Agent
211
P4D-4 Image Reconstruction of Moderate Contrast Targets Using the Distorted Born Iterative Method
212
P4D-7 Nonlinear Propagation of Ultrasound Through Microbubble Clouds: A Novel Numerical Implementation
213
P4D-9 Numerical Model for the Dynamics of a Contrast Agent Bubble in an Ultrasound Field
214
P4E-1 The Dependence of Sonoporation on Cell Cycle Phase: Enhanced Effect During G2 and S-Phase
215
P4E-2 On the Mechanisms of Ultrasound Contrast Agents Induced Arrhythmias
216
P4E-3 100 MHz Sub-Millimeter Size Fiber Optic Pressure Sensors: Luxury or Necessity?
217
P4E-5 Theoretical Analysis of Oscillations of Cells in the High Frequency Ultrasonic Field
218
P4F-1 Contrast-Transfer Improvement for Electrode Displacement Elastography
219
P4F-2 Ultrasonic Elastography and Plane Strain Inverse Algorithms for Polymer Gel Dosimetry
220
P4F-3 Comparing Optimization Algorithms for the Young´s Modulus Reconstruction in Ultrasound Elastography
221
P4F-4 Feasibility of Two-Dimensional Quantitative Sonoelastographic Imaging
222
P4F-5 Microscopic Measurement of Three-Dimensional Distribution of Tissue Viscoelasticity
223
P4F-6 On the Potential of Combined ARFI and Elastography to Improve Differentiation of Material Structure in Viscoelastic Tissue
224
P4F-7 Integration of a Pressure Sensing Array Into Ultrasound Elastography
225
P4G-2 Structural Cheese Analysis Using Phased Array System
226
P4G-3 An Efficient Measurement Strategy for Plate Wave Diffraction Tomography
227
P4G-4 Airborne Ultrasonic Confocal Instrument for Parametric Imaging of Complex Samples
228
P4G-6 A New Method for the Inspection of Tool Wear Based on the Dispersion of ASF Modes
229
P4G-7 Eigenvalue Imaging Method For Subsurface Defects via A0-Mode Lamb-Waves
230
P4G-8 The Contour of the Bonding Strength at an Interface Between Bonded Solid-Bonding Layer-Solid Structure by CAN Parameter
231
P4H: An example of successful use of serious games in telerehabilitation
232
P4H-1 Finite Amplitude Method for Measurement of Nonlinearity Parameter B/A Using Plane-Wave Tone Bursts
233
P4H-2 Explosionlike Boiling of a Viscous Liquid in a High-Intensity Ultrasonic Beam
234
P4I-1 Neutrally Buoyant Band Gap Design for Underwater Applications
235
P4I-3 A Magnified Lamb Wave Source Based on the Resonant Cavity of Phononic-Crystal Plates
236
P4J-1 Design Parameters for SAW Multi-Tone Frequency Coded Reflectors
237
P4J-3 Dip-Type Liquid-Phase Sensor Using SH-SAW
238
P4K-1 Application of Slanted Finger Inter-Digital Transducer SAW Devices to Plural Ultraviolet Photodetectors
239
P4K-2 Theoretical and Experimental Results of Flat Phase Linear-Wide Band -Low Loss Filters Using Dispersive Unidirectional Interdigital Transducers on Y-X LiNbO3 and New Acoustic Boundary Waves
240
P4K-4 Novel Layered SAW Structure for Droplet Multidirectional Actuating and Sensing
241
P4L-1 Enabling Very High Temperature Acoustic Wave Devices for Sensor & Frequency Control Applications
242
P4L-2 Theoretical Analysis of Love Mode Surface Acoustic Wave Device as Cell-Based Biosensor
243
P4L-3 Anisotropic Wave-Surface Shaped Annular Interdigital Transducer
244
P4L-4 Etch Rate Dependence on Crystal Orientation for Lithium Niobate
245
p4-Linda: a portable implementation of Linda
246
P4M-1 Design, Fabrication and Characterisation of Capacitive Micro-Machined Ultrasonic Transducers Based on a 2D-Like Architecture
247
P4M-2 A Linear CMUT Air-Coupled Array For NDE Based on MUMPS
248
P4M-3 Experimental Characterization of Capacitive Micromachined Ultrasonic Transducers
249
P4M-4 Cross-Coupling in Sealed cMUT Arrays for Immersion Applications
250
P4M-5 Accurate Assessment of CMUT Devices Through Precise Electrical Impedance Measurement in Air
251
P4M-6 A Low Noise Capacitive Feedback Analog Front-End for CMUTs in Intra Vascular Ultrasound Imaging
252
P4M-7 Front-End IC Design for 2D cMUT Arrays: Modeling and Experimental Verification
253
P4M-8 Interaction Between a cMUT Cell and a Liquid Medium around the Parallel Resonance Frequency
254
P4M-9 Reduction of Crosstalk in CMUT Arrays by Introducing Double Periodicities
255
p4p application research oriented on multi-download service
256
P4P Pastry: A novel P4P-based Pastry routing algorithm in peer to peer network
257
P4-SimSaaS: Policy specification for multi-tendency simulation Software-as-a-Service model
258
P4Well concept to empower self-management of psychophysiological wellbeing and load recovery
259
p53-Induced ROS-accumulation induces programmed cell death in C6 glioma cells
260
p53-Mdm2 core regulation revealed by a mathematical model
261
p53-Mdm2 loop controlled by a balance of its feedback strength and effective dampening using ATM and delayed feedback
262
P5A-1 A Method for Improved Standardization of In Vivo Calcaneal Time-Domain Speed-of-Sound Measurements
263
P5A-10 Assessment of Human Jawbone Using Ultrasonic Guided Wave: In Vitro Study
264
P5A-2 An Experimental Study on the Ultrasonic Wave Propagation and Structural Anisotropy in Bovine Cancellous Bone
265
P5A-4 Broadband Ultrasonic Attenuation in Femoral Bovine Cortical Bone is an Indicator of Bone Properties
266
P5A-5 Dependence of Both Slow and Fast Wave Mode Properties on Bone Volume Fraction and Structural Anisotropy in Human Trabecular Bone: A 3D Simulation Study
267
P5A-8 Spatial Distribution of Acoustic Impedance and Microstructure Assessed by Scanning Acoustic Microscopy in Human Radial Cortical Bone
268
P5A-9 Depth Dependent High Frequency Backscatter Analysis of Degenerated Cartilage
269
P5B-1 A Fast Method for Data Acquisition in Contrast Replenishment Analyses
270
P5B-10 Single Microbubble Acoustics with Signal Processing: Initial Experience with Amplitude Modulated Pulse Sequences
271
P5B-11 Monitoring Device of Au Nano-Particle Distribution in Living Body Using Ultrasonic Velocity Change Image
272
P5B-12 How Do Conservation Laws Define a Motion Suppression Score in In-Vivo Ivus Sequences?
273
P5B-13 Improved Ultrasound Contrast Agent Detection in a Clinical Setting
274
P5B-2 Imaging Microbubble Destruction/Replenishment with Nakagami Distribution
275
P5B-3 Frame Accumulation Method with Motion Compensation for High-Contrast Vascular Imaging in Artery Phase
276
P5B-4 Optimization of Chirp Reversal for Ultrasound Contrast Imaging
277
P5B-5 Echogenic Liposomes in High-Frequency Ultrasound Imaging
278
P5B-6 In Vitro Pressure Estimation Obtained from Subharmonic Contrast Microbubble Signals
279
P5B-7 Design of Quadratic Filters for Contrast-Assisted Ultrasonic Imaging
280
P5B-8 Self-Trapping of Microbubbles to Surface of Target
281
P5B-9 Investigation of the Response of Attached biSphere™ Microbubbles to Ultrasound
282
P5C-1 Real-Time Stereo 3D Ultrasound
283
P5C-2 A New Convolution-Based Methodology to Simulate Ultrasound Images in a 2D / 3D Sector Format
284
P5C-3 Field Simulation Parameters Design for Realistic Statistical Parameters of Radio - Frequency Ultrasound Images
285
P5C-4 Image Guidance Using Camera and Ultrasound Images
286
P5C-5 Design and Validation of an Ultrasound Array Optimised for Epidural Needle Guidance
287
P5C-6 Compact Ultrasound Scanner with Built-in Raw Data Acquisition Capabilities
288
P5D-1 Elasticity Estimation by Time-Reversal of Shear Waves
289
P5D-2 Propagation of Narrowband Shear Waves Induced by a Finite-Amplitude Radiation Force
290
P5D-4 Advances in Liver Stiffness Measurements Using Transient Elastography
291
P5D-5 Principal Component Analysis of Shear Strain Effects
292
P5D-6 Displacement Estimators Using Angular Insonifications for Reconstructive Elastography
293
P5E-1 Motion Analysis of the Surface Particle of a Coiled Waveguide Due to the Flexural Wave
294
P5E-2 Response of Thermoacoustic Waves in Stressed Thin Plates
295
P5E-3 Study on the Surface Wave Propagation in the Diamond Coated Silicon
296
P5E-4 3D Transient Analysis of Ultrasound Propagation Using Finite Difference Time Domain Method and Its Experimental Verification
297
P5E-5 On the Propagation in a Waveguide with Gaussian Section Variation: Inverse Problem to Determine the Hiding Waveguide Profile and Separation of Converted Modes Contributions in the Case of Multi-Incident Modes, Experimental and Numerical Studies
298
P5E-7 Multi Resonances of the S0 Adiabatic Mode Propagating in a Linearly Varying Cross Section Waveguide, Experimental and Numerical Results
299
P5E-8 The Method of Reverberation-Ray Matrix - A New Matrix Analysis of Waves in Piezoelectric Laminates
300
P5E-9 A Fast Field Simulation Method for Longitudinal Ultrasound Wave Propagation and Transmission in Homogeneous and Layered Media
301
P5F-1 Recognition of Layer-Structured Optical Labels Using Collinear Acoustooptic Processor without Time Gating for Photonic Routing
302
P5F-2 Improved Fiber Optic Hydrophone Sensors
303
P5F-3 Light Diffraction by IDT-Radiated Bulk Acoustic Waves in ZX-LiNbO3
304
P5G-1 Optimization of a Single Phase Ultrasonic Linear Motor
305
P5G-2 Acoustic Surface Wave Induced Propagation of Liquids in Open Channels
306
P5G-6 A Multi-DOF Ultrasonic Motor Using In-Plane Deformation of PZT Elements
307
P5H-1 Hybrid Finite Element Analysis of Leakey Surface Acoustic Waves in Periodic Waveguides of Finite Thickness
308
P5H-2 Novel SAW Network Model Parameter Extraction Technique
309
P5H-3 A COM Analysis of SAW Tags Operating at Harmonic Frequencies
310
P5H-4 COM Parameters of Langasite Crystal
311
P5I-1 Multiple States Switching Operation of AlGaN /GaN Layer Mode Device
312
P5I-2 Lower-Loss Filters on Langasite
313
P5I-3 Improvement of Balance Performance in LSAW Filters Based on 5-IDT Multi-Mode Structure
314
P5I-4 Diamond Saw Resonators With SiO2/ZnO/IDT/ZnO/Diamond Structure
315
P5J-1 Dual-Layer Transducer Array for 3-D Imaging
316
P5J-2 Ultrasound Probe with Integrated ECG Lead
317
P5J-3 Design of a Piezocomposite Matrix Transducer Configuration for Multi-Mode Operation in HIFU Applications
318
P5J-4 256x256 2-D Array Transducer with Row-Column Addressing for 3-D Imaging
319
P5J-5 Direct Attach of Planar-Based and Ribbon-Based Cables to Ultrasound Imaging Arrays
320
P5K-1 High Temperature Broadband Contact BAW Transducer
321
P5K-2 Optimization and Characterization of RF Sputtered Piezoelectric Zinc Oxide Thin Film for Transducer Applications
322
P5K-3 Novel Thick Film Transducers for High Frequency Ultrasonography
323
P5K-4 High-Overtone Self-Focusing Acoustic Transducer for High Frequency Ultrasonic Imaging
324
P5K-5 Performance Estimation of Ultra-Miniature One Dimensional Array Ultrasound Probe with Hydrothermally Synthesized PZT Polycrystalline Film Transducers
325
P6 Binary Floating-Point Unit
326
P6A-1 Photoacoustic Imaging of Fibrosarcoma Using RGD-Cy 3 as a Targeted Contrast Agent
327
P6A-4 A Co-Axial Scanning Acoustic and Photoacoustic Microscope
328
P6A-5 Real-Time Optoacoustic Imaging Using Near Infrared Absorbing Gold Nanoshells For Contrast Enhancement
329
P6B-1 Error Analysis of Autocorrelation-Based Velocity Vector Estimation in the Aperture Domain
330
P6B-10 Improved Investigation of Maternal/Fetal/Placental Vessels through Multigate Spectral Doppler
331
P6B-11 How Fat Layers Affect the Clinical Diagnosis from Doppler Data
332
P6B-12 Blood Velocity Estimation Based On 3D Spatiotemporal Filtering of Sequences of Ultrasound Images
333
P6B-13 In Vivo Blood Flow Imaging of Achilles Tendon in Mice with High Frequency Ultrasound
334
P6B-14 A 3D Ultrasound System for Image Guided Modeling of Patient-Specific Artery Geometries
335
P6B-2 Quantitative Assessment of Flow Velocity through Transverse Dual-Beam Analysis
336
P6B-3 In Vivo Investigation of Filter Order Influence in Eigen-Based Clutter Filtering for Color Flow Imaging
337
P6B-4 Multi-Dimensional Spectrum Analysis for 2-D Vector Velocity Estimation
338
P6B-5 In Vivo Vector Flow Imaging Using Improved Directional Beamforming
339
P6B-7 The Initial Doppler Blood Flow Measurement Using an Implantable CMUT Array
340
P6B-8 Utility of Template-based Filtering Methods to Improve Accuracy of Echo PIV for Multi-Component Blood Velocity Measurements
341
P6B-9 Clutter Suppression in Doppler Ultrasound Using Wiener Filtering
342
P6C-10 Evaluation of the Structure Factor Size Estimator (SFSE) with Simulated Ultrasonic Backscattered Signals from Blood
343
P6C-11 In Vitro Study of Frequency-Dependent Blood Echogenicity Under Pulsatile Flow
344
P6C-12 Angular Dependence of Ultrasonic Echo from Surface with Minute Roughness
345
P6C-13 High Frequency Ultrasonic Characterization of Human Vocal Fold Tissue
346
P6C-2 Image Texture Clustering for Prostate Ultrasound Diagnosis
347
P6C-3 Quantitative Ultrasonography Of Choroidal Melanoma Following Proton-Beam Radiotherapy
348
P6C-4 Extended System Transfer Compensation for Parametric Imaging in Ultrasonic Response Assessment of Anti-Cancer Therapies
349
P6C-5 Information Theoretic Design of Breast Sonography
350
P6C-6 Breast Ultrasound Computer-Aided Diagnosis Using Both Acoustic and Image Features
351
P6C-7 Ultrasound RF Time Series for Detection of Prostate Cancer: Feature Selection and Frame Rate Analysis
352
P6C-8 Correcting for Focusing when Estimating Attenuation for Tissue Characterization Based on Gaussian Approximations of the Beam Profile
353
P6C-9 An Ultrasound Phantom with Long-Term Stability Using a New Biomimic Soft Gel Material
354
P6D-1 3D/4D Ultrasound Registration of Bone
355
P6D-2 Ultrasound Bone Segmentation Using Dynamic Programming
356
P6D-3 3-D Ultrasound Guidance of Surgical Robotics: Autonomous Guidance and Catheter Transducers
357
P6D-4 Analysis of Ultrasound Images Based on Local Statistics. Application to the Diagnosis of Developmental Dysplasia of the Hip
358
P6D-5 Enhancement of Bone Surface Visualization Using Ultrasound Radio-Frequency Signals
359
P6E-1 Optimization Methodology for Piezoelectric Transformers Design
360
P6E-3 Surface Acoustic Wave Linear Motor Using Segment-Structured Diamond-Like Carbon Films on Contact Surface
361
P6E-4 Glass Substrate Surface Acoustic Wave Linear Motor
362
P6E-5 Analysis of PZT Layer Thickness in Traveling Wave Ultrasonic Motor Performance
363
P6E-8 A Study on the New Type Linear Ultrasonic Motor (LUSM)
364
P6F-2 Piezoelectric Generator as Power Supply for RFID-Tags and Applications
365
P6F-3 A Study on the Wedge-Shaped Piezoelectric Transformer (WSPT)
366
P6F-4 A Theoretical Time-Course Study of Acoustic Tweezers
367
P6G-1 Building Block Concept in Quasi-Slanted SPUDT Synthesis Method
368
P6G-2 Synthesis of Frequency Response for Wideband SAW Ladder Type Filters
369
P6G-3 Switchable SAW Filter Bank with Both Narrow & Wide Channel Bandwidth and 10 Channels SAW Filter Bank
370
P6G-4 High Q-factor STW-Resonators on AT-Cut of Quartz
371
P6H-1 Electrochemical Etching of Quartz
372
P6H-10 High Piezoelectric Responses in P(VDF HFP) Copolymers for Sensors and Transducers
373
P6H-6 Lead-Free Piezoelectric Ceramics for High-Frequency Ultrasound Transducers
374
P6H-7 Investigation of Morphotropic Phase Boundary PbTiO3-Bi(MgZr)O3 Based Complex Perovskite Ceramics
375
P6H-8 Design of a Bulk-Micromachined Piezoelectric Accelerometer
376
P6H-9 Discerning the Quality of ZnO Films from Their Etch Properties
377
p88110: A Graphical Simulator for Computer Architecture and Organization Courses
378
P959 I/O Expansion Bus Proposed Standard
379
PA 6/EPDM blends for electrical insulations. Preliminary characterization
380
PA calibration in TDMA antenna arrays
381
PA linearization using multi-stage look-up-table predistorter with optimal linear weighted delay
382
PA Symposium 2010
383
Pa.-Ohio-West Va. interconnection
384
p¿n junction diodes as millimetre-wave detectors
385
Pa2Pa: Patient to patient communication for emergency response support
386
PA46 NYLON The driving material for E-motors
387
PA7200: a PA-RISC processor with integrated high performance MP bus interface
388
PA7300LC integrates cache for cost/performance
389
PA-8000: a case study of static and dynamic branch prediction
390
PAAG
391
PAAG: A Polymorphic Array Architecture for Graphics and Image Processing
392
PAAKL: Password Authentication Using Behavioral Metrics
393
PAALS: precision accelerometer alignment and leveling system
394
PAAR: A routing protocol for context-aware services in wireless sensor-actuator networks
395
PaaS Characteristics for Productive Software Development: An Evaluation Framework
396
PaaS Mode in Network Game Advertising
397
PaaS on IaaS
398
PAAS: A Privacy-Preserving Attribute-Based Authentication System for eHealth Networks
399
PAAS: A Protocol-based Approach to Adaptive Service Composition
400
PaaS: A revolution for information technology platforms
401
PaaS: New Opportunities for Cloud Application Development
402
PAAS: Power Aware Algorithm for Scheduling in High Performance Computing
403
PaaS-Independent Approach to Provision Appropriate Cloud Resources for SCA-based Applications Deployment
404
PaaS-Independent Provisioning and Management of Applications in the Cloud
405
PaaS-Oriented Performance Modeling for Cloud Computing
406
PaaS-Platform for Mobile Health
407
PAAVE: Protocol for Anonymous Authentication in Vehicular Networks Using Smart Cards
408
PAB: Parallelism-Aware Buffer Management Scheme for Nand-Based SSDs
409
PABADIS - an agent based flexible manufacturing concept
410
PABAM: A Physics-Based Analytical Model to Estimate Bipolar Amplification Effect Induced Collected Charge at Circuit Level
411
Pabble: Parameterised Scribble for Parallel Programming
412
PABC: Power-Aware Buffer Cache Management for Low Power Consumption
413
PABEM: A new power-aware adaptive bus encoding method using Huffman algorithm
414
PABIRS: A data access middleware for distributed file systems
415
PABLO vs. Double-Poly - A Comparison of Two High-Performance Bipolar Technologies
416
PABRE: Pattern-based Requirements Elicitation
417
PABRE-Man: Management of a requirement patterns catalogue
418
PABRE-Proj: Applying patterns in requirements elicitation
419
PABTEC: Passivity-Preserving Balanced Truncation for Electrical Circuits
420
PABX: the epitome of ´interconnection´
421
PAC - a novel approach for clustering mechanism in adhoc network
422
PAC 2005 Grounding of SNS Accelerator Structure
423
PAC bounds for simulation-based optimization of Markov decision processes
424
PAC coding for real-time video transmission over mobile radio environment
425
PAC DSP Core and Application Processors
426
PAC DSP Core and Its Applications
427
PAC Duo SoC performance analysis with ESL design methodology
428
PAC duo system power estimation at ESL
429
PAC learnability versus VC dimension: A footnote to a basic result of statistical learning
430
PAC learning for Markov decision processes and dynamic games
431
PAC learning with generalized samples and an applicaiton to stochastic geometry
432
PAC learning with irrelevant attributes
433
PAC nearest neighbor queries: Approximate and controlled search in high-dimensional and metric spaces
434
PAC vs. MAC for Decentralized Detection Using Noncoherent Modulation
435
PAC: Pattern-driven Application Consolidation for Efficient Cloud Computing
436
PAC: perceptive admission control for mobile wireless networks
437
PAC: Program Analysis for Approximation-aware Compilation
438
PAC: Taming TCP Incast Congestion Using Proactive ACK Control
439
PAC=PAExact and other equivalent models in learning
440
PACALL: Supporting Language Learning Using SenseCam
441
PACAO: A protocol architecture for cloud access optimization in distributed data center fabrics
442
PAC-Bayes Analysis for Twin Support Vector Machines
443
PAC-Bayesian approach for minimization of phoneme error rate
444
PAC-Bayesian Inequalities for Martingales
445
PAC-Bayesian learning with asymmetric cost (June 2011)
446
PaCC: A Parallel Compare and Compress Codec for Area Reduction in Nonvolatile Processors
447
PACCI: a high-performance MAC protocol for client-server-based gigabit LANs and MANs
448
Pacco-a new approach for an effective IP environment
449
P-Accountable Networked Systems
450
PACCS 2010 volume 1 content
451
PACCS 2010 volume 2 content
452
Pace conference report: Early involvement in professional issues will net you positive results
453
Pace independent mobile gait biometrics
454
Pace of change - Product development: success through product and cycletime excellence
455
Pace of tower shadow fluctuations in a wind farm
456
Pace the heartbeat by double-heartbeat-frequency sound wave
457
Pace University [advertisement]
458
Pace University [advertisement]
459
PACE your network: Fair and controllable multi-tenant data center networks
460
PACE, a dry etch, ultra-high speed, precision machining and polishing process for micro/macroscopic features w/o subsurface damage
461
PACE: a dynamic programming algorithm for hardware/software partitioning
462
PACE: a floor control system for just-in-time manufacturing
463
PACE: a new approach to dynamic voltage scaling
464
PACE: a parallel VLSI extractor on the Intel hypercube multiprocessor
465
PACE: a planning advisor on curriculum and enrolment
466
PACE: a regular array for implementing regularly and irregularly structured algorithms
467
PACE: an architectural style for trust management in decentralized applications
468
PACE: an autofocus algorithm for SAR
469
PACE: Augmenting Personal Mobile Devices with Scalable Computing
470
PACE: Pattern Accurate Computationally Efficient Bootstrapping for Timely Discovery of Cyber-security Concepts
471
PACE: Policy-Aware Application Cloud Embedding
472
PACE: Simple multi-hop scheduling for single-radio 802.11-based Stub Wireless Mesh Networks
473
PACE: Who Benefits?
474
PACE2: an improved parallel VLSI extractor with parameter extraction
475
PACE3: a large dynamic range analog memory front-end ASIC assembly for the charge readout of silicon sensors
476
Paced breathing controller using LabView
477
Paced ECG analysis based on neural networks
478
Paced TCP: A Dynamic Bandwidth Probe TCP with Pacing in AD HOC Networks
479
Paceline: Improving Single-Thread Performance in Nanoscale CMPs through Core Overclocking
480
PACELP: a high quality and low complexity scheme for narrow band coding of speech
481
Pacemaker Exposure to High-Power Microwave Ultrawideband Radiation
482
Pacemaker Identification Code
483
Pacemaker interference and low-frequency electric induction in humans by external fields and electrodes
484
Pacemaker interference by 60-Hz contact currents
485
Pacemaker interference by magnetic fields at power line frequencies
486
Pacemaker leads place optimization based on vectorcardiography signal processing
487
Pacemaker Power Sources
488
Pacemaker registration by E-mail
489
Pacemaker reliability: design to explant
490
Pacemaker Sensing During Atrial Fibrillation
491
Pacemaker
TM
OC-48 traffic management engine demo
492
Pacemakers & defibrillators
493
Pacemakers and Implantable Cardiac Defibrillators: Software Radio Attacks and Zero-Power Defenses
494
Pacemakers in Veterinary Medicine
495
Pacemaking: A Pulsing Industry
496
PACER (Phased Array Concepts Evaluation Rig): design, development and adaptive beamforming experiments
497
Pacer Comet 4: Next Generation Automated Testing of Gas Turbine Engines
498
Pacer: A Microprocessor-Based Process Control*
499
Pacer: A Progress Management System for Live Virtual Machine Migration in Cloud Computing
500
PaCGEN: Automatic system for critical path selection based on multiple parameters
501
PACH: Ploidy-AgnostiC Haplotyping
502
Pachinko biology: Gambling on single cells
503
Pacific annual meeting is slated for August 26 - 29 in Spokane, Wash.
504
Pacific Bell´s ISDN experiences
505
Pacific Bell´s network and systems concept of the 90s
506
Pacific Coast A. I. E. E. Convention, Vancouver, B. C., September 9–11, 1912
507
Pacific Coast Convention
508
Pacific Coast convention
509
Pacific Coast Convention
510
Pacific Coast convention
511
Pacific Coast convention
512
Pacific Coast convention
513
Pacific Coast convention
514
Pacific Coast convention
515
Pacific Coast Convention
516
Pacific Coast convention
517
Pacific Coast convention
518
Pacific Coast Convention
519
Pacific Coast convention
520
Pacific Coast Convention
521
Pacific Coast convention
522
Pacific Coast Convention
523
Pacific Coast Convention
524
Pacific coast convention
525
Pacific Coast convention at Portland, Oregon, September 2–5, 1930
526
Pacific Coast convention at Seattle September 15
527
Pacific Coast convention change of date
528
Pacific Coast convention dates selected
529
Pacific Coast convention papers deal with live problems
530
Pacific Coast convention plans
531
Pacific Coast convention postponed
532
Pacific Coast convention program will stress power for war
533
Pacific Coast convention to be held in Salt Lake City, Sept. 6–10
534
Pacific coast convention to be held in Seattle, September 15th
535
Pacific Coast convention to have session with IRE
536
Pacific Coast convention, August 28–31, 1928: Has diversified program
537
Pacific Coast convention, Del Monte, Calif., Sept. 13–16
538
Pacific Coast convention, Del Monte, California, September 13–16, 1927
539
Pacific Coast convention, Portland, Oregon September 2–5
540
Pacific coast convention, Salt Lake City
541
Pacific Coast convention, San Francisco May 5, 6 and 7, 1910
542
Pacific Coast Convention, Seattle, September 5–9, 1916
543
Pacific Coast convention, Spokane, Wash., September 9–11, 1914
544
Pacific Coast convention, Spokane, Wash., September 9–11, 1914
545
Pacific Coast convention, Vancouver
546
Pacific Coast convention, Vancouver, B. C., September 9–11, 1913
547
Pacific Coast convention, Vancouver, B. C., September 9–11, 1913
548
Pacific Coast convention. Spokane, Wash.
549
Pacific Coast convention: Splendid technical program and engrossing entertainment with an opportunity to see then orthwest
550
Pacific Coast meeting at Portland
551
Pacific Coast meeting Los Angeles, Cal., April 2528, 1911
552
Pacific Coast meeting, Portland, Ore., April 16–20, 1912
553
Pacific coast program nearing completion
554
Pacific Coast trip
555
Pacific computer communication Symposium, 22-24 October 1985, Seoul, Republic of Korea
556
Pacific Computer Conference at Caltech attended by 460 registrants
557
Pacific general meeting brings engineering achievements to fore
558
Pacific general meeting establishes record attendance in San Francisco
559
Pacific general meeting plans are near completion
560
Pacific general meeting program treats problems of the Southwest
561
Pacific General Meeting scheduled for August 15-18 in Butte, Mont.
562
Pacific general meeting sessions to stress power, forest product industries
563
Pacific general meeting sets attendance record at San Diego
564
Pacific general meeting to be held August 22–25, 1961, in Salt Lake City, Utah
565
Pacific general meeting, Pasco, Wash., August 28–30, 1957 tentative technical program
566
Pacific Graphics ´97 [front matter]
567
Pacific H.V.D.C. intertie inaugurated
568
Pacific HVDC intertie
569
Pacific HVDC Intertie System AC Side Harmonic Studies
570
Pacific Intertie Tests
571
Pacific Medical Network Project-pushing the edge of the envelope in information interoperability
572
Pacific meeting emphasizes industrial growth and development of the Northwest
573
Pacific meeting session stresses electrical techniques in cardiology
574
Pacific Northwest 1952 power shortage
575
Pacific Northwest 1952 Power Shortage [includes discussion]
576
Pacific northwest distinguished lecture - 100 years of inertial navigation
577
Pacific Northwest regional newborn screening: a paradigm of prevention
578
Pacific Northwest-politics trumps technology [electric utility history]
579
Pacific Rim TransTech Conference. 1995 Pacific Rim TransTech Conference Proceedings. A Ride into the Future [front matter]
580
Pacific Rim TransTech Conference. 1995 Vehicle Navigation and Information Systems Conference Proceedings. 6th International VNIS. A Ride into the Future [front matter]
581
Pacific Sierra´s VAST-HPF and VAST/77toHPF
582
Pacific Telesis´ plans for implementation of the intelligent network
583
Pacific-Coast Convention
584
PacifiCorp´s Application of IEEE 1453
585
PacifiCorp´s development and use of enhanced reliability analysis tools
586
PacifiCorp´s Perspective on Using IEEE 519
587
Pacifier: High-Throughput, Reliable Multicast Without “Crying Babies” in Wireless Mesh Networks
588
Pacifier: High-Throughput, Reliable Multicast without ``Crying Babies´´ in Wireless Mesh Networks
589
Pacifier: Record and replay for relaxed-consistency multiprocessors with distributed directory protocol
590
PACIIA 2008 Committee Members - Volume 1
591
PACIIA 2008 Committee Members - Volume 2
592
PACIIA 2008 Organizing Committee - Volume 1
593
PACIIA 2008 Organizing Committee - Volume 2
594
Pacing and sensing performance of fractally coated leads
595
Pacing lead/myocardium interface: modelling and characterization of the impedance
596
Pacing Real-Time Spatiotemporal Control of Cardiac Alternans
597
Pacing-induced multiple wave reentry
598
Pack ice stress and convergence measurements by satellite-tracked ice beacons
599
Pack instruction generation for media pUsing multi-valued decision diagram
600
Pack Set and the Effect on Pneumatic Conveying of Cement
601
Pack Sizing and Reconfiguration for Management of Large-Scale Batteries
602
Pack Up Cloud: Recursive Datacenter Resource Management and Experimental Studies
603
Pack up your troubles
604
Pack up your troubles
605
Pack your own parachute - Individual ownership and responsibility of safety principles
606
PACK/UNPACK on coarse-grained distributed memory parallel machines
607
PACK: Prediction-Based Cloud Bandwidth and Cost Reduction System
608
Package Alternatives for Integrated Power Electronic Modules (IPEM) with Improved Voltage Rating
609
Package and chip design optimization for mid-frequency power distribution decoupling
610
Package and chip-level EMI/EMC structure design, modeling and simulation
611
Package and interconnect modeling of the HFA3624, a 2.4 GHz RF to IF converter
612
Package and PCB effects on linearity of a micromixer-based W-CDMA upconverter
613
Package architecture and component design for an implanted neural stimulator with closed loop control
614
Package architecture design and optimization tool AUDiT: Version 4.2 for inhomogeneous systems
615
Package autoclave delamination study by substrate design improvement
616
Package autoclave delamination study by substrate design improvement
617
Package Boosting for Readaption of Cascaded Classifiers
618
Package capacitors impact on microprocessor maximum operating frequency
619
Package characterization and development of a flip chip QFN package: fcMLF
620
Package characterization of FET-based biochemical sensors
621
Package characterization of UTAC´s Grid Array package (GQFN) and performance comparison over standard laminate packages
622
Package characterization on advanced NBA-QFN structure
623
Package Characterization: Simulations or Measurements?
624
Package clock distribution design optimization for high-speed and low-power VLSIs
625
Package cohesion classification
626
Package cooling designs for a dual-chip electronic package with one high power chip
627
Package crack resolution through low stress dambar punch design: A six sigma DMAIC approach
628
Package cracking in plastic surface mount components as a function of package moisture content and geometry
629
Package Deformation And Cracking Mechanism Due To Reflow Soldering
630
Package delamination as indicator of ball bond lift: New diagnostic methodology
631
Package delivery company web-based supporting system with usage of Java EE technology
632
Package demonstration of an interposer with integrated TSVs and flexible compliant interconnects
633
Package Design Advisor-mechanical, electrical and thermal analysis in one CAD tool
634
Package design and material impact on board level reliability of fine pitch packages
635
Package design and materials selection optimization for overmolded flip chip packaging
636
Package design and measurement of 10 Gbps laser diode on high-speed silicon optical bench
637
Package design for a microwave laser driver
638
Package design for alleviating stress in materials embedded with electronic systems
639
Package design for high performance ICs
640
Package design for high-speed low-cost ASIC LSIs
641
Package design for high-speed SerDes
642
Package design methodology in consideration with signal integrity, power integrity and electromagnetic immunity
643
Package design of pressure sensors for high volume consumer applications
644
Package design optimization and materials selection for stack die BGA package
645
Package design optimization for efficient on-chip-capacitance leveraging
646
Package Design Optimization for Electrical Performance of a Power Module using Finite Element Analysis
647
Package Development for MEMS Based 3D Micro-Mirror Optical Bio-Probe for OCT Application
648
Package Effects Caused by Leaky Modes at Higher Frequencies in Microwave Integrated Circuits
649
Package effects on avalanche rating of power MOSFETs
650
Package electrical specifications for giga bit signaling I/Os
651
Package embedded decoupling capacitor impact on core power delivery network for ARM SoC application
652
Package embedded heat exchanger for stacked multi-chip module
653
Package embedded inductors for integrated voltage regulators
654
Package fatigue reliability of the stacked chip BGA evaluated by optimal equivalent solder
655
Package geometric aware thermal analysis by infrared-radiation thermal images
656
Package heat dissipation with integrated carbon nanotube micro heat sink
657
Package Hermeticity
658
Package hermeticity testing with thermal transient measurements
659
Package improvements and testing of a novel MEMS bionic vector hydrophone
660
Package induced low-k delaminations: Numerical developments and experimental investigations to address FEBE compatibility fracture phenomena.
661
Package induced stress impact on transistor performance for ultra-thin SoC
662
Package inductance characterization at high frequencies
663
Package inductance measurement at high frequencies
664
Package influence on the simulated performance of 1.2 kV SiC modules
665
Package Insert Leaflet Analysis and Improvement to Reduce Patient Risk Factors: A Pharmacovigilance Approach in Computer Science
666
Package level failure analysis: New techniques and new instruments for better results
667
Package level integration of a monolithic buck converter power IC and bondwire magnetics
668
Package level metrics for reusability in aspect oriented systems
669
Package Level Simulation and Verification of Microsystems
670
Package macromodeling via time-domain vector fitting
671
Package Management Systems
672
Package market segments and design challenges
673
Package measurement methodology using a surface mount jig
674
Package Media for IMAC
675
Package model extraction from multi-port S-parameters
676
Package Model for Efficient Simulation, Design, and Characterization of High Performance Electronic Systems
677
Package model synthesis
678
Package of iterative solvers for the Fujitsu VPP500 parallel supercomputer
679
Package of procedures for the decision of optimization tasks by the method of branches and borders
680
Package of VME pressure sensors
681
Package on package DDR Power Integrity Design
682
Package on Package SMT rework technology
683
Package on Package warpage - impact on surface mount yields and board level reliability
684
Package optimization of a stacked die flip chip based test package
685
Package Optimization of the Cilium-Type MEMS Bionic Vector Hydrophone
686
Package Parasitic Inductance Extraction and Simulation Model Development for the High-Voltage Cascode GaN HEMT
687
Package patterns for visual architecture recovery
688
Package Performance Improvement with Counter-Discontinuity and its Effective Bandwidth
689
Package plane model validation using test chip, test package, and test board
690
Package Reference Fingerprint: a Rich and Compact Visualization to Understand Package Relationships
691
Package related reliability investigation with a multi-sensor chip
692
Package reliability and performance trends in an era of product integration
693
Package reliability related to die surface passivation: Characterization through TOF-SIMS analysis and package stressing
694
Package requirements for high performance VLSI CMOS chips
695
Package routability- and IR-drop-aware finger/pad assignment in chip-package co-design
696
Package routing algorithms in mobile ad-hoc wireless networks
697
Package Routing and Thermal Analysis on a Multi-Chip Package (MCP)
698
Package service flow applications in GRID-system using genetic algorithm
699
Package size and epoxy mass effects on package hermeticity requirements
700
Package size effects on the gains of patch antennas and finite patch arrays
701
Package Size Reduction & Solder Joint Reliability for High Density Semiconductor Packaging
702
Package solution of indirectly-heated type thermoelectric power sensors for RF application
703
Package stacking in SMT for 3D PCB assembly
704
Package stress monitor to compensate for the piezo-hall effect in CMOS Hall sensors
705
Package Stress Monitor to Compensate for the Piezo-Hall Effect in CMOS Hall Sensors
706
Package structural integrity analysis considering moisture
707
Package structure interaction induced molding issues in MCM packages
708
Package Substation System Type ENK with SF6 Insulation
709
Package Substation System Type Enk with SF6 Insulation
710
Package substrate built-in three-dimensional distributed matching circuit for high-speed SerDes applications
711
Package Surface Blueprints: Visually Supporting the Understanding of Package Relationships
712
Package switching noise evaluation using boundary scan circuitry
713
Package technology evaluation and optimization for high-speed applications
714
Package technology for STM-16 optical Tx/Rx and IC´s
715
Package test interface fixture considering low cost solution, high electrical performance, and compatibility with fine pitch packages
716
Package thermal resistance model dependency on equipment design
717
Package thermal resistance model: dependency on equipment design
718
Package thermal resistance: geometrical effects in conventional and hybrid packages
719
Package to board interconnect design for minimum return loss
720
Package to board interconnection shear strength (PBISS) behavior at high strain rates approaching mechanical drop
721
Package to board interconnection shear strength (PBISS): effect of surface finish, PWB build-up layer and chip scale package structure
722
Package to board interconnection shear strength (PBISS): effect of surface finish, PWR build-up layer and chip scale package structure
723
Package unit integration for process industry — A new description approach
724
Package W2CWM2C: Description, Features, and Applications
725
Package warpage challenges for LQFP 144 lead CMOS 90 device and it´s impact to lead coplanarity
726
Package warpage evaluation for high performance PQFP
727
Package warpage evaluation for multi-layer molded PQFP
728
Package yield enhancement using machine learning in semiconductor manufacturing
729
Package–on–Package – Review on a Promising Packaging Technology
730
Package-antenna for wireless sensor network nodes
731
Package-Aware Scheduling of embedded workloads for temperature and Energy management on heterogeneous MPSoCs
732
Package-based software development
733
Package-chip co-design to increase flip-chip C4 reliability
734
Packaged 1.5-
m Quantum-Well SOA With 0.8-W Output Power and 5.5-dB Noise Figure
735
Packaged 1.55 μm DFB laser with 25 GHz modulation bandwidth
736
Packaged 10.6 micron heterodyne 1-GHz bandwidth receiver
737
Packaged 10.6-micron heterodyne 1 GHz bandwidth receiver
738
Packaged 2*2 array of InGaAs/InP multiple quantum well modulators grown by double-sided epitaxy
739
Packaged 30 Gbit/s data demultiplexing and clock extraction IC fabricated in a AlGaAs/GaAs HBT technology
740
Packaged 7 mW, 1.2 GHz dynamic 60/61 GaAs prescaler
741
Packaged 850 nm vertical-cavity surface-emitting lasers as low-cost optical sources for transparent fibre-optic links
742
Packaged 850 nm vertical-cavity surface-emitting lasers as low-cost optical sources for transparent fibre-optic links
743
Packaged AlGaAs waveguide modulator array at 830 nm wavelength
744
Packaged and hybrid integrated all-optical flip-flop memory
745
Packaged antenna solution for the Radio front end @ 60 GHz based on a dielectric resonator
746
Packaged array of eight MSM photodetectors with uniform 12 GHz bandwidth
747
Packaged BiCMOS embedded RF-MEMS switches with integrated inductive loads
748
Packaged clock recovery integrated circuits for 40 Gbit/s optical communication links
749
Packaged Diamond-Shaped Ring-Laser-Diode Switch
750
Packaged double-pass travelling-wave semiconductor laser amplifiers
751
Packaged DRG of continuous oscillations of increased power of frequency range 30–100 GHz
752
Packaged Electronically Tunable S-Band Traveling-Wave Maser System
753
Packaged frequency-stable tunable 20 kHz linewidth 1.5 μm InGaAsP external cavity laser
754
Packaged heat pumps and their application in high street shops
755
Packaged high gain unidirectional 1300 nm MQW laser amplifiers
756
Packaged hybrid III-V/silicon SOA
757
Packaged hybrid integrated phased-array multi-wavelength laser
758
Packaged hybrid Si-IPD™ antenna for 60 GHz applications
759
Packaged hybrid soliton pulse source results 70 terabit.km/sec soliton transmission
760
Packaged hybrid soliton pulse source results and 270 terabit.km/sec soliton transmission using sliding-frequency guiding filters
761
Packaged instruments
762
Packaged integrated SPDC photon pair source with polarisation splitter
763
Packaged integrated transceiver for short-range high data-rate communications at 60 GHz
764
Packaged MEMS micromirrors for cryogenic environment
765
Packaged MEMS tunable resonators
766
Packaged micromechanical sensors
767
Packaged microstrip triplexer with star-junction topology
768
Packaged Millimeter Wave Thermal MEMS Switches
769
Packaged mode multiplexer based on silicon photonics
770
Packaged Monolithic Silicon 112-Gb/s Coherent Receiver
771
Packaged Optical Sensors Based on Regenerated Fiber Bragg Gratings for High Temperature Applications
772
Packaged optical sensors for the electric field characterization in harsh environments
773
Packaged PHASAR-based wavelength demultiplexer with integrated detectors
774
Packaged photonic probes for an on-wafer broad-band millimeter-wave network analyzer
775
Packaged polarization-insensitive WDM monitor with low loss (7.3 dB) and wide tuning range (4.5 nm)
776
Packaged printed transmission lines: modal phenomena and relation to leakage
777
Packaged Q band medium power amplifier
778
Packaged semiconductor laser optical phase-locked loop (OPLL) for photonic generation, processing and transmission of microwave signals
779
Packaged semiconductor lasers for optical-fiber transmission
780
Packaged single pole double thru (SPDT) and true time delay lines (TTDL) based on RF MEMS switches
781
Packaged single-ended CMOS low noise amplifier with 2.3 dB noise figure and 64 dBm IIP
2
782
Packaged Software Configuration through the Lens of Social Construction of Technology
783
Packaged Software Implementation Requirements Engineering by Small Software Enterprises
784
Packaged total-energy system
785
Packaged transceiver with on-chip integrated antenna and planar discrete lens for UWB millimeter-wave communications
786
Packaged Triplexer Based on Distributed Coupling Technique
787
Packaged Tunable Bandpass Filters Based on Varactor-Loaded Spiral Combline Topology
788
Packaged Tunable Combline Bandpass Filters
789
Packaged Tunable L-Band Maser System
790
Packaged Tunable Notch Filters
791
Packaged Ultra-Wide-Band Bandpass Filter Based on Inverted-T Multiple-Mode Resonators and Inverted-F Impedance Transformers [TC Contests]
792
Packaged Ultrawidebandfilter Competition [TC Contests]
793
Packaged wireless multisensor module embedded reinforced concrete for monitoring construction characteristics
794
Packaged X-band capacitive-coupled dual behavior resonator filter [Technical Committee]
795
Packaged X-band filter with optimized interconnects [Technical Committee]
796
Packaged, High-Power, Narrow-Linewidth Slab-Coupled Optical Waveguide External Cavity Laser (SCOWECL)
797
Packaged, Integrated 32 to 40 GHz Millimeter-Wave Up-Converter
798
Packaged, integrated DFB/EA-MOD for repeaterless transmission of 10 Gbit/s over 107 km standard fibre
799
Package-die co-optimization for improved performance and lower cost: A 32nm 10-core Xeon CPU case study
800
Package-induced temperature dependence of MEMS capacitive strain sensor and system design considerations
801
Package-Interposer-Package (PIP): A breakthrough Package-on-Package (PoP) technology for high end electronics
802
Packageless AlN/ZnO/Si Structure for SAW Devices Applications
803
Packageless SAW Devices with Isolated Layer Acoustic Waves (ILAW) and Waveguiding Layer Acoustic Waves (WLAW)
804
Packageless temperature sensor based on AlN/IDT/ZnO/Silicon layered structure
805
Package-level electromagnetic interference analysis
806
Package-level Implementation of Multiband Electromagnetic Band-Gap Structures
807
Package-level integrated antennas based on LTCC technology
808
Package-Level Integrated LTCC Antenna for RF Package Application
809
Package-level integration of LTCC antenna
810
Package-Level Microjet-Based Hotspot Cooling Solution for Microelectronic Devices
811
Package-level Si-based micro-jet impingement cooling solution with multiple drainage micro-trenches
812
Package-level thermal management of a 3D embedded wafer level package
813
Package-on-Package (PoP) for Advanced PCB Manufacturing Process
814
Package-on-Package (PoP) warpage characteristic and requirement
815
Package-on-Package Assembly Yield Assessment in the ODM/EMS Environment Using Monte Carlo Simulation
816
Package-on-package for chip cooling with embedded fluidics
817
Package-On-Package Mechanical Reliability Characterization
818
Package-on-package with very fine pitch interconnects for high bandwidth
819
Package-Oriented Programing of Engineering Tools
820
Package-oriented software engineering: a generic architecture
821
Package-Role Based Authorization Control Model for Wireless Network Services
822
Packages and Film Resistors for Hybrid Microcircuits
823
Packages for gate arrays and standard cells
824
Packages go vertical
825
Packages stacked to deal with SiP issues
826
Packages With Integrated 60-GHz Aperture-Coupled Patch Antennas
827
Package-Segment Model for movie retrieval system and adaptable applications
828
Package-silicon co-design-experiment with an SOC design
829
Package-strain-enhanced device and circuit performance
830
Package-to-board transition via parasitic effects on simultaneous switching noise
831
Packaging 1000 MIPS for IBM´s S/390 G5 server
832
Packaging a
-Band Integrated Module With an Optimized Flip-Chip Interconnect on an Organic Substrate
833
Packaging a 150-W bipolar ECL microprocessor
834
Packaging a 150-W bipolar ECL microprocessor
835
Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array
836
Packaging a fiber Bragg grating with metal coating for an athermal design
837
Packaging a fiber Bragg grating without preloading in a simple athermal bimaterial device
838
Packaging a piezoresistive pressure sensor for intracranial pressure monitoring
839
Packaging accuracy examination of the polarization-maintaining dual fiber collimator basing on machine sight
840
Packaging actomyosin-based biomolecular motor-driven devices for nanoactuator applications
841
Packaging alternatives for high lead count, fine pitch, surface mount technology
842
Packaging alternatives for high lead count, fine pitch, surface mount technology
843
Packaging alternatives to large silicon chips: tiled silicon on MCM and PWB substrates
844
Packaging an X-band microwave integrated circuit
845
Packaging an X-band microwave integrated circuit
846
Packaging and AC powering of LED array
847
Packaging and antenna design for wireless SAW temperature sensors in metallic environments
848
Packaging and assembly for integrated photonics - the ePIXpack photonics packaging service
849
Packaging and Assembly for Integrated Photonics—A Review of the ePIXpack Photonics Packaging Platform
850
Packaging and assembly of 12-channel parallel optical transceiver module
851
Packaging and Assembly of 3-D Silicon Stacked Module for Image Sensor Application
852
Packaging and board assembly technology trend and impact on the supply chain
853
Packaging and characterisation of ultra low power VCSEL for sensor networks
854
Packaging and characterization of GaAs MMIC C-band amplifier as per MIL-STD 883
855
Packaging and characterization of mechanically actuated microtweezers for biomedical applications
856
Packaging and characterization of silicon carbide thyristor power modules
857
Packaging and deployment strategies for synthetic aperture radar membrane antenna arrays
858
Packaging and disseminating lessons learned from COTS-based software development
859
Packaging and environmental stability of thermally controlled arrayed-waveguide grating multiplexer module with thermoelectric device
860
Packaging and environmental studies of copper clad tfe-glass stripline
861
Packaging and evaluation of an online tool for locating metal shrapnel during surgery
862
Packaging and Feedthrough Modes of Wafer Level for RF MEMS Switches
863
Packaging and integration of high-speed optical components
864
Packaging and integration technologies for future high frequency power supplies
865
Packaging and integration technologies for future high-frequency power supplies
866
Packaging and interconnect design and analysis using FDTD
867
Packaging and interconnect solutions for a low cost surface-mountable millimeter-wave radar sensor
868
Packaging and Interconnect Techniques for Complex Millimeter-Wave Front-Ends
869
Packaging and interconnect technologies for the development of GaN nanowire-based light emitting diodes
870
Packaging and interconnection mutual coupling effects in planar structures and discontinuities
871
Packaging and interconnection techniques for microsystems
872
Packaging and isolating microsphere coupling system
873
Packaging and manufacture of optical circuits for signal processing
874
Packaging and manufacturing trends for the server power supply
875
Packaging and metallisation effects of valley microstrip line with slit for use in very small multilayer MMICs
876
Packaging and metallisation effects of valley microstrip line with slit for use in very small multilayer MMICs
877
Packaging and microcooling of high power diode laser bars
878
Packaging and Microelectromechanical Systems (MEMS)
879
Packaging and MMIC Design for Low Cost MM-Wave Modules
880
Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays
881
Packaging and movement
882
Packaging and Non-Hermetic Encapsulation Technology for Flip Chip on Implantable MEMS Devices
883
Packaging and performance of 980nm broad area semiconductor lasers
884
Packaging and performance of an IGBT-based hybrid electric vehicle
885
Packaging and performance of an ultra-fast 1×4 optical switch
886
Packaging and performance of high power semiconductor lasers of high heat flux up to 2000 W/cm
2
887
Packaging and power distribution design considerations for a Sun Microsystems desktop workstation
888
Packaging and process optimization for three-dimensional structure unit of double-sided cooling IGBT module
889
Packaging and qualification of MEMS-based space systems
890
Packaging and reliability issues in microelectromechanical systems
891
Packaging and reliability of photonic components for subscriber network systems
892
Packaging and reliability of photonic components for subscriber network systems
893
Packaging and Reliability of SAW Filters
894
Packaging and reliability research on automobiles micro-pressure sensor
895
Packaging and sensing platform using opto-electronic zinc oxide nano-heterostructure integration
896
Packaging and system integration of microwave and digital monolithic IC´s
897
Packaging and testing of electro-magnetically actuated silicon micro mirror for Pico-projector applications
898
Packaging and the measurements problem
899
Packaging and thermal analysis of a power inverter for inductive heating applications
900
Packaging and thermal analysis of power electronics modules
901
Packaging and thermal management (organized by CIPS)
902
Packaging and thermal management of high-power, slab-coupled optical waveguide laser arrays for beam combining
903
Packaging and thermomechanical challenges for high temperature electronics
904
Packaging and thin-film truncation effects on thin-film open end microstrip line for miniature multilayer MMICs
905
Packaging and wired interconnections for insertion of miniaturized chips in smart fabrics
906
Packaging Approach for Integrating 40/45-nm ELK Devices Into Wire Bond and Flip-Chip Packages
907
Packaging aspects of CVD diamond in high performance electronics requiring enhanced thermal management
908
Packaging Aspects of Photodetector Modules for 100 Gbit/s Ethernet Applications
909
Packaging Aspects of Photodetector Modules for 100 Gbit/s Ethernet Applications
910
Packaging aspects of the Jitney parallel optical interconnect
911
Packaging aspects of the Litebus
TM
parallel optoelectronic module
912
Packaging assessment of porous ultra low-k materials
913
Packaging capacity analysis of a biopharmaceutical production operation
914
Packaging carbon nanotube based infrared detector
915
Packaging challenges associated with warpage of ultra-thin chips
916
Packaging Challenges for Miniaturized SOT Packages
917
Packaging challenges for small die
918
Packaging challenges in low-k silicon with thermally enhanced ball grid array (TE-PBGA)
919
Packaging challenges in SS-1 supercomputer storage card design
920
Packaging challenges in the design of a 800 Mbps source-synchronous simultaneous bi-directional parallel interface
921
Packaging challenges of producing smaller power mosfets & schottky diodes for the automotive sector
922
Packaging characteristics of 6-layer ultra low-k/Cu dual damascene interconnect featuring advanced scalable porous silica (k=2.1)
923
Packaging compatible microtransformers on a silicon substrate
924
Packaging concept for a miniaturized wirelessly interrogable temperature logger
925
Packaging consideration for 1 Gbps Si CMOS optical driver
926
Packaging consideration for a novel CWDM bidirectional transceiver configured with TO-packaged LD, PD and thin film filter
927
Packaging Considerations for a Compact Reconfigurable RF Tuner with a Broadband Tuning Range
928
Packaging Considerations for a Surface Acoustic Wave Strain Sensor
929
Packaging considerations for high-speed single-ended and differential nets
930
Packaging considerations for microelectromechanical microwave switches
931
Packaging considerations for very high temperature microsystems
932
Packaging Design and Testing for High Temperature Applications > 15 °C
933
Packaging Design Considerations Using Conventional Components
934
Packaging design of microsystems and meso-scale devices
935
Packaging design of wide-angle phased-array antenna for frequencies above 20 GHz
936
Packaging design support environment-a simulation system for analysis of VLSI interconnects
937
Packaging designs and flexural stress estimation for thin-film types of OLED devices
938
Packaging development for GaAs X-ray line detectors
939
Packaging Developments For Optoelectronic Components In Broadband Communication Networks
940
Packaging education at the Dresden University of Technology/Germany
941
Packaging education for the 21st century
942
Packaging effect investigation for MEMS-based sensors WL-CSP with a central opening
943
Packaging Effect on MEMS Pressure Sensor Performance
944
Packaging effect on reliability for Cu/low k structures
945
Packaging effect on reliability of Cu/low k interconnects
946
Packaging effects of a broadband 60 GHz cavity-backed folded dipole superstrate antenna
947
Packaging Effects of Cu/Low-k Interconnect Structure
948
Packaging Effects of Multiple X-Band SiGe LNAs Embedded in an Organic LCP Substrate
949
Packaging effects on a CMOS low-noise amplifier: Flip-chip versus wirebond
950
Packaging Effects on RadFET Sensors for High Energy Physics Experiments
951
Packaging effects on radFET sensors for high energy physics experiments
952
Packaging effects on reliability of Cu/low-k interconnects
953
Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: Flip-chip versus wire-bond
954
Packaging effects on the performances of MEMS for high-G accelerometer: frequency-domain and time-domain analyses
955
Packaging Effects on Transistor Radiation Response
956
Packaging efforts for inter- and intra-board level optical interconnects
957
Packaging Energy and Reserves Bids through Risk Penalties for Enhanced Reliability in Co-optimized Markets
958
Packaging factors affecting the fatigue life of power transistor die bonds
959
Packaging Failure Isolation with Time-Domain Reflectometry (TDR) for Advanced BGA Packages
960
Packaging fault-tolerant software with Ada
961
Packaging for a 1 Gb/s OEIC fiber-optic data link
962
Packaging for a 40-channel parallel optical interconnection module with an over 25-Gb/s throughput
963
Packaging for a 40-channel parallel optical interconnection module with an over-25-Gbit/s throughput
964
Packaging for a wireless intraocular pressure sensor with a solder-filled microchannel antenna
965
Packaging for ESD sensitive items
966
Packaging for fiber in board electro-optical interconnection
967
Packaging for high performance computers
968
Packaging for microelectromechanical and nanoelectromechanical systems
969
Packaging for microengineered devices. Lessons from the real world
970
Packaging for millimetre wave fibre-radio modules
971
Packaging for power semiconductors based on the 3D printing technology Selective Laser Melting
972
Packaging for productivity
973
Packaging for radiation resistant X-ray detectors
974
Packaging for SiC power device
975
Packaging for thermal management of power electronics building blocks using metal posts interconnected parallel plate structure
976
Packaging for VLSI components
977
Packaging for wireless communications
978
Packaging for wireless technology
979
Packaging guidelines for PC cards
980
Packaging high-coupling photonics devices and modules by combination of the art and science
981
Packaging high-power diode laser bars using microchanneled copper mounts
982
Packaging image sensor devices for camera module applications
983
Packaging impact on switching noise in high-speed digital systems
984
Packaging in the IT environment: competing challenges in the design of packaging for electronic products
985
Packaging induced stress effects investigations on 40nm CMOS technology node: Measurements and optimization of device shifts
986
Packaging induced stresses in a packaged micromechanical microphone
987
Packaging industry conference dated May 6-7 at east lansing, Mich.
988
Packaging Industry Subcommittee to sponsor Annual conference May 7–8
989
Packaging influence on acceleration sensitivity of pyroelectric infrared detectors
990
Packaging issues for next generation high voltage, high temperature power electronic modules
991
Packaging issues for optical time division multiplexed networks
992
Packaging Issues on Combination of LED and Flip Chip
993
Packaging leakage mechanism: investigation of copper sulfide growths
994
Packaging material issues in high temperature power electronics
995
Packaging Materials and Techniques for Implantable Instruments
996
Packaging materials for 2.5/3D technology
997
Packaging Materials User in a New Era - Material & Packaging Solution Correspondent with Semiconductor
998
Packaging MEMS inertial sensors at Motorola
999
Packaging Method for Increased Isolation Using a Microstrip to Waveguide Transition
1000
Packaging method for metamaterial based microwave devices
