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1
Thermal interaction of an array of flip chip components
2
Thermal interaction of semiconductor devices in multi-chip modules
3
Thermal interaction of semiconductor devices on copper clad ceramic substrates
4
Thermal interaction of semiconductor devices on copper-clad ceramic substrates
5
Thermal Interactions Between Electromigration Test Structures
6
Thermal interface material evaluation for IGBT modules under realistic power cycling conditions
7
Thermal Interface Material Resistance Measurement Apparatus
8
Thermal interface material with aligned CNT and its application in HB-LED packaging
9
Thermal Interface Materials - A Review of the State of the Art
10
Thermal interface materials based on carbon nanotubes and their thermal characterization
11
Thermal interface materials for power electronics applications
12
Thermal Interface Materials: Historical Perspective, Status, and Future Directions
13
Thermal Interface Resistance Measurements for GaN-on-Diamond Composite Substrates
14
Thermal interface void reduction techniques for direct-soldered power modules
15
Thermal interfaces based on vertically aligned carbon nanotubes : An analysis of the different contributions to the overall thermal resistance
16
Thermal interference in a 0.85 μm 8×8 two-dimensional vertical-cavity surface-emitting laser array
17
Thermal interruption capability of carbon dioxide in a puffer-type circuit breaker utilizing polymer ablation
18
Thermal interruption performance and fluctuations in high voltage gas circuit breakers
19
Thermal inversion based on separating the radiance contribution of atmosphere and land surface
20
Thermal Investigation for Multiple Chips 3D Packages
21
Thermal investigation of a battery module for work machines
22
Thermal investigation of an infrared reflow furnace with a convection fan
23
Thermal Investigation of GaN-Based Laser Diode Package
24
Thermal investigation of high power Optical Devices by transient testing
25
Thermal Investigation of Permanent-Magnet Synchronous Motor for Aerospace Applications
26
Thermal investigation of plastic-encapsulated and hermetically sealed components for automotive industry
27
Thermal investigation of the acoustic emission in polycrystalline ferrimagnets
28
Thermal investigation of the three types of NTC thermistors
29
Thermal investigations for a three-phase AC-to-DC PWM converter
30
Thermal Investigations of 3D FCBGA Packages with TSV Technology
31
Thermal investigations of solder joints used in power applications
32
Thermal investigations of the acoustic emission in polycrystalline ferrimagnets
33
Thermal ion implantation for advanced semiconductor processing
34
Thermal ionization of an aluminum surface by pulsed megagauss field
35
Thermal ions diffusion on printed circuit board
36
Thermal IR emissivity of oil films on sea surfaces at moderate winds
37
Thermal IR emissivity of oil films on sea surfaces under moderate winds
38
Thermal IR imager utilizing a thermal-to-visible transducer
39
Thermal IR imaging in trauma
40
Thermal Isolated BIPV Design Matched to A-Si Modules Behaviours
41
Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications
42
Thermal Isolation of Encapsulated MEMS Resonators
43
Thermal isolation of high-temperature superconducting thin films using silicon wafer bonding and micromachining
44
Thermal issues in a backwafer contacted silicon-on-glass integrated bipolar process
45
Thermal Issues in LDMOSFET Packages
46
Thermal issues in MEMS and microscale systems
47
Thermal issues in microelectronics
48
Thermal issues in microelectronics
49
Thermal issues in microelectronics
50
Thermal issues in microelectronics
51
Thermal issues in microelectronics
52
Thermal issues in microelectronics
53
Thermal issues in microelectronics
54
Thermal issues in microelectronics [breaker page]
55
Thermal issues in microelectronics [breaker page]
56
Thermal Issues in Micromachined Spiral Inductors for High-Power Applications
57
Thermal issues in microsystems packaging
58
Thermal issues in next-generation integrated circuits
59
Thermal issues in operating large motors outside their rated power and speed range
60
Thermal Issues in Operating Large Motors Outside Their Rated Power and Speed Range
61
Thermal issues in stacked die packages
62
Thermal issues of solar irradiation sensor
63
Thermal joint conductance for flexible graphite materials: analytical and experimental study
64
Thermal Land Surface Emissivity Retrieved From SEVIRI/Meteosat
65
Thermal laser stimulation effects on NMOS transistor
66
Thermal Laser Stimulation of active devices in silicon - a quantitative FET parameter investigation
67
Thermal lattice Boltzmann simulations for multi-species fluid equilibration
68
Thermal lattice motion and theories of the Peierls transition
69
Thermal Layers Effect on Recording Performance in HAMR
70
Thermal Layers in Postarc Channel
71
Thermal layout optimization of stacked chips based on hybrid algorithm of simulated annealing and particle swarm
72
Thermal leakage detection on building facades using infrared textures generated by mobile mapping
73
Thermal lens and beam properties in multiple longitudinally diode laser pumped Nd:YAG slab lasers
74
Thermal lens and laser oscillating in CaF
2
and BaF
2
ceramics
75
Thermal Lens Compensation of Nd:YAG Rod Laser Using a Solid-state Element with Negative dn/dT
76
Thermal lens correction of Nd:YAG rod laser used with thermo-optical compensation element of solid material
77
Thermal lens effect on single-transverse-mode stability of proton-implanted photonic-crystal vertical-cavity surface-emitting lasers
78
Thermal lens effects in the LD end-pump fundamental and self-Raman crystal laser
79
Thermal lens in laser-diode-pumped self-frequency-doubled Nd,Lu:YAl/sub 3/(BO/sub 3/)/sub 4/ laser with and without laser oscillations
80
Thermal lens reduction in longitudinally pumped diffusion bonded Nd:YVO
4
81
Thermal lens spectroscopy gas sensing based on etalon-stabilized wavelength sweep technique for fiber ring laser
82
Thermal lensing compensation of diode laser pumping high power Nd: YAG laser
83
Thermal lensing effect of methanol studied with femtosecond laser pulses
84
Thermal lensing in biologic medium
85
Thermal lensing in diode-pumped ytterbium Lasers-Part I: theoretical analysis and wavefront measurements
86
Thermal lensing in diode-pumped ytterbium Lasers-Part II: evaluation of quantum efficiencies and thermo-optic coefficients
87
Thermal lensing in end-pumped Nd:YAG under lasing and nonlasing conditions
88
Thermal lensing in high-power ridge-waveguide lasers
89
Thermal lensing in Nd:YVO
4
laser with in-band pumping at 914 nm
90
Thermal lensing in oxide-confined, single-mode VCSELs
91
Thermal Lensing Spectroscopy Analysis of Er:YAG Crystal Rod: Thermal Focal Length Measure
92
Thermal lensing with acentric beams in thin windows
93
Thermal life evaluation of high temperature insulation systems and hybrid insulation systems in mineral oil
94
Thermal life of enameled magnet wire
95
Thermal life of enameled round magnet wire with various twist holder configurations
96
Thermal life of PVC insulated appliance hookup wires
97
Thermal Life of Varnished Glass Cloth
98
Thermal life of varnished glass cloth
99
Thermal light cannot be represented as a statistical mixture of pulses
100
Thermal limitations due to semiconductors and packaging in high power switches
101
Thermal limitations in air-cooled axial flux in-wheel motors for urban mobility vehicles: A preliminary analysis
102
Thermal limitations in optical recording
103
Thermal limitations in optical recording
104
Thermal limitations of CW and pulsed silicon TRAPATT diodes
105
Thermal limitations of InP HBT´s in 80 and 160 Gbits
-1
IC´s
106
Thermal limitations of InP HBTs in 80- and 160-gb ICs
107
Thermal limitations on the performance of GaAs low boundary field oscillators
108
Thermal limits for integration of directly modulated lasers with driver IC on SOI
109
Thermal limits in reflow soldering process
110
Thermal limits of flip chip package-experimentally validated, CFD supported case studies
111
Thermal Limits of Transrormers for Short-Circuit Conditions AIEE Committee Report
112
Thermal load analysis and real time hot spots recognition in TOKAMAK using cellular nonlinear networks
113
Thermal load boards — another thermal management design tool
114
Thermal load on DED target plates
115
Thermal Loading Affecting the Measurements of Thermally Induced Focal Length
116
Thermal loading and heat removal from a sequentially fired railgun
117
Thermal Loading and Lifetime Estimation for Power Device Considering Mission Profiles in Wind Power Converter
118
Thermal loading and reliability of 10 MW multilevel wind power converter at different wind roughness classes
119
Thermal Loading and Reliability of 10-MW Multilevel Wind Power Converter at Different Wind Roughness Classes
120
Thermal loading in highly efficient diode pumped ytterbium doped lithium niobate lasers
121
Thermal Loading of Thin Metal Foils Used as Electron Beam Windows for a Krf Laser
122
Thermal loading of wind power converter considering dynamics of wind speed
123
Thermal localization
124
Thermal logic circuits
125
Thermal longevity of nano-multilayer magnetic media
126
Thermal loss and soldering effect study of high-Q antennas in handheld devices
127
Thermal loss becomes an issue for narrow-band tunable antennas in fourth generation handsets
128
Thermal loss in high-Q antennas
129
Thermal loss measurements of high frequency planar transformers
130
Thermal loss of high-Q antennas in Time Domain vs. Frequency Domain Solver
131
Thermal Lowering of the Threshold for Microwave Breakdown in Air-Filled Waveguides
132
Thermal macro-modeling of a surface mounted package with a computational fluid dynamic (CFD) tool
133
Thermal magnetic fluctuations in plasmas near the electron cyclotron frequency
134
Thermal Magnetic Noise From Synthetic Antiferromagnets in Magnetoresistive Heads
135
Thermal magnetic noise in tunneling readers
136
Thermal magnetization noise in spin valves
137
Thermal magnetization noise, damping fundamentals, and mode analysis: application to a thin film GMR sensor
138
Thermal magnetization rotation of small nanoparticles
139
Thermal magnetoresistance of copper matrix in compound superconductors, a new measuring method
140
Thermal management analysis of high-power electronic modules using Cu bonded AlN substrates
141
Thermal management and characterization of flip chip BGA packages
142
Thermal management and characterization of the active component embedding into organic substrate
143
Thermal management and concurrent system design of a wearable multicomputer
144
Thermal management and design aspects of high performance plastic quad flat packages for smart-power ICs
145
Thermal management and device failure assessment of high-power AlGaN/GaN HFETs
146
Thermal Management and Load Control of Container Data Center: A Case Study of Cloud Computing in a Rack
147
Thermal management and novel package design of high power light-emitting diodes
148
Thermal management and power packaging for spacecraft of the next millennium
149
Thermal management and resistive rail heating of a large-scale naval electromagnetic launcher
150
Thermal management and resistive rail heating of a large-scale naval electromagnetic launcher
151
Thermal management and testing of MCM with embedded chip in silicon substrate
152
Thermal management and thermal resistance of high power LEDs
153
Thermal management and thermomechanical optimization at higher temperatures
154
Thermal management aspects of all-electric ships
155
Thermal management challenges in forced convection tablets
156
Thermal Management Challenges in Telecommunication Systems and Data Centers
157
Thermal management challenges in the passive cooling of handheld devices
158
Thermal management coatings via combustion chemical vapor deposition (CCVD)
159
Thermal management concept for next generation vehicles
160
Thermal Management Concepts for Power Sandwich Industrial Drive
161
Thermal management concepts for vehicles of next generation
162
Thermal management consumption and its effect on remaining range estimation of electric vehicles
163
Thermal management control without overshoot using combinations of boiling liquids
164
Thermal management control without overshoot using combinations of boiling liquids
165
Thermal management design criteria and solutions
166
Thermal management design criteria and solutions
167
Thermal management design for GMR head ESD-robustness
168
Thermal management design for GMR head ESD-robustness
169
Thermal management design of battery compartments of outdoor telecommunication cabinets
170
Thermal management details and their influence on the aging of power semiconductors
171
Thermal management during stalled rotor by conduction loss redistribution
172
Thermal management estimations for buried bump interconnection technology printed wiring boards with bump (filled via) interconnection
173
Thermal Management for 3D Processors via Task Scheduling
174
Thermal management for ceramic multichip modules: experimental program
175
Thermal management for dependable on-chip systems
176
Thermal Management for Efficiency Enhancement for Multi-Stack Fuel Cell Electric Vehicle
177
Thermal management for flip-chip high power amplifiers utilizing carbon nanotube bumps
178
Thermal management for high performance computing in spaceborne applications
179
Thermal management for high performance integrated circuits with non-uniform chip power considerations
180
Thermal management for high-power active amplifier arrays
181
Thermal Management for High-Power Single-Frequency Tunable Diode-Pumped VECSEL Emitting in the Near- and Mid-IR
182
Thermal management for high-power wavelength conversion
183
Thermal management for motor
184
Thermal management for multifunctional structures
185
Thermal management for multifunctional structures [spacecraft electronics]
186
Thermal management for multi-phase current mode buck converters
187
Thermal management for stackable packages with stacked ICs
188
Thermal Management for Stacked 3D Microelectronic Packages
189
Thermal management for wafer level packaging (WLP)
190
Thermal management I (organized by CIPS) thermal management II (organized by CIPS)
191
Thermal Management in 2.3- μm Semiconductor Disk Lasers: A Finite Element Analysis
192
Thermal Management in a 3D-PCB-Package with Water Cooling
193
Thermal management in color variable multi-chip led modules
194
Thermal Management in Embedded Systems: A Software Approach
195
Thermal management in heat assisted magnetic recording
196
Thermal Management in Heat-Assisted Magnetic Recording
197
Thermal Management in Heat-Assisted Magnetic Recording
198
THERMAL MANAGEMENT IN HIGH AVERAGE POWER PULSED COMPRESSION SYSTEMS
199
Thermal management in high layer count PCBs using sintered-paste-filled PTH
200
Thermal management in high performance computers by use of heat Pipes and vapor chambers, and the challenges of global warming and environment
201
Thermal management in high-density power converters
202
Thermal management in high-power continuous-wave second harmonic generation
203
Thermal management in high-power vertical-external-cavity surface-emitting lasers
204
Thermal management in hybrid silicon lasers
205
Thermal Management in Large Bi2212 Mesas Used for Terahertz Sources
206
Thermal Management in Long-Wavelength Flip-Chip Semiconductor Disk Lasers
207
Thermal management in mobile devices: challenges and solutions
208
Thermal management in PowerPC microprocessor multichip modules applications
209
Thermal management in semiconductor device packaging
210
Thermal management in strongly non-planar microwave HBTs
211
Thermal management in telecommunications central offices: The next steps
212
Thermal management in the design process of MV GIS
213
Thermal management in traction applications as a constraint optimal control problem
214
Thermal management in vertical-external-cavity surface-emitting lasers: finite-element analysis of a heatspreader approach
215
Thermal management integration for microfluidics applications
216
Thermal management issues and evaluation of a novel, flexible substrate, 3-dimensional (3-D) packaging concept
217
Thermal management issues in cryo-electronics
218
Thermal management issues in Laser diode packaging
219
Thermal management issues with various space nuclear power alternatives on SSTS spacecraft
220
Thermal management of 3D IC integration with TSV (through silicon via)
221
Thermal management of 3-D IC using carbon nanotube thermal via
222
Thermal management of 3D RF PoP based on ceramic substrate
223
Thermal management of 3D stacked dies with air convection and water cooling methods
224
Thermal management of a 3D chip stack using a liquid interface to a synthetic jet cooled spreader
225
Thermal management of a C4/CBGA interconnect technology for a high-performance RISC microprocessor: the Motorola PowerPC 620
TM
microprocessor
226
Thermal management of a C4/ceramic-ball-grid array: the Motorola PowerPC 603
TM
and PowerPC 604
TM
RISC microprocessors
227
Thermal management of a high-performance multichip module
228
Thermal management of a laptop computer with synthetic air microjets
229
Thermal management of a low-cost 2kW solar inverter
230
Thermal management of a medical device using thermoelectric coolers
231
Thermal management of a micro-display engine assembly
232
Thermal management of a multi-core master processing unit (MPU) for an ultrascalable computing platform
233
Thermal management of a passively cooled LED-based large area direct backlight for LCDs
234
Thermal Management of a Soft Starter: Transient Thermal Impedance Model and Performance Enhancements Using Phase Change Materials
235
Thermal management of a stacked-die package in a handheld electronic device using passive solutions
236
Thermal Management of a Stacked-Die Package in a Handheld Electronic Device Using Passive Solutions
237
Thermal management of AC induction motors using computational fluid dynamics modeling
238
Thermal Management of Active Electronically Scanned Array Transmit/Receive LRU (Line Replaceable Unit)
239
Thermal management of active LEDs in consumer TV LED-LCD display
240
Thermal Management of advanced Fuel Cell Power Systems
241
Thermal Management of Air- and Liquid-Cooled Multichip Modules
242
Thermal management of air-core stator for a large-capacity HTS motor
243
Thermal management of AlGaN-GaN HFETs on sapphire using flip-chip bonding with epoxy underfill
244
Thermal management of an electronical device using PCM embedded in a pin fin heat sink
245
Thermal management of an IGBT module using two-phase cooling
246
Thermal management of an integrated power module with multiple power devices
247
Thermal management of an led light engine for airborne applications
248
Thermal management of batteries using a hybrid supercapacitor architecture
249
Thermal management of battery compartments of outdoor telecommunication cabinets using phase change materials (PCM)
250
Thermal Management of Biomaterials in a Rectangular Cavity Surrounded by a Phase Change Material
251
Thermal management of biomaterials in a rectangular cavity surrounded by a phase change material
252
Thermal management of BioMEMS
253
Thermal management of BioMEMS: temperature control for ceramic-based PCR and DNA detection devices
254
Thermal Management of Biosensor Networks
255
Thermal Management of Blocks in a Channel Using Phase Change Material
256
Thermal Management of Bright LEDs for Automotive Applications
257
Thermal management of compact SMT multilayer power converters
258
Thermal management of die stacking architecture that includes memory and logic processor
259
Thermal management of Diesel Engine ECU
260
Thermal Management of Digital Switching Systems
261
Thermal management of diode laser arrays
262
Thermal management of electrical machines [breaker page]
263
Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing
264
Thermal management of electronic and electrical devices in automobile environment
265
Thermal management of electronic components using Makrolon polycarbonate and Bayflex polyurethane
266
Thermal management of electronic networks using TLM
267
Thermal management of electronics enclosures under unsteady heating/cooling conditions using phase change materials (PCM)
268
Thermal Management of Electronics Using PCM-Based Heat Sink Subjected to Cyclic Heat Load
269
Thermal management of electronics: problems and analytical techniques
270
Thermal management of electronics: problems and analytical techniques
271
Thermal management of embedded device package
272
Thermal management of embedded devices
273
Thermal management of FET devices using graphene heat spreader
274
Thermal management of FPGA-based embedded systems at operating system level
275
Thermal management of fuel cell-driven vehicles using HT-PEM and hydrogen storage
276
Thermal management of GEO satellite communication payload
277
Thermal management of harsh-environment electronics
278
Thermal management of heat spreader materials for flip chip type package
279
Thermal management of high density power servers using a compact two-phase loop cooling system
280
Thermal Management of High Density Very Low Profile Memory Module
281
Thermal management of high energy density battery equipments
282
Thermal management of high performance microprocessors in burn-in environment
283
Thermal management of high power dissipation electronic packages: from air cooling to liquid cooling
284
Thermal management of high power LEDs: Impact of die attach materials
285
Thermal management of high power memory module
286
Thermal management of high power transformer in different outdoor environment conditions
287
Thermal management of high-power electronics modules packaged with interconnected parallel plates
288
Thermal Management of High-power White LED Package
289
Thermal Management of Hotspots Using Diamond Heat Spreader on Si Microcooler for GaN Devices
290
Thermal management of hotspots using upstream laminar micro-jet impinging array
291
Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices
292
Thermal Management of Hybrid Silicon Ring Lasers for High Temperature Operation
293
Thermal management of integrated circuits in burn-in environment
294
Thermal management of lateral GaN power devices
295
Thermal management of liquid-cooled cold plates for multiple heat sources in a humanoid robot
296
Thermal management of lithium-ion battery pack with liquid cooling
297
Thermal Management of Long-Length HTS Cable Systems
298
Thermal management of manycore systems with silicon-photonic networks
299
Thermal management of microelectronics in the 21st century
300
Thermal management of mid-infrared (IR) quantum cascade lasers
301
Thermal management of military fighter aircraft electro-optics pod: an invited paper
302
Thermal Management of Mobile Phone using Phase Change Material
303
Thermal management of MOSFET junction temperature in RF amplifier
304
Thermal management of multichipmodule (MCM) using genetic algorithms
305
Thermal Management of Near-Infrared Semiconductor Disk Lasers With AlGaAs Mirrors and Lattice (Mis)Matched Active Regions
306
Thermal Management of On-Chip Caches Through Power Density Minimization
307
Thermal management of on-chip caches through power density minimization
308
Thermal management of on-chip hot spots and 3D chip stacks
309
Thermal management of optically pumped long-wavelength InP-based semiconductor disk lasers
310
Thermal management of packaged IC by experimentally verified finite element modeling
311
Thermal management of packages with 3D die stacking
312
Thermal management of portable electronic equipment using thermoelectric energy conversion
313
Thermal management of portable micro fuel cell stacks
314
Thermal management of power electronics modules via acoustic micrography imaging
315
Thermal management of power electronics using thermoelectric coolers
316
Thermal management of power HBT in pulsed operating mode
317
Thermal management of power HBT in pulsed operating mode
318
Thermal Management of Power Inverter Modules at High Fluxes via Two-Phase Spray Cooling
319
Thermal management of power LED system
320
Thermal management of power system design by computational simulation
321
Thermal management of projection displays
322
Thermal management of silicon carbide power module for military hybrid vehicles
323
Thermal management of silicon-based multichip modules
324
Thermal management of surveillance equipments electronic components using pulsating heat pipes
325
Thermal management of telecommunication optical module in forced convection mode
326
Thermal management of telecommunications batteries using phase change materials (PCM) Jacket
TM
327
Thermal management of value regulated lead-acid batteries-a comparison of gelled vs. absorbed electrolyte technologies
328
Thermal management of VCSEL-based optoelectronic modules
329
Thermal management of VCSEL-based optoelectronic modules
330
Thermal management of vertical gallium nitride nanowire arrays: Cooling design and tip temperature measurement
331
Thermal management solutions and design guidelines for silicon based photonic integrated modules
332
Thermal Management Strategies for Cold Start of Automotive PEMFC
333
Thermal management strategies for high power semiconductor pump lasers
334
Thermal management strategies for high power semiconductor pump lasers
335
Thermal management system for high performance PowerPC/sup TM/ microprocessors
336
Thermal Management System for Particle Sensors Design, Performance and Verification
337
Thermal management system for reflow oven
338
Thermal management systems for data centers with liquid cooling technique of CPU
339
Thermal management systems´ design methodology for transport applications
340
Thermal Management Technique Using Control of Thermal Radiation Spectrum for Encapsulated Electronic Devices
341
Thermal management techniques for an advanced linear motor in an electric aircraft recovery system
342
Thermal Management Technologies for Electronic Packaging: Current Capabilities and Future Challenges for Modelling Tools
343
Thermal management technologies for electronics based on multiwalled carbon nanotube bundles
344
Thermal management technology for series-parallel HEV
345
Thermal Management through In-Board Heat Pipes Manufactured using Printed Circuit Board Multilayer Technology
346
Thermal management to avoid the collapse of current gain in power heterojunction bipolar transistors
347
Thermal management using "dry" phase change material
348
Thermal management using a hypervapotron, part III: Summary of controlling parameters
349
Thermal management using interleaved CVD diamond layers for high power 3D chip stacks
350
Thermal management using synthetic jet ejectors
351
Thermal management via task scheduling for 3D NoC based multi-processor
352
Thermal management with additive multilayer circuitry on metal substrates
353
Thermal management with diamond
354
Thermal management with graphene lateral heat spreaders: A feasibility study
355
Thermal management: A key point for the integration in solid state lighting systems
356
Thermal management: Effect of heat shielding using thin metal cylinders on a dispenser cathode temperature
357
Thermal management: Effect of heater geometry on a dispenser cathode temperature
358
Thermal management: Use of aluminum-nitride multilayer heaters in dispenser cathodes
359
Thermal Managements for Highly Efficient SHG with Linear Input/Output Characteristics Using Periodically Poled Stoichiometric LiTaO
3
360
Thermal managerment of high power memory module for server platforms
361
Thermal mangament of multicore processors using power multiplexing
362
Thermal mapping of Delphi thermal test dies
363
Thermal mapping of interconnects subjected to brief electrical stresses
364
Thermal Mapping of Power Devices with a Completely Automated Thermoreflectance Measurement System
365
Thermal mapping of transistors with a laser scanner
366
Thermal Maps of GaAs P-HEMT: A Novel System Based on the Photocurrent Spectral Analysis
367
Thermal mark characterization on static magneto-optic metals
368
Thermal mark characterization on static magneto-optical media
369
Thermal mass characterization of a server at different fan speeds
370
Thermal mastering of MV/LV prefabricated substation
371
Thermal matching designed CMOS mems-based thermoelectric generator for naturally cooling condition
372
Thermal matching of a thermoelectric energy harvester with the environment and its application in wearable self-powered wireless medical sensors
373
Thermal Material With Low Curie Temperature in a Thermally Actuated Superconducting Flux Pump System
374
Thermal mathematical model correlation of an earth observation satellite
375
Thermal Measurement and Modeling of Multi-Die Packages
376
Thermal Measurement and Simulation of 3D stacked die packages
377
Thermal measurement method for multi-chip packages
378
Thermal measurement of AC power in comparison with the electrodynamic method
379
Thermal measurement of cerebrospinal fluid flow rate in hydrocephalus shunt
380
Thermal measurement of losses of GaN power transistors for optimization of their drive
381
Thermal measurement of RF and microwave devices using a novel thermal probe
382
Thermal measurements and analysis of flip-chip LED packages with and without underfills
383
Thermal Measurements and Qualification IC Packages Using the Transient Method: Principles and Applications
384
Thermal measurements and simulations with a silicon detector-pyrolytic graphite sandwich
385
Thermal measurements by use of a SBIMOS diode matrix
386
Thermal measurements for service life estimations of high power induction hardening coils
387
Thermal Measurements In A 1200 kV Compressed Gas Insulated Transmission Line
388
Thermal measurements of two layered thin films of different orders on copper
389
Thermal measurements on cooling lava
390
Thermal measurements on flip-chipped system-on-chip packages with heat spreader integration
391
Thermal mechanical modeling and assessment for a novel power system module with vertical input capacitor
392
Thermal mechanical noise based characterization of CMUTs using monolithically integrated low noise receiver electronics
393
Thermal mechanical performance test on suspended insulators for transmission line
394
Thermal mechanical study of mini-TWT ceramic jacketed collectors
395
Thermal Memory Effect in Polymer Optical Fibers
396
Thermal memory effect modeling and compensation for GaN Doherty amplifier
397
Thermal memory effects modeling and compensation in RF power amplifiers and predistortion linearizers
398
Thermal method of gas separation with micro-pores
399
Thermal method of remote sensing for prediction and monitoring earthquake
400
Thermal methodology for evaluating the performance of microelectronic devices with non-uniform power dissipation
401
Thermal methods [of blood flow imaging]
402
Thermal metrology of silicon microstructures using Raman spectroscopy
403
Thermal Metrology of Silicon Microstructures Using Raman Spectroscopy
404
Thermal metrology techniques for UV LED light sources
405
Thermal micro flow sensor
406
Thermal microactuators for optical purpose
407
Thermal micromagnetic model with a pseudo-three-dimensional junction for magnetoresistive heads
408
Thermal Microphotonic Focal Plane Array (TM-FPA) for Uncooled High Sensitivity Thermal Imaging
409
Thermal microscopy of spin-valve and magnetoresistive devices
410
Thermal microtransducers by CMOS technology combined with micromachining
411
Thermal Microwave Emission from a Three-Layer Random Medium with Three-Dimensional Variations
412
Thermal Microwave Emission from Vegetated Fields: A Comparison between Theory And Experiment
413
Thermal microwave foldover and bistability in ferromagnetic resonance
414
Thermal microwave phonons
415
Thermal mismatch induced reliability issues for Cu filled through-silicon vias
416
Thermal mitigation for high energy density metallized polypropylene capacitors when repetitively discharging
417
Thermal mitigation using thermal through silicon via (TTSV) in 3-D ICs
418
Thermal Modal Analysis of Wing Considering Aerodynamic Heating
419
Thermal model and analysis of wound rotor induction machine
420
Thermal Model and Analysis of Wound-Rotor Induction Machine
421
Thermal model and associated novel approach for synchrotron radiation liner with end cooling
422
Thermal Model and Behavior of a Totally-Enclosed-Water-Cooled Squirrel-Cage Induction Machine for Traction Applications
423
Thermal model and temperature control of a 30 MVA distribution transformer applied in low frequency drying process
424
Thermal model based digital relaying algorithm for induction motor protection
425
Thermal Model Design and Analysis of High-Power LED Headlamp Cooling Device Based on the Thermoelectric Effect
426
Thermal Model Extraction of GaN HEMTs for Large-Signal Modeling
427
Thermal model for AlGaN/GaN HEMTs including self-heating effect and non-linear polarization
428
Thermal model for data centre cooling
429
Thermal Model for Hand-Object Interactions
430
Thermal model for induction machine
431
Thermal model for operation of arc furnace transformer in steel making plant in a climate of high humidity
432
Thermal model for optical fiber coating under tight bending diameters
433
Thermal model for paralleled surface-mount power MOSFETs
434
Thermal model for power transformers dynamic loading
435
Thermal Model For The Hyperthermia Treatment Of An Irregularly Shaped Tumor
436
Thermal model for the local microwave hyperthermia treatment of benign prostatic hyperplasia
437
Thermal model generalization of infrared radiation sensors
438
Thermal model identification of a claw pole generator by a method combining FEM with experiment
439
Thermal model of a disk coil with directed oil flow
440
Thermal model of airships and its computing analysis with improved net heat method
441
Thermal model of an induction generator in oscillating water column wave energy converter
442
Thermal Model of Electrical Contacts Based on Experimental Data
443
Thermal model of electromechanical flywheel with brushless DC machine
444
Thermal model of IGBT modules in the arm converter
445
Thermal model of laser diode arrays
446
Thermal Model of Miniaturized Schottky Emitter for Parallel Electron Beam Lithography
447
Thermal model of MV cable termination using finite elements technique
448
Thermal model of permanent-magnet synchronous motor based on support vector machine and fuzzy modeling
449
Thermal model of phosphor self-heating in phosphor-converted light-emitting diodes
450
Thermal model of power semiconductor devices for electro-thermal circuit simulations
451
Thermal model of skin-equivalent phantoms at 60 GHz
452
Thermal model of stator slot for small synchronous reluctance machine
453
Thermal model of the dishwasher heater in air
454
Thermal model of the evolution of fragments inside a microscopic spot: A multiscale approach of the interaction plasma/cathode
455
Thermal model of totally enclosed water-cooled permanent magnet synchronous machines for electric vehicle applications
456
Thermal Model of Totally Enclosed Water-Cooled Permanent-Magnet Synchronous Machines for Electric Vehicle Application
457
Thermal model requirements for prediction of facet temperature in electro-optical-thermal simulation of ridge lasers
458
Thermal Model With Winding Homogenization and FIT Discretization for Stator Slot
459
Thermal modeling accuracy of hourly averaged data for large free Field Cadmium telluride PV arrays
460
Thermal modeling analysis of the IGBT integration shunt model
461
Thermal Modeling and Analysis for 3-D ICs With Integrated Microchannel Cooling
462
Thermal modeling and analysis for Ceramic Quad Flat No-lead packages
463
Thermal Modeling and Analysis of a Double-Stator Switched Reluctance Motor
464
Thermal modeling and analysis of a power device heat sinks
465
Thermal modeling and analysis of high power semiconductor laser arrays
466
Thermal modeling and analysis of pin grid arrays and multichip modules
467
Thermal modeling and analysis of storage systems
468
Thermal Modeling and Characterization of a Thin-Film Heater on Glass Substrate for Lab-on-Chip Applications
469
Thermal modeling and characterization of electrical machines, and calculation of current ratings
470
Thermal modeling and characterization of Package with Through-Silicon-Vias (TSV) Interposer
471
Thermal modeling and characterization of SiC power module under both air cooling and liquid cooling conditions
472
Thermal modeling and characterization of the embedded micro wafer level package (EMWLP) at the package- and system-level
473
Thermal modeling and control limits in high performance microprocessors
474
Thermal modeling and control of rapid thermal processing systems
475
Thermal modeling and design of 3D integrated circuits
476
Thermal modeling and design of liquid cooled heat sinks assembled vvith flip chip ball grid array packages
477
Thermal Modeling and Device Noise Properties of 3D-SOI Technology
478
Thermal Modeling and Device Noise Properties of Three-Dimensional–SOI Technology
479
Thermal modeling and experimental characterization of the C4/surface-mount-array interconnect technologies
480
Thermal modeling and experimental characterization of the C4/surface-mount-array interconnect technologies
481
Thermal modeling and experimental study of 3D stack package with hot spot consideration
482
Thermal modeling and experimental techniques for microwave bipolar devices
483
Thermal modeling and experimental techniques for microwave bipolar devices
484
Thermal modeling and experimental validation of a large prismatic Li-ion battery
485
Thermal modeling and experimental validation of an encapsulated busbars system
486
Thermal modeling and experimental validation of thermal interface performance between non-flat surfaces
487
Thermal modeling and experimentation to determine maximum power capability of SCR´s and thyristors
488
Thermal modeling and management in ultrathin chip stack technology
489
Thermal Modeling and Management of DRAM Systems
490
Thermal modeling and management of the integrated HID ballast
491
Thermal modeling and measurement of AlGaN/GaN FETs built on sapphire and SiC substrates
492
Thermal modeling and measurement of AlGaN-GaN HFETs built on sapphire and SiC substrates
493
Thermal modeling and measurement of GaN-based HFET devices
494
Thermal modeling and measurements of AlGaN/GaN HEMTs including Thermal Boundary Resistance
495
Thermal modeling and optimization for electronic packages
496
Thermal modeling and performance of high heat flux SOP packages
497
Thermal modeling and real time overload capacity prediction of overhead power lines
498
Thermal modeling and simulation of a package-on-package embedded micro wafer level package (EMWLP) structure at the package and system-level
499
Thermal modeling and simulation of distribution transformers
500
Thermal modeling and simulation of the chilled water system for future all electric ship
501
Thermal modeling and simulation of transformers
502
Thermal Modeling and Temperature Driven Placement for FPGAs
503
Thermal Modeling and Validation of a Lithium-Ion Battery Based on Electric Vehicle Measurements
504
Thermal modeling applications to forest canopies
505
Thermal modeling as a tool to determine the overload capability of electrical machines
506
Thermal modeling for 3D-ICs with integrated microchannel cooling
507
Thermal Modeling for a HVAC Controlled Real-Life Auditorium
508
Thermal modeling for advanced high power packaging development and on-line performance monitoring
509
Thermal modeling for electrothermal simulation of power devices or circuits
510
Thermal modeling for FinFET NAND gate circuits using a multi-block reduced-order model
511
Thermal modeling for magnetic components: a survey
512
Thermal modeling for mode-size estimation in microlasers with application to linear arrays in Nd:YAG and Tm,Ho:YLF
513
Thermal modeling for MRI-guided radiofrequency tumor ablation
514
Thermal modeling for power MOSFETs in DC/DC applications
515
Thermal modeling for Silicon-on-Sapphire (SOS) based power amplifier design in wireless communication
516
Thermal Modeling for System-in-a-Package Based on Embedded Chip Structure
517
Thermal modeling for the design and check of an axial flux PM motor
518
Thermal modeling for the estimation of energy losses from municipal heating networks using infrared thermography
519
Thermal modeling for vehicle battery system: A brief review
520
Thermal modeling for warpage effects in organic packages
521
Thermal Modeling Improvements using substrate ECAD integration
522
Thermal modeling in cylindrical coordinates using effective conductivity
523
Thermal modeling methodology for efficient system-level thermal analysis
524
Thermal modeling of "direct lamination cooling (DLC)" induction motor for hybrid electric vehicle applications
525
Thermal Modeling of 3-D Stacked DRAM Over SiGe HBT BiCMOS CPU
526
Thermal modeling of 3D stacks for floorplanning
527
Thermal modeling of a BLDC motor for a kick scooter
528
Thermal Modeling of a Claw-Pole Electrical Generator: Steady-State Computation and Identification of Free and Forced Convection Coefficients
529
Thermal modeling of a double-neck large diameter crystal growth process
530
Thermal modeling of a double-neck large diameter crystal growth process
531
Thermal modeling of a few-chip module housing a DC-DC power supply
532
Thermal modeling of a high-speed switched reluctance machine with axial air-gap flow for vacuum cleaners
533
Thermal Modeling of a LiFePO
4
/Graphite Battery and Research on the Influence of Battery Temperature Rise on EV Driving Range Estimation
534
Thermal Modeling of a Multilayered Film via Taylor Series Expansion- and Least Squares-Based-Lattice Boltzmann Method
535
Thermal modeling of a permanent magnet machine built using Litz wire
536
Thermal Modeling of a Segmented Stator Winding Design
537
Thermal modeling of a short-duty motor
538
Thermal modeling of a small extreme power density macro on a high power density microprocessor chip in the presence of realistic packaging and interconnect structures
539
Thermal modeling of a stator bar - Influence of geometry and material properties
540
Thermal modeling of a wafer in a rapid thermal processor
541
Thermal modeling of active embedded chip into high density electronic board
542
Thermal modeling of aluminum electrolytic capacitors
543
Thermal modeling of an induction machine through the association of two numerical approaches
544
Thermal Modeling of an Induction Motor
545
Thermal Modeling of an Inverted-Type Oil-Immersed Current Transformer
546
Thermal modeling of axial piston pump and application
547
Thermal modeling of BOX/DTI enclosed power devices with Green´s function approach
548
Thermal Modeling of Brushless DC Motor and Brake Solenoid in Electro-Mechanical Actuators for the More Electric Aircraft Engine
549
Thermal modeling of cryogenic accelerator structures
550
Thermal modeling of densely packed electronic systems
551
Thermal modeling of diamond-based power electronics packaging
552
Thermal Modeling of Directly Cooled Electric Machines Using Lumped Parameter and Limited CFD Analysis
553
Thermal modeling of directly-oil-cooled permanent magnet synchronous machine
554
Thermal modeling of discrete microelectronic elements within three-dimensional continuous models
555
Thermal modeling of double slope wick-type solar still with different thickness insulation absorption of wick surface
556
Thermal modeling of double slope wick-type solar still with different thickness insulation absorption of wick surface
557
Thermal modeling of electrical contacts in switches and relays
558
Thermal modeling of electrical contacts in switches and relays
559
Thermal modeling of electrical utility transformer
560
Thermal modeling of electronic components for thermal simulation of electronic equipment
561
Thermal modeling of enhancement LED package
562
Thermal modeling of E-type magnetic components
563
Thermal Modeling of Flooded Rotor Electrical Machines for Electro-Hydrostatic Actuators
564
Thermal Modeling of Gaseous Helium as a Cryogen for High Temperature Superconducting Cable Components
565
Thermal modeling of grease-type interface material in PPGA application
566
Thermal Modeling of Helium Cooled High-Temperature Superconducting DC Transmission Cable
567
Thermal modeling of high frequency GaN power HEMT´s using analytic approach
568
Thermal modeling of high performance packages in portable computers
569
Thermal modeling of high performance packages in portable computers
570
Thermal Modeling of High Power GaN-on-Diamond HEMTs Fabricated by Low-Temperature Device Transfer Process
571
Thermal modeling of high temperature power conversion capacitors
572
Thermal modeling of homogeneous embedded multi-core processors
573
Thermal modeling of hybrid concentrating PV/T collectors with tree-shaped channel networks cooling system
574
Thermal modeling of hybrid microelectronics
575
Thermal modeling of integrated power electronic modules by a lumped-parameter circuit approach
576
Thermal Modeling of Intersubband Transition-Based InGaAs/AlAsSb Ultrafast All-Optical Cross-Phase Modulators
577
Thermal modeling of isothermal cuboids and rectangular heat sinks cooled by natural convection
578
Thermal modeling of isothermal cuboids and rectangular heat sinks cooled by natural convection
579
Thermal modeling of large-area VCSELs under optical pumping
580
Thermal modeling of Lundell alternators
581
Thermal modeling of Lundell alternators
582
Thermal modeling of magnetoresistive heads in three dimensions
583
Thermal modeling of medium voltage cable terminations under square pulses
584
Thermal modeling of metal oxides for highly scaled nanoscale RRAM
585
Thermal modeling of microelectronic equipment taking into account thermal contact conductance
586
Thermal modeling of micro-hotplates for integrated sensor applications
587
Thermal Modeling of Multi-Core Processors
588
Thermal Modeling of Multi-Fin Field Effect Transistor Structure Using Proper Orthogonal Decomposition
589
Thermal Modeling of Multi-finger SiC Power MESFETs
590
Thermal modeling of multi-gate field effect transistors based on a reduced order model
591
Thermal modeling of nanodevices
592
Thermal modeling of novel monolithic pyroelectric infrared image sensors
593
Thermal modeling of on-chip interconnects and 3D packaging using EM tools
594
Thermal Modeling of Organic Light-Emitting Diode Display Panels
595
Thermal modeling of passive thermal management system with phase change material for LiFePO4 battery
596
Thermal modeling of permanent magnet double-rotor machine
597
Thermal modeling of permanent magnet motor with finite element method
598
Thermal modeling of portable power cables
599
Thermal Modeling Of Portable Power Cables
600
Thermal modeling of pot core magnetic components used in high frequency static converters
601
Thermal modeling of power gallium arsenide microwave integrated circuits
602
Thermal modeling of power substations using the finite element method
603
Thermal modeling of pulse current trimming
604
Thermal modeling of PV modules using computational simulation
605
Thermal Modeling of Quilt Packaging Interconnects
606
Thermal Modeling of Resistive Switching Devices
607
Thermal modeling of self-heating in strained-silicon MOSFETs
608
Thermal modeling of silicon-on-insulator current mirrors
609
Thermal modeling of specialty heat-sinks for low-cost COP packaging of high-power LEDs
610
Thermal Modeling of Terahertz Quantum-Cascade Lasers: Comparison of Optical Waveguides
611
Thermal modeling of the module integrated DC-DC converter for flexible thin-film PV modules
612
Thermal modeling of the module integrated DC-DC converter for thin-film PV modules
613
Thermal modeling of thin-film SOI transistors
614
Thermal modeling of three-dimensional integrated circuits considering the thermal removal capability of different TSVs
615
Thermal modeling of through hole capacitors
616
Thermal modeling of transferred VCSELs
617
Thermal modeling of WLP-BAW filters: Power handling and miniaturization
618
Thermal modeling techniques for heat sinks for power electronics
619
Thermal modeling with PC spreadsheets
620
Thermal modeling, analysis and control using an electrical analogy
621
Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods
622
Thermal modeling, analysis, and management of high-power GaN transistors
623
Thermal Modeling, Characterization and Management of On-Chip Networks
624
Thermal modeling, measurements and design considerations of GaAs microwave devices
625
Thermal modelling and analysis for offshore submarine high-voltage direct current cable crossings
626
Thermal modelling and control of hydrogen-oxygen combustor
627
Thermal modelling and optimisation of hot solder dip process
628
Thermal modelling and optimization-based control of a batch diffusion furnace
629
Thermal modelling and performance assessment of PV modules based on climatic parameters
630
Thermal modelling and selection of a high speed permanent magnet surface mount electrical machine
631
Thermal modelling and simulation of non-volatile and non-rotating phase change memory cell
632
Thermal modelling approach and model predictive control of a water-cooled PEM fuel cell system
633
Thermal modelling for dynamic transformer rating in low carbon distribution network operation
634
Thermal modelling for temperature control in MPSoC´s using Timed Continuous Petri Nets
635
Thermal modelling investigation of heat paths due to iron losses in synchronous machines
636
Thermal modelling of 3D multicore systems in a flip-chip package
637
Thermal modelling of a claw-pole car alternator: Steady-state computation and identification of free convection coefficients
638
Thermal modelling of a fractional-slot concentrated-winding Kaman type Axial-Flux Permanent-Magnet machine
639
Thermal modelling of a high speed permanent magnet synchronous machine
640
Thermal modelling of a kilovoltage X-ray source for portal imaging
641
Thermal modelling of a low speed air-cooled Axial Flux Permanent Magnet generator
642
Thermal modelling of a passively cooled inverter for wave power
643
Thermal modelling of a tubular linear machine for marine renewable generation
644
Thermal modelling of AC commutator motors for domestic appliances
645
Thermal modelling of an alternator for use in a prediction system
646
Thermal Modelling of an Induction Motor
647
Thermal modelling of cables in conduits: (air gap consideration)
648
Thermal modelling of coherent asymmetric dipole antenna arrays with variable antenna positions and orientations
649
Thermal modelling of electro-mechanical cables for ROV applications
650
Thermal modelling of electronic systems based on spectral analysis of circuit temperature response
651
Thermal Modelling Of Enclosed Cables In Automotive Applications
652
Thermal modelling of high power GTO thyristors
653
Thermal modelling of hot spot formation at deep level centers in silicon transistor under laser irradiation
654
Thermal modelling of IC packages
655
Thermal Modelling of IGBT Devices
656
Thermal modelling of infrared heater for plastic waste gasification
657
Thermal modelling of integrated heat exchangers with alternating ribs
658
Thermal modelling of large-format laminated Li-ion battery and experimental validation using embedded thermocouples
659
Thermal modelling of multifinger GaAs/GaN FETs using SPICE
660
Thermal modelling of multiple die packages
661
Thermal modelling of nonideal interstitial microwave antenna array hyperthermia for the treatment of cancer
662
Thermal modelling of permanent-split-capacitor single-phase induction motors based on accurate loss density measurement
663
Thermal modelling of solder joint formation
664
Thermal modelling of switched flux permanent magnet machines
665
Thermal Modelling of TEFC Alternators
666
Thermal modelling of the building and its HVAC system using Matlab/Simulink
667
Thermal modelling of the emerging multi-chip packages
668
Thermal modelling of the human eye exposed to laser radiation
669
Thermal modelling of the Pentium processor package
670
Thermal modelling of TPV systems
671
Thermal modelling of tubular linear machines using a hybrid analytical method
672
Thermal modelling of vertical-cavity surface-emitting lasers using the finite-element method
673
Thermal modelling of water-cooled Axial-Flux Permanent Magnet Machine
674
Thermal modelling to analyze the effect of cell temperature on PV modules energy efficiency
675
Thermal modelling with neural network applied to Planck space mission
676
Thermal modelling, simulation and evaluation of a high power battery cell for automotive applications
677
Thermal models and electrical machine performance improvement using encapsulation material
678
Thermal models characterization for reliable temperature capping and performance optimization in Multiprocessor Systems on Chip
679
Thermal models for dynamic clock control
680
Thermal Models for Online Detection of Pulp Obstructing the Cooling System of TEFC Induction Motors in Pulp Area
681
Thermal models for on-line detection of pulp obstructing the cooling system of TEFC induction motors in pulp area
682
Thermal Models for Optical Circuit Simulation Using a Finite Cloud Method and Model Reduction Techniques
683
Thermal models for semiconductor device simulation
684
Thermal models for semiconductors
685
Thermal models generator (TMG)
686
Thermal models of short arc between high current contacts
687
Thermal modifications of internal quantum efficiencies in the near IR [Si solar cells]
688
Thermal modulation effect on the heat change and flow during crystal growth in a vertical Bridgman cavity
689
Thermal monitoring - from inside the cabinet
690
Thermal monitoring and testing of electronic systems
691
Thermal Monitoring of Eyjafjöll Volcano Eruptions by Means of Infrared MODIS Data
692
Thermal monitoring of large power transformers
693
Thermal Monitoring of Major Active Volcanoes Worldwide by Synergetic Merge of High- and Lowresolution Payloads ASTER, ETM+, TM and MODIS
694
Thermal monitoring of memories
695
Thermal monitoring of real processors: Techniques for sensor allocation and full characterization
696
Thermal monitoring of safety-critical integrated systems
697
Thermal monitoring of the myocardium under blood arrest preliminary study
698
Thermal monitoring of transformers
699
Thermal monitoring on power transformers
700
Thermal Monitoring: Raman Spectrometer System for Remote Measurement of Cellular Temperature on a Microscopic Scale
701
Thermal moon probe cable
702
Thermal multielement receiver optical radiation
703
Thermal nanoimprint fabrication of chalcogenide glass waveguide resonators
704
Thermal nanoimprint fabrication of chalcogenide glass waveguide resonators on nonconventional plastic substrates
705
Thermal nanoimprint fabrication of silicon high Q optical microdisk resonators
706
Thermal Nature Of Microwave Evoked Body Movements
707
Thermal near-field optical spectroscopy
708
Thermal network analysis in MV GIS design
709
Thermal network analysis in MV GIS design
710
Thermal network component models for 10 kV SiC power module packages
711
Thermal Network Model of Supercapacitors Stack
712
Thermal Networks for Time-Variant Cooling Systems: Modeling Approach and Accuracy Requirements for Lifetime Prediction
713
Thermal networks from heat wave equation
714
Thermal networks from phonon Boltzmann´s transport equation: Part I - Fundamentals
715
Thermal networks from phonon Boltzmann´s transport equation: Part II - Compact modeling
716
Thermal neutron backscatter imaging
717
Thermal Neutron Damage in Bipolar PNP Transistors
718
Thermal neutron detection using alkali halide scintillators with
6
Li and pulse shape discrimination
719
Thermal neutron detection using Si detector and a boron implanted polyethylene converter
720
Thermal neutron detection with
6
Li converters
721
Thermal neutron detection with a high-pressure Xe/TMA//sup 3/He gas electron multiplier
722
Thermal neutron detection with the lithium borate scintillator
723
Thermal neutron detection with the lithium borate scintillator
724
Thermal neutron detectors with discrete anode pad readout
725
Thermal Neutron Die-Away Studies in a 14 MeV Neutron-Based Active Interrogation System
726
Thermal neutron filter design for the neutron radiography facility at the LVR-15 reactor
727
Thermal neutron imaging tests using Ce doped LiCaAlF
6
and sealed
252
Cf source
728
Thermal neutron imaging tests with rare-earthion-doped LiCaAlF
6
and sealed
252
Cf source
729
Thermal neutron imaging with a Rotationally Modulated Collimator (RMC)
730
Thermal neutron imaging with PIN photodiode line scanner and Eu-doped LiCaAlF
6
scintillator
731
Thermal Neutron Scintillator Detectors Based on Poly (2-Vinylnaphthalene) Composite Films
732
Thermal neutron soft error rate for SRAMS in the 90NM–45NM technology range
733
Thermal neutron source location using a 3-D position-sensitive CdZnTe detector array
734
Thermal Neutron-Induced Soft Errors in Advanced Memory and Logic Devices
735
Thermal Nitridation of Chemical Dielectrics as an Easy Approach to Ultra-thin Gate Oxide Processing
736
Thermal nitridation of Si and SiO
2
for VLSI
737
Thermal Nitridation of Si and SiO
2
for VLSI
738
Thermal Nitride capacitors for high density RAMs
739
Thermal nitride gate FET technology for VLSI devices
740
Thermal Noise Analysis in Conical-Scan Radars
741
Thermal Noise Analysis of a Programmable-Gain Switched-Capacitor Amplifier With Input Offset Cancellation
742
Thermal noise analysis of multi-bit SC gain-stages for low-voltage high-resolution pipeline ADC design
743
Thermal noise analysis of multi-input SC-integrators for delta-sigma modulator design
744
Thermal noise analysis of SGMOSFET for different substrate and gate oxides
745
Thermal Noise Analysis on the Resistive Vee Dipole Antenna for Ground-Penetrating Radar Applications
746
Thermal noise and bit error rate limits in nanoscale memories
747
Thermal noise and drift mobility of randomly moving electrons in homogeneous materials with highly degenerate electron gas
748
Thermal Noise and Noise Measurements—A 2010 Update
749
Thermal noise and radiation pressure in MEMS Fabry-Perot tunable filters and lasers
750
Thermal noise behavior of a nonlinear bridge circuit
751
Thermal noise behavior of a thick depletion region avalanche photodetector
752
Thermal Noise Compliant Synthesis of Linear Lumped Macromodels
753
Thermal noise driven heat engines: Noise put to work, while it sheds light on “quantum heat engine weirdness”
754
Thermal Noise Effect in FTTH Communication Systems
755
Thermal noise emission of a lossy material for a TEM propagation
756
Thermal Noise Errors in DF Monopulse Systems Having Log Amplifiers
757
Thermal Noise from a Passive Linear Multiport
758
Thermal noise from long sense lines
759
Thermal noise from switches in a switched-capacitor gain stage
760
Thermal noise in a finite bandwidth
761
Thermal Noise in Amplitude Comparison Monopulse Systems
762
Thermal noise in buried-channel MOSFET
763
Thermal noise in digital Josephson devices
764
Thermal noise in double-injection space-charge-limited solid-state diodes
765
Thermal noise in field-effect devices
766
Thermal noise in field-effect transistors
767
Thermal Noise in Field-Effect Transistors
768
Thermal noise in field-effect transistors
769
Thermal noise in gradual-junction-gate f.e.t.
770
Thermal noise in Hall-effect twoports
771
Thermal Noise in Interferometric Gravitional-Wave Detectors
772
Thermal noise in junction-gate field-effect transistors
773
Thermal noise in linear damped systems
774
Thermal noise in lossy waveguides
775
Thermal Noise in MOSFETs: A Two- or a Three-Parameter Noise Model?
776
Thermal noise in multi-section radio links
777
Thermal noise in nonlinear resistive devices and its circuit representation
778
Thermal noise in optical fibers and its influence on long-distance coherent communication systems
779
Thermal noise in optical reference resonators
780
Thermal Noise in Spin-Phonon Systems
781
Thermal noise in the hot electron regime in FET´s
782
Thermal Noise in Track-and-Hold Circuits: Analysis and Simulation Techniques
783
Thermal noise limits in nanoscale electronics
784
Thermal noise limits of microphones
785
Thermal noise measurement of SI integrator
786
Thermal noise measurements in GaAs MESFET´s
787
Thermal noise measurements on micro-cantilevers coated with dielectric materials
788
Thermal noise modeling for short-channel MOSFETs
789
Thermal noise modeling for short-channel MOSFETs
790
Thermal noise modeling of nano-scale MOSFETs for mixed-signal and RF applications
791
Thermal noise of microwave antennas
792
Thermal noise of microwave superconducting filter-amplifier combinations
793
Thermal noise of silicon based grating reflectors for high-precision metrology
794
Thermal noise of transmission lines: A generalized solution
795
Thermal Noise of Transmission Media
796
Thermal noise performance in recent CMOS technologies
797
Thermal noise random number generator based on SHA-2 (512)
798
Thermal noise response based control of tip-sample separation in AFM
799
Thermal noise, damping fundamentals and mode analysis: application to GMR sensors
800
Thermal noise, intermittent failures, and yield in Josephson circuits
801
Thermal noise, motional electromotive force, and electric fields in the human body
802
Thermal noise, suspensions and new materials
803
Thermal Noise-Limited Fiber-Optic Sensing at Infrasonic Frequencies
804
Thermal nondestructive examination method for thermal sprayed coatings
805
Thermal nondestructive testing technology of aircraft composite material
806
Thermal Nonequilibrium of a Free-Burning Argon Arc Plasma
807
Thermal Nonequilibrium Simulation of an Arc Plasma Jet
808
Thermal Nonlinearities in Contour Mode AlN Resonators
809
Thermal nonlinearity analysis of toroidal microcavities
810
Thermal nonlinearity and optical bistability in a graphene-silicon waveguide resonator
811
Thermal nonlinearity in coupled disk microresonators
812
Thermal nonuniformities and mechanism of Brownian motion
813
Thermal Numerical Simulation and Correlation for a Power Package
814
Thermal numerical simulation for advanced package development
815
Thermal optical bistability in InGaAs/InAlAs MQW etalons at 1.5 mu m wavelength
816
Thermal optical property analysis of three mirrors aberration optical system
817
Thermal Optimal Design for Plain Plate-Fin Heat Sinks by Using Neuro-Genetic Method
818
Thermal optimalization of a stereovision electronic travel aid for the blind
819
Thermal optimisation of GaN flip chip power transistors
820
Thermal optimisation of mechatronically integrated power electronics for an engine cooling fan using brushless technology
821
Thermal optimised modulation methods of three-level neutral-point-clamped inverter for 10 MW wind turbines under low-voltage ride through
822
Thermal optimization design of high-power LED fin-tubular radiator
823
Thermal Optimization for a HSPMG Used for Distributed Generation Systems
824
Thermal optimization for micro-architectures through selective block replication
825
Thermal optimization formulation strategies for multi-constraints electronic devices placement on PCB
826
Thermal optimization in a power electronic supply
827
Thermal optimization in multi-granularity multi-core floorplanning
828
Thermal optimization of 3D microcontacts using DOE and CFD analysis
829
Thermal optimization of a flip-chip WiFi RF front-end IC
830
Thermal Optimization of a High-Power Salient-Pole Electrical Machine
831
Thermal Optimization of a High-Speed Permanent Magnet Motor
832
Thermal optimization of a miniaturized camera with Pentium PC module
833
Thermal Optimization of a Radial Folded Fin Heat Sink for Desktop Computer Applications
834
Thermal optimization of a tubular permanent magnet linear synchronous motor
835
Thermal optimization of an air-cooling heat exchanger utilizing manifold-microchannels
836
Thermal optimization of an integrated LV battery energy storage station
837
Thermal Optimization of Circular Bodies Submitted to an Intense Heat Flux by Constructal Design
838
Thermal Optimization of Electronic Equipment: Form Factor Improvement
839
Thermal optimization of electronic systems using Design of Experiments based on numerical inputs
840
Thermal optimization of high power LED arrays with a fin cooling system
841
Thermal optimization of metalized polypropylene film capacitors
842
Thermal optimum analyses and mechanical design of 10-kA, vapor-cooled power leads for SSC superconducting magnet tests at MTL
843
Thermal Overload Protection of Induction Motors Under Waveform Distortion
844
Thermal Overload Tests on a 400 MVA Power Transformer with a Special 2.5 P.U. Short-Time Loading Capability
845
Thermal overload tests on a 400-MVA power transformer with a special 2.5-p.u. Short time loading capability
846
Thermal Overshoot Analysis for Hot-spot Temperature Rise of Transformer
847
Thermal oxidation and characterization for surface layers of Al implanted TiN films
848
Thermal oxidation and stability of thin manganese films
849
Thermal oxidation as a key technology for high efficiency screen printed industrial silicon solar cells
850
Thermal Oxidation Kinetics and Locos Isolation in Soi Materials
851
Thermal oxidation of 6H-silicon carbide at enhanced growth rates
852
Thermal oxidation of AlGaAs: modeling and process control
853
Thermal oxidation of CuInSe
2
: experiment and physico-chemical model
854
Thermal Oxidation of Lightly- and Heavily-Doped Silicon in Pure N
2
O
855
Thermal oxidation of silicon as an impurity-controlled process
856
Thermal oxidation of ultra thin palladium (Pd) foils at room conditions
857
Thermal oxidation studies on methyl grafted natural rubber polymer electrolytes with paraphenylene diamine additive
858
Thermal oxidation-induced strain in silicon nanobeams
859
Thermal Oxide Film Deposition Monitoring Algorithm
860
Thermal oxide, Al
2
O
3
and amorphous-Si passivation layers on silicon
861
Thermal packaging - the moving frontier
862
Thermal Packaging Challenges and Opportunities at the Micro and Nano Scales
863
Thermal Packaging of High Temperature Superconductor Bulk for Superconducting Flywheel Energy Storage
864
Thermal parameter estimation in the presence of uncertainty [packaging]
865
Thermal parameter estimation using recursive identification
866
Thermal parameter estimation using recursive identification
867
Thermal parameter extraction for bipolar circuit modelling
868
Thermal Parameter Extraction Method for Light-Emitting Diode (LED) Systems
869
Thermal parameter extraction technique using DC I-V data for HBT transistors
870
Thermal parameter identification of photovoltaic module using genetic algorithm
871
Thermal parameter identification of simplified building model with electric appliance
872
Thermal parameters measurement method of electronics materials
873
Thermal parameters measurement on fire fighter during intense fire exposition
874
Thermal parameters measurement on fire fighter: Improvement of the monitoring system
875
Thermal Parametric Imaging in the Evaluation of Skin Burn Depth
876
Thermal passive systems, latent heat storage and simulation
877
Thermal path following robot vehicle: Sensor design and motion control
878
Thermal Pathfinding for 3-D ICs
879
Thermal Performance Analysis for Packaging Configuration Design of Multifinger GaInP Collector-Up HBTs as Small High-Power Amplifiers
880
Thermal performance analysis for the machine tool´s spindle
881
Thermal performance analysis of a 3D package
882
Thermal performance analysis of a novel compound parabolic concentrator solar collector
883
Thermal Performance Analysis of a Silicon Microreactor for Rapid DNA Analysis
884
Thermal performance analysis of cryogenic system for cooling of superconducting magnets at 4K temperature level
885
Thermal performance analysis of linear fresnel reflector concentrator with a compound parabolic cavity absorber
886
Thermal performance analysis of photoelectric parameters on high-power LEDs packaging modules
887
Thermal performance analysis of polymer optical waveguides for thermo-optic applications
888
Thermal performance analysis of solar steam aided coal-fired power generation
889
Thermal performance analysis of the double-sided linear switched reluctance motor
890
Thermal Performance Analysis of the Lithium-Ion Batteries
891
Thermal performance and mechanical stress analysis of BGA and flex-CSP using parametric FEA models
892
Thermal performance and microstructure of lead versus lead-free solder die attach interface in power device packages
893
Thermal performance and placement design of LED array package on PCB
894
Thermal Performance and Reliability Analysis of Single-Phase PV Inverters With Reactive Power Injection Outside Feed-In Operating Hours
895
Thermal performance and reliability aspects of silicon hybrid multi-chip modules
896
Thermal performance and reliability assessment of nano-sintered silver die attach materials
897
Thermal performance and reliability characterization of bonded interface materials (BIMs)
898
Thermal performance and reliability management for novel power electronic packaging using integrated base plate
899
Thermal Performance and Reliability of Thermal Interface Materials: A Review
900
Thermal performance and solder joint reliability for board level assembly of modified leadframe package
901
Thermal Performance Assessment and Validation of High-Concentration Photovoltaic Solar Cell Module
902
Thermal performance assessment in AlGaN/GaN structures by microsensor integration
903
Thermal performance challenges for rapid thermal processing
904
Thermal performance characteristic comparison between flip-chip wirebond ceramic multichip modules
905
Thermal performance characteristics of folded stacked packages
906
Thermal performance characterization of nano thermal interface materials after power cycling
907
Thermal Performance Comparison between Various RF Transceiver Modules
908
Thermal performance comparison of chip-on-board, flip chip-on-board and standard TQFP package
909
Thermal performance comparison of high pin count cavity-up enhanced plastic ball grid array (EPBGA) packages
910
Thermal performance comparison of high pin count cavity-up enhanced plastic ball grid array (EPBGA) packages
911
Thermal Performance Comparison of Thick-Film Insulated Aluminum Substrates With Metal Core PCBs for High-Power LED Modules
912
Thermal Performance Correlation of Horizontal Closed-Loop Oscillating Heat Pipes
913
Thermal performance enhancement by exploitation of nano-effects
914
Thermal Performance Enhancement for CSP Packages
915
Thermal performance enhancement in solar air heater channel with periodically V-shaped baffles
916
Thermal performance evaluation and methodology for pyramid stack die packages
917
Thermal performance evaluation for a microelectronics motor control system incorporating dynamic heat sources
918
Thermal Performance Evaluation of a High-Speed Flywheel Energy Storage System
919
Thermal performance evaluation of a synthetic jet heat sink for electronic cooling
920
Thermal performance evaluation of an insulation system for cast resin power transformers
921
Thermal performance evaluation of Power QFN package with stacked and side by side die configuration
922
Thermal Performance Evaluation of Power SSL Module in LTCC
923
Thermal performance evaluation of SiC power devices packaging
924
Thermal performance evaluation of various heat sinks for air cooling
925
Thermal performance evaluation of VLSI packaging
926
Thermal performance evaluations of passive solar building in Korea
927
Thermal Performance Experiment Research of One New Floor Heating System
928
Thermal performance improvement of solar thermal power generation
929
Thermal performance improving for small form factor BGA
930
Thermal performance investigation of DQW GaInNAs laser diodes
931
Thermal performance investigation of three-dimensional structure unit in double-sided cooling IGBT module
932
Thermal performance limits of polymer composite pin fin heat sinks
933
Thermal performance limits of the QFP family
934
Thermal performance limits of the QFP family
935
Thermal performance measurement for confined heat sinks
936
Thermal performance modeling of hybrid liquid-air cooled servers
937
Thermal performance modeling of power cable joints
938
Thermal performance of 1.55μm InGaAlAs quantum well buried heterostructure lasers
939
Thermal performance of 3D ICs: Analysis and alternatives
940
Thermal performance of a Direct-Bond-Copper Aluminum Nitride manifold-microchannel cooler
941
Thermal performance of a double-action pulsed jet CPU cooler
942
Thermal performance of a dual 1.2 kV, 400 a silicon-carbide MOSFET power module
943
Thermal performance of a hybrid photovoltaic-thermal collector with a modified absorber
944
Thermal performance of a plate-fin heat sink with a shield
945
Thermal performance of a power electronics module made by thick-film planar interconnection of power devices
946
Thermal performance of a solder-coated optical fiber Bragg grating sensor
947
Thermal performance of a thermoelectric air-cooling system with heat sinks
948
Thermal performance of a thin high interconnect density organic substrate for flip-chip applications
949
Thermal Performance of a Three-Phase Induction Motor Under Fault Tolerant Operating Strategies
950
Thermal Performance of a Three-Phase Induction Motor Under Fault Tolerant Operating Strategies
951
Thermal Performance of a Vapor Chamber Heat Pipe with Diamond-Copper Composition Wick Structures
952
Thermal performance of air-cooled hybrid heat sinks for a low velocity environment
953
Thermal performance of aluminum-foam heat sinks by forced air cooling
954
Thermal performance of an air-cooled plastic ball grid array package in natural and forced convection
955
Thermal performance of an elliptical pin fin heat sink
956
Thermal performance of an integral immersion cooled multichip module package
957
Thermal performance of an integral immersion cooled multichip module package
958
Thermal performance of an MCM flip-chip assembly in liquid nitrogen
959
Thermal Performance of an Open-Slot Modular-Wound Machine With External Rotor
960
Thermal performance of baseplate and direct substrate cooled power modules
961
Thermal performance of box-type solar cooker with inbuilt paraboloid reflector
962
Thermal performance of building attached sunspace in Jordan climate
963
Thermal Performance of Carbon Nanotube-Based Composites Investigated by Molecular Dynamics Simulation
964
Thermal performance of CMOS-SOI transistors from weak to strong inversion
965
Thermal performance of collector-up HBTs for small high-power amplifiers with a novel thermal via structure underneath the HBT fingers
966
Thermal performance of cooling system for red, green and blue LED light source for rear projection TV
967
Thermal Performance of Data Centers-Rack Level Analysis
968
Thermal Performance of Direct Buried Pipe-Type Cable Splices
969
Thermal Performance of Direct Buried Pipe-Type Cable Splices
970
Thermal Performance of Distribution Transformers in Underground Vaults: I - The Problem
971
Thermal Performance of Distribution Transformers in Underground Vaults: II - Mathematical Model
972
Thermal performance of double-sided SMT capacitors: Operation and soldering
973
Thermal performance of dual piezoelectric cool jet for ultra-thin mobile applications
974
Thermal performance of embedded active chips
975
Thermal performance of embedded heat pipe in high power density LED streetlight module
976
Thermal performance of FC
M
BGA: Exposed molded die compared to lidded package
977
Thermal performance of ferrule designs for medium voltage cable jointing
978
Thermal performance of flip chip ball grid array packages
979
Thermal performance of flip chip using finite element method
980
Thermal performance of heatsink and thermoelectric cooler packaging designs in LED
981
Thermal performance of high power LED package based on LTCC
982
Thermal performance of horizontal closed-loop ground-coupled heat pump systems using flowable-fill
983
Thermal performance of IMS™ dielectrics: data and prediction
984
Thermal performance of Inkjet-assisted spray cooling in a closed system
985
Thermal performance of Landsat-7 ETM+ instrument during first year in flight
986
Thermal performance of LED packages for solid state lighting with novel cooling solutions
987
Thermal performance of metal-clad fiber Bragg grating sensors
988
Thermal performance of metamorphic double heterojunction bipolar transistors with InP and InAlP buffer layers
989
Thermal Performance of Microchannels With Wavy Walls for Electronics Cooling
990
Thermal performance of microchannels with wavy walls for electronics cooling
991
Thermal performance of miniature loop heat pipe operating under different heating modes
992
Thermal performance of multiple piezoelectric-magnetic fans
993
Thermal performance of naturally ventilated test building with pitch and ceiling insulation
994
Thermal performance of non-metallic two-phase cold plates for humanoid robot cooling
995
Thermal performance of novel thin heat pipe
996
Thermal performance of oxide-free lithographic VCSELs
997
Thermal performance of packed bed solar air heater
998
Thermal performance of PCM-cooled mobile phone
999
Thermal performance of photonic crystal waveguiding devices based on GaInNAs/GaInAs quantum-wells
1000
Thermal performance of plastic-encapsulated and hermetically sealed components for automotive applications
