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1
Thermal performance of power packages-single-inline package as a case study
2
Thermal performance of single- and joint-extrusions with discrete heat sources
3
Thermal performance of smart heat sinks for cooling high power LED modules
4
Thermal performance of specific heat receiver concepts for advanced solar dynamic applications
5
Thermal Performance of Splices and Terminals in Pipe-Type Cable Systems
6
Thermal Performance of Splices and Terminals in Pipe-Type Cable Systems
7
Thermal performance of stress grading systems for converter-fed motors
8
Thermal performance of sub-atmospheric loop thermosyphon with and without enhanced boiling surface
9
Thermal performance of tape based ball grid array over molded packages
10
Thermal performance of the 28×28 mm QFP PowerQuad2
11
Thermal performance of the IC package integrated with micro- thermoelectric device
12
Thermal performance of the launcher mirrors in the DIII-D ECH system
13
Thermal Performance of the Multilayered Honeycomb Microchannel Heat Sink
14
Thermal performance of the rotor of the MIT-EPRI 3 MVA superconducting alternator
15
Thermal Performance of the SunPower Alpha-2 PV Concentrator
16
Thermal performance of the SunPower Alpha-2 PV-concentrator
17
Thermal performance of thermoelectric cooler (tec) integrated heat sink and optimizing structure for low acoustic noise / power consumption
18
Thermal performance of trunk-mounted mobile equipment
19
Thermal performance of underfilled BGAs
20
Thermal performance of underground power cables with constant and cyclic currents in presence of moisture migration in the surrounding soil
21
Thermal performance of Various heat sinks
22
Thermal performance of water-cooled heat sinks
23
Thermal performance of water-cooled heat sinks: a comparison of two different designs
24
Thermal performance optimization of smooth flat plate solar air heater (SFPSAH) using simulated annealing: Evaluation and comparisons
25
Thermal Performance Prediction of QFN Packages using Artificial Neural Network (ANN)
26
Thermal performance research of plastic helical gear and steel worm transmission
27
Thermal Performance Simulation of a Model Coil for a 40-T Hybrid Magnet
28
Thermal performance study of a parabolic trough collectoer based on heat transfer oil
29
Thermal performance study of direct attached high-power LEDs using an innovative submount technique
30
Thermal performance study of next generation fine-pitch chip-on-film (COF) packages — A numerical study
31
Thermal performance study of next generation fine-pitch chip-on-film (COF) packages — A numerical study
32
Thermal Performance Study on Pulsed Inductor
33
Thermal performance study on pulsed inductor
34
Thermal performance test of U-type evacuated glass tubular solar collector filled with graphite
35
Thermal phase compensation in fiber-optic interferometers
36
Thermal phase noise in coherent optical-fibre systems
37
Thermal Phase Noise Measurements in Optical Fiber Interferometers
38
Thermal phenomena during the encapsulation of electronic devices
39
Thermal phenomena in compact electronic enclosures: a numerical study
40
Thermal phenomena in compact electronic enclosures: a numerical study
41
Thermal phenomena in deeply scaled MOSFETs
42
Thermal phenomena in nanoscale transistors
43
Thermal phenomena in nanoscale transistors
44
Thermal phenomena in nanoscale transistors - Keynote Speaker
45
Thermal phenomena in silicon-germanium molecular beam epitaxial growth
46
Thermal physical model for Ge
2
Sb
2
Te
5
phase change memory in electrical memory device
47
Thermal physics investigation of alternate systems with D-
3
HE plasma
48
Thermal physics-entropy and free energies - Book Review
49
Thermal Physiological Moment Invariants for Face Identification
50
Thermal physiological pose-based moment invariants for face identification
51
Thermal pinching at low fields in n-type germanium
52
Thermal pipeline sensor placement model for fault detection
53
Thermal placement algorithm based on heat conduction analogy
54
Thermal placement for high-performance multichip modules
55
Thermal placement optimization for embedded resistances based on orthogonal design and fuzzy genetic algorithm
56
Thermal placement optimization of MCMs using a force-directed based algorithm
57
Thermal plant bids and market clearing in an electricity pool. Minimization of costs vs. minimization of consumer payments
58
Thermal Plants for "Firming up" Hydro
59
Thermal Plants Optimization Using Fuzzy Logic Controller
60
Thermal plasma crystal growth
61
Thermal Plasma Cvd Of Diamond: Relation Between Flow Velocity And Film Growth Chemistry
62
Thermal plasma deposition of nanostructured films
63
Thermal plasma in-flight treatment of electroplating sludge
64
Thermal plasma processes for use in research and development
65
Thermal plasma processes for use in research and development
66
Thermal plasma processing
67
Thermal plasma processing of B/sub 4/C and Al-B/sub 4/C nanopowders
68
Thermal plasma treatment of electroplating sludge
69
Thermal Plasma Vitrification of MSWI Fly Ash Mixed With Different Biomass Ashes
70
Thermal plasmas
71
Thermal plasmas properties in gas or gas-vapour mixtures
72
Thermal plasmomechanical infrared detector
73
Thermal Plume Monitoring with Temperature Recording Drogues
74
Thermal polarization mechanisms on 0-3 type ferroelectric composites based on PVDF
75
Thermal pole-tip protrusion analysis of magnetic heads for hard disk drives
76
Thermal pole-tip protrusion analysis of magnetic heads for hard disk drives
77
Thermal poling studies in phosphate glasses
78
Thermal portraits of objects in the MM and IR wave bands
79
Thermal positive-ionic and electronic emissions from iridium heated in vacua
80
Thermal positive-ionic and electronic emissions from iridium heated in vacua
81
Thermal Potential of Flat Evaporator Miniature Loop Heat Pipes for Notebook Cooling
82
Thermal Power Control of the NRU Reactor
83
Thermal power enterprise’s total factor productivity model and its application
84
Thermal power generation scheduling by simulated competition
85
Thermal power generation system fault diagnosis method based on Multilevel Flow Models
86
Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Concept
87
Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Implementation
88
Thermal power plant analysis using artificial neural network
89
Thermal power plant as contributed by coal mill control
90
Thermal power plant dynamics identification
91
Thermal power plant start-up scheduling with evolutionary computation by using an enforcement operator
92
Thermal power plants for peak-load and emergency service
93
Thermal power prediction of nuclear power plant using neural network and parity space model
94
Thermal power satellite design and mass calculation
95
Thermal prediction and scheduling of network applications on multicore processors
96
Thermal prediction of a fault tolerant permanent magnet vernier machine
97
Thermal pre-dimensioning methodology based on thermal impedance
98
Thermal preparation as a way for complex solution for challenges in contemporary power engineering
99
Thermal preparation of highly stable glass periodic changes with nano-scale resolution using a laser-inscribed hydrogen loaded seed template
100
Thermal preprocessing to shorten flows, simplify lithography, and radically reduce processing cycle time
101
Thermal pressure control: regulation of high-pressure gas by exploitation of temperature sensitivity
102
Thermal printer
103
Thermal printer
104
Thermal probe measurements of energy flux onto a substrate during ICP assisted sputter-deposition
105
Thermal problems caused by harmonic frequency leakage fluxes in 3-phase, 3-winding converter transformers
106
Thermal problems caused by harmonic frequency leakage fluxes in three-phase, three-winding converter transformers
107
Thermal Problems Caused by Harmonic Frequency Leakage Fluxes in Three-Phase, Three-Winding Converter Transformers
108
Thermal Problems in Gas-Insulated Transmission Lines Solved by the Finite-Element Method
109
Thermal process robust identification using wavelet de-noise and least-squares method
110
Thermal Process System Identification Using Particle Swarm Optimization
111
Thermal Processes and Peculiarities of Multilayer Coating Structure based on Cr20Ag20 Obtained by Electronic Radial Deposition
112
Thermal processes and stability of longitudinal magnetic recording media
113
Thermal processes driving laser-welding for module interconnection
114
Thermal processes effecting upon waveform shaping in autodyne gunn diode oscillators
115
Thermal processes in a streamer discharge in water
116
Thermal processes in the bolometric measurer of laser radiation characteristics
117
Thermal processing effects in proton-isolated n-type GaAs devices
118
Thermal processing equipment
119
Thermal processing equipment
120
Thermal processing for continued scaling of semiconductor devices
121
Thermal processing impact on the integrity of HfO
2
-based high-k gate dielectrics
122
Thermal processing of EVA encapsulants and effects of formulation additives [for solar cells]
123
Thermal processing of labile materials: a kinetic approach
124
Thermal processing of spray-pyrolyzed and electrodeposited Tl superconductor films and optimization of the transport critical current density
125
Thermal Processing of Tantalum Nitride Resistors
126
Thermal Processing with Maximized Simplicity and Energy Efficiency
127
Thermal processing, morphology and electrical strength of polyethylene
128
Thermal profile analysis of Doubly-Fed induction generator based wind power converter with air and liquid cooling methods
129
Thermal profile measurements of a Luneberg lens
130
Thermal profile of high power laser diode arrays and implications in line-narrowing using external cavities
131
Thermal profile reconstruction in the steady state during microwave hyperthermia based on microwave radiometry measurements: bidimensional aspects
132
Thermal profiles in footwear design: an in-sole measurement system
133
Thermal profiling of gain saturation in semiconductor optical amplifiers
134
Thermal profiling of photonic integrated circuits by thermoreflectance microscopy
135
Thermal profiling of residential energy use
136
Thermal Profiling of Residential Energy Use
137
Thermal profiling of silicon solar cells during the metallization process
138
Thermal Profiling to Overcome Flux Residue Formation in a No-clean Solder Paste for Lead-free Surface Mount Technology
139
Thermal profiling: locating the onset of gain saturation in semiconductor optical amplifiers
140
Thermal prognosis of dry-type transformer: Simulation study on load and ambient temperature impacts
141
Thermal properties and application at microwave frequency of double-layered garnet films
142
Thermal properties and behaviour of gain profiled semiconductor lasers
143
Thermal properties and degradation of Phenolic Resin/Zn composite films
144
Thermal properties and electric field profile in metallized dielectric film adhesively bonded to substrate
145
Thermal Properties and Heat Transfer in Concrete Filled Steel Tube Reinforced Concrete Columns Exposed to Fire
146
Thermal properties and passband improvement of high index contrast micro-ring resonator by phase error correction
147
Thermal properties and power capability of helix structures for millimeter waves
148
Thermal Properties and Reliability of GaN Microelectronics: Sub-Micron Spatial and Nanosecond Time Resolution Thermography
149
Thermal properties and temperature distribution of epoxy composite with micro and nano AlN for molded transformer
150
Thermal properties and thermal instabilities of InP-based heterojunction bipolar transistors
151
Thermal properties measurements using laser flash technique at cryogenic temperature
152
Thermal Properties of 12-Fold Quasi-Photonic Crystal Microcavity Laser With Size-Controlled Nano-Post for Electrical Driving
153
Thermal Properties of a Dusty Plasma in the Presence of Driven Dust Acoustic Waves
154
Thermal properties of a special commuter vehicle concept
155
Thermal properties of Ag sintered layer used as interconnect material in microelectronics packaging
156
Thermal Properties of AlGaN/GaN HFETs on Bulk GaN Substrates
157
Thermal properties of Aluminum&PVC co-extrusion sliding window
158
Thermal properties of an erbium-doped fibre amplifier
159
Thermal properties of buried-heterostructure laser diodes
160
Thermal properties of CNT reinforced semiconductive shield materials used in power cables
161
Thermal properties of commercial thermoelectric modules
162
Thermal Properties of Composites Filled with Different Fillers
163
Thermal Properties of Environmentally Friendly Dielectrics used in Medium Voltage Circuit Breakers
164
Thermal properties of etched-well surface-emitting semiconductor lasers
165
Thermal properties of fibre Bragg gratings inscribed point-by-point by infrared femtosecond laser
166
Thermal properties of high-power transistors
167
Thermal properties of impregnating materials for stable superconducting magnets
168
Thermal properties of interconnects in power MOSFETs
169
Thermal properties of LDPE/silica nanocomposites
170
Thermal Properties of Magnetic Nanoparticles Modified With Polyethylene Glycol
171
Thermal Properties of Metal Oxide Surge Arresters
172
Thermal Properties of Metal Oxide Surge Arresters
173
Thermal Properties of Metal-Coated Vertically-Aligned Single Wall Nanotube Films
174
Thermal properties of metamorphic buffer materials for growth of InP double heterojunction bipolar transistors on GaAs substrates
175
Thermal properties of multi-walled carbon nanotube-reinforced polypropylene composites
176
Thermal properties of oxide free nano non noble metal for low temperature interconnect technology
177
Thermal properties of polycrystalline Garnets and Ferrites
178
Thermal properties of post-size controlled 12-fold quasi-photonic crystal microcavity for electrically-driving
179
Thermal properties of power HBT´s
180
Thermal properties of power Si MOSFET by considering electron - Phonon scattering using Monte Carlo Simulation
181
Thermal Properties Of Proton-implanted Top-surface Emitting Microlasers In Linear And Nonlinear Regimes
182
Thermal properties of quantum transition process in piezoelectric materials based on the projected Liouville equation.
183
Thermal Properties of ReBCO Copper Stabilized Superconducting Tapes
184
Thermal properties of semiconductor lasers, and the interpretation of thermal-resistance measurements
185
Thermal properties of semiconductor oxide-confinement vertical-cavity lasers
186
Thermal properties of SiC-ceramics substrate interface made by silver glass composition
187
Thermal properties of Silicon compatible GaNAsP SQW lasers
188
Thermal Properties of Silicon Nitride Beams Below One Kelvin
189
Thermal Properties of Spin Torque Oscillators: Singularity in Effective Energy
190
Thermal properties of superion Li/sup +/ conducting materials
191
Thermal properties of synthetic ester-based transformer oil during ageing in laboratory conditions
192
Thermal properties of the Burrus-type light-emitting diode: Part I—The model
193
Thermal properties of the Burrus-type light-emitting diode: Part II—The results
194
Thermal properties of the monoclinic KGd(PO
3
)
4
195
Thermal properties of thin films measured by photothermal methods
196
Thermal Properties of Tin/Silver Alloy Nanoparticles for Low Temperature Lead-free Interconnect Technology
197
Thermal Properties of Tissue Equivalent Phantom Materials
198
Thermal properties of two titanium alloy dental implants — Linear behaviour and calorimetric analysis
199
Thermal Properties of Ultrathin Hafnium Oxide Gate Dielectric Films
200
Thermal properties of very fast transistors
201
Thermal properties of whole-solid-insulated polymeric ZnO surge arrester
202
Thermal properties of Y
3
Al
5
O
12
, GdVO
4
, and YVO
4
203
Thermal properties on high fill factor electrical windings: Infiltrated vs non infiltrated
204
Thermal property analysis of boron nitride-filled glass-fiber reinforced polymer composites
205
Thermal property determination of laminar-flowing fluids utilizing the frequency response of a calorimetric flow sensor
206
Thermal property measurement using a thermal wave generator
207
Thermal property of magnetic materials for hydrogen magnetic refrigeration and effect of magnetic field on them
208
Thermal protection for successively starting three phase induction motors using Particle Swarm Optimization technique
209
Thermal protection of an 80V silicon-on-insulator LDMOS transistor for power-over-Ethernet applications
210
Thermal Protection of Induction Motors Enhanced by Interactive Electrical and Thermal Models
211
Thermal Protection of Induction Motors Enhanced by Interactive Electrical and Thermal Models
212
Thermal Protection of Laundry-Appliance Motors
213
Thermal protection of overhead lines in different ambient conditions
214
Thermal protection of transformers under overload conditions
215
Thermal protection of transformers under overload conditions
216
Thermal protection of undocumented ac motors
217
Thermal Protection of Vector-Controlled IM Drive Based on DC Current Injection
218
Thermal protection of vehicle payloads using phase change materials and liquid cooling
219
Thermal Protection or Transformers Under Overload Conditions
220
Thermal protection-, aerodynamics- and control simulation of an electromagnetically launched projectile
221
Thermal Protection, Aerodynamics, and Control Simulation of an Electromagnetically Launched Projectile
222
Thermal protrusion of thermally assisted magnetic recording for binary gas mixture with temperature
223
Thermal Protrusion-Induced Air Bearing Slider Instability at Disk Proximity and Light Contact
224
Thermal proximity imaging of hard-disk substrates
225
Thermal proximity sensing for hard disks
226
Thermal pulse investigation of the generation, transport, and trapping of space charge in microelectronics buried oxide structures
227
Thermal pulse measurements on electron-beam irradiated fluoroethylene-propylene copolymer
228
Thermal pulse method with an applied field
229
Thermal pulse study of the electric polarization in P(VDCN-VAc)
230
Thermal pulsed-plasma technology for hazardous waste treatment
231
Thermal pyrolytic graphite composite with coefficient of thermal expansion matching for advanced thermal management
232
Thermal qualification of 3D stacked die packages
233
Thermal qualification of 3D stacked die structures
234
Thermal Quench Behaviors of No-Insulation Coils Wound Using GdBCO Coated Conductor Tapes With Various Lamination Materials
235
Thermal Quench in HTS Double Pancake Race Track Coil
236
Thermal quenching of Ce
3+
: YAG glass-ceramic phosphor
237
Thermal Radiation Detectors
238
Thermal Radiation from Finned Heat Sinks
239
Thermal radiation material for electronic devices applications
240
Thermal radiation of hyperbolic metamaterials and metallic surfaces
241
Thermal Radio Radiation from the Moon and Planets
242
Thermal radio radiation from the moon and planets
243
Thermal rating characteristics of UHF power capacitors
244
Thermal rating implications of the co-location of HV cable circuits in tunnels
245
Thermal rating monitoring of the TNB overhead transmission line using line ground clearance measurement and weather monitoring techniques
246
Thermal rating of overhead line wire
247
Thermal Rating of Overhead Line Wire
248
Thermal rating of overhead line wire
249
Thermal rating of transformers. Application of the multiflow principle to naturally cooled transformers
250
Thermal rating of transformers. Introduction of multiflow principle
251
Thermal ratings of cable insulation and clarifying tests
252
Thermal RC-network approach to analyze multichip power packages
253
Thermal real-time monitoring of a gearbox integrated electric rear axle drive for hybrid electric traction
254
Thermal Recovery of an Arc Track
255
Thermal recovery of degraded space silicon solar cells due to large fluence irradiation
256
Thermal recovery process prediction in a self-blast interrupter with the generation of swirling flow
257
Thermal Rectifier Based on p-n Junction
258
Thermal recycling of used vegetable oil in an university campus
259
Thermal Re-Emission of Trapped Hot Electrons in NMOS Transistors
260
Thermal re-emission of trapped hot electrons in NMOS transistors
261
Thermal Regeneration in Etched-Core Fiber Bragg Grating
262
Thermal regimes in optical glass modification by the ultra-short laser pulses
263
Thermal regulation as control reference in electric drives
264
Thermal regulation of double oven controlled crystal oscillator, DOCXO
265
Thermal regulator for IC temperature characterization using a microprobe station
266
Thermal Relationships in an Induction Motor under Normal and Abnormal Operation
267
Thermal relaxation in exchange coupled ferromagnet/antiferromagnet bilayers
268
Thermal relaxation in perpendicular double-layered media
269
Thermal Relaxation In Perpendicular Double-layered Media
270
Thermal relaxation in the strong-demagnetizing limit
271
Thermal relaxation times in the trapped-flux storage device
272
Thermal reliability & IMC behavior of low cost alternative Au-Ag-Pd wire bonds to Al metallization
273
Thermal reliability analysis of non-gate dielectric film in IEC-GCT
274
Thermal reliability analysis of polymeric materials for PV technology
275
Thermal reliability considerations for Deployment of area array packages in harsh environments
276
Thermal reliability evaluation of PLCC packaging using scanning acoustic microscopy
277
Thermal reliability of Ag-8Au-3Pd alloy wire bonds
278
Thermal reliability of Bragg gratings written in hydrogen-sensitized fibers
279
Thermal Reliability of Cu/low -κ(Black-Diamond
TM
, BD) Interconnects on Flexible Organic Substrate
280
Thermal reliability of fine pitch Cu-Cu bonding with self assembled monolayer (SAM) passivation for Wafer-on-Wafer 3D-Stacking
281
Thermal reliability of power insulated gate bipolar transistor (IGBT) modules
282
Thermal remagnetization of Co
5
Sm magnets
283
Thermal Remote Phosphor Coating for Phosphor-Converted White-Light-Emitting Diodes
284
Thermal remote sensing for earth science applications
285
Thermal remote sensing for examining the relationship between urban Land surface Temperature and land use/cover in Tabriz city, Iran
286
Thermal remote sensing for land surface temperature monitoring: Maraqeh County, Iran
287
Thermal Remote Sensing For Walrus Population Assessment In The Canadian Arctic.
288
Thermal remote sensing with an autonomous unmanned aerial remote sensing platform for surface stream temperatures
289
Thermal requirements for electronic equipment cabinets exposed to outdoor environments
290
Thermal requirements in future 3D processors
291
Thermal Requirements of Resistors used in Circuit Breakers for Transient Voltage Control
292
Thermal research on material and structure of High-Power-LED module
293
Thermal residual stresses in functionally graded structures: A didactic case study
294
Thermal resilience of polymer-coated double-clad fiber
295
Thermal resilient bounded-skew clock tree optimization methodology
296
Thermal resistance (Rth) enhancement by optimizing TO package thermal contact
297
Thermal resistance (Rth) enhancement by optimizing to package thermal contact
298
Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization. I. Fundamentals and theory
299
Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization. II. Practice and experiments
300
Thermal resistance analysis by numerical method for power device packaging
301
Thermal Resistance Analysis of a Multi-Stack Flip Chip 3-D Package
302
Thermal resistance analysis of high power LED module under power cycling test
303
Thermal resistance analysis of high power LEDs with multi-chip package
304
Thermal resistance analysis of high power light emitting diodes
305
Thermal resistance analysis related to the degradation of GaAs-Based laser diodes
306
Thermal Resistance and Heat Spreading Characterization Platform for Concentrated Photovoltaic Cell Receivers
307
Thermal Resistance and Reliability of High-Power LED Packages Under WHTOL and Thermal Shock Tests
308
Thermal resistance and reliability of low-cost high-power LED packages under WHTOL test
309
Thermal resistance and temperature distribution in double-heterostructure lasers: Calculations and experimental results
310
Thermal resistance between cable and duct
311
Thermal resistance calculation of AlGaN/GaN on SiC devices
312
Thermal resistance calculation of AlGaN-GaN devices
313
Thermal resistance characterization of 200 GHz F
t
InGaAs/InAlAs HBTs
314
Thermal resistance characterization of implanted subcollector InP-based HBTs
315
Thermal resistance comparison of high power infrared emitter
316
Thermal resistance degradation of alloy die attached power devices during thermal cycling
317
Thermal resistance evaluation of a three-dimensional (3D) chip stack
318
Thermal resistance evaluation of high-speed VCSELs: an isothermal optical transient technique
319
Thermal Resistance Extraction of Power Transistors using Electric Field Simulation
320
Thermal resistance in Si
1-x
Ge
x
HBTs on bulk-Si and SOI substrates
321
Thermal resistance in trench-isolated Si/SiGe heterojunction bipolar transistors
322
Thermal resistance investigations on new leadframe-based LED packages and boards
323
Thermal resistance measurement of avalanche diodes
324
Thermal resistance measurement of discrete capacitors
325
Thermal Resistance Measurement of LED Package with Multichips
326
Thermal resistance measurement of LEDswith multi-chip packages
327
Thermal resistance measurements and finite element calculations for ceramic hermetic packages
328
Thermal resistance measurements and reliability of GaAs power MESFETs
329
Thermal resistance measurements for AlGaAs/GaAs heterojunction bipolar transistors
330
Thermal resistance measurements of interconnections and modeling of thermal conduction path, for the investigation of the thermal resistance of a three-dimensional (3D) chip stack
331
Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack
332
Thermal resistance measurements of interconnections, for the investigation of the thermal resistance of a three-dimensional (3D) chip stack
333
Thermal resistance measurements of microwave devices
334
Thermal resistance measurements of the surfaces of various materials in room temperature to 50 K
335
Thermal resistance measurements on monolithic and hybrid Darlington power transistors
336
Thermal resistance modeling for the electrothermal layout of high-power RF transistors
337
Thermal resistance modeling for the electrothermal layout of high-power RF transistors
338
Thermal resistance modeling of linear motor driven stages for chip mounter applications
339
Thermal resistance modelling of RF high power bipolar transistors
340
Thermal resistance of (H)BTs on bulk Si, SOI and glass
341
Thermal resistance of AlGaN/GaN HEMTs on SopSiC composite substrate
342
Thermal resistance of GaAs field-effect transistors
343
Thermal resistance of gallium-arsenide field-effect transistors
344
Thermal Resistance of IC Packages
345
Thermal resistance of light-emitting diodes
346
Thermal resistance of metamorphic InP-based HBTs on GaAs substrates using a linearly graded In
x
Ga
1-x
P metamorphic buffer
347
Thermal resistance of MIS mesa varactors
348
Thermal resistance of optical ground wire to direct lightning strike
349
Thermal resistance of planar semiconductor structures
350
Thermal resistance of power submicron heterojunction field-effect transistors
351
Thermal Resistance of SiGe HBTs at High Power Densities
352
Thermal Resistance of Snap-In Type Aluminum Electrolytic Capacitor Attached to Heat Sink
353
Thermal resistance of snap-in type aluminum electrolytic capacitor attached to heat sink
354
Thermal resistance of the helical slow-wave system made by a method of solid-phase compound of ceramic-metal elements
355
Thermal resistance of the semiconductor structures for a photomixing device
356
Thermal resistance of top-surface-emitting vertical-cavity diode lasers and monolithic two-dimensional arrays
357
Thermal resistance of top-surface-emitting vertical-cavity semiconductor lasers and monolithic two-dimensional arrays
358
Thermal resistance of VCSELs bonded to integrated circuits
359
Thermal resistance reduction in power MOSFETs integrated in a 65nm SOI technology
360
Thermal resistance, thermomechanical stress and thermal cycling endurance of silicon chips bonded with adhesives
361
Thermal Resistance: A Reliability Consideration
362
Thermal resistance-based bounds for the effective conductivity of composite thermal interface materials
363
Thermal resistivity of quaternary solid solutions InGaSbAs and GaAlSbAs lattice-matched to GaSb
364
Thermal resistivity of soil
365
Thermal response analysis of variable stiffness of piezoelectric cylindrical shell
366
Thermal response and thermal-hydraulic analysis of PFC baking for SST-1 tokamak
367
Thermal response measurements for semiconductor device die attachment evaluation
368
Thermal Response Model of a Simulated Cranial Structure Exposed to Radiofrequency Radiation
369
Thermal Response of a Lossy Two-Ports to a Correlation Radiometer
370
Thermal response of a three core belted PILC cable under varying load conditions
371
Thermal response of bimetallic conductors under surge currents taking the skin effect into account
372
Thermal response of coated steel conductors under surge currents taking the skin effect into account
373
Thermal response of copper oxide superconducting thin films
374
Thermal response of cutaneous thermoreceptors: A new criterion for the human body thermal sensation
375
Thermal response of integrated circuit input devices to an electrostatic energy pulse
376
Thermal response of materials to pulsed laser radiation
377
Thermal Response of Microwave Transistors Under Pulsed Power Operation
378
Thermal response of the ultra-performance BGA heat sink in ducted and unducted flow conditions...an experimental investigation
379
Thermal Response Of TXV-controlled Heat Pump Systems Operating With Refrigerant Mixtures
380
Thermal response to DVFS: analysis with an Intel Pentium M
381
Thermal responses of in vivo skin irradiated by 1,064 nm multiple pulse Nd:YAG laser
382
Thermal reversal of elongated ferromagnetic particles misoriented to the applied field
383
Thermal Reversal of Magnetic Grains Under Arbitrary Time Varying Pulse Field
384
Thermal Reversal of Magnetic Grains Under Time Varying Pulse Field
385
Thermal rhythmography-topograms of the spectral analysis of fluctuations in skin temperature
386
Thermal Robustness of Silicon-on-Insulator Versus Bulk Material in L-Band RF Power LDMOSFETs
387
Thermal rollover characteristics up to 150/spl deg/C of buried-stripe type 980-nm laser diodes with a current injection window delineated by a SiN
x
layer
388
Thermal runaway - How to halt it and recover from it + How to detect it and prevent it
389
Thermal runaway analysis of high power AlGaAs/GaAs heterojunction bipolar transistors
390
Thermal runaway and resistive properties of a Bi2223 pancake coil subjected to overcurrent
391
Thermal runaway avoidance during burn-in
392
Thermal runaway behaviour of VRLA batteries
393
Thermal Runaway Characteristics of Bi2212 Coil for Conduction-Cooled SMES
394
Thermal runaway characteristics of silicon microstrip module designed for ATLAS upgrade inner tracker at super LHC
395
Thermal runaway evaluation for high temperature TRIACS
396
Thermal runaway evaluation for new high-temperature Triacs in steady-state operation
397
Thermal runaway in integrated circuits
398
Thermal runaway in multijunction solar cells
399
Thermal runaway of a 1 T cryocooler-cooled oxide Superconducting pulsed coil in Ac operation
400
Thermal runaway of IMPATT diodes
401
Thermal Runaway of the 13 kA Busbar Joints in the LHC
402
Thermal runaway of VRLA batteries: published test methods versus real life experience
403
Thermal runaway prediction based on electrothermal models in nanotechnologies
404
Thermal runaway prevention by control of float voltage as a function of a battery temperature
405
Thermal Runaway Prevention in Arc Spots
406
Thermal runaway-a system solution for a system problem
407
Thermal Runaways in LHC Interconnections: Experiments
408
Thermal Safe High Level Test Synthesis for Hierarchical Testability
409
Thermal Safety Analysis of Capsule Endoscope
410
Thermal safety management of lithium-ion battery energy storage systems for use in ocean-going and subsea applications
411
Thermal satellite data for earthquake research
412
Thermal scaling consideration of Si MOSFETs with gate length typically larger than 100 nm
413
Thermal scaling of ultra-thin SOI: reduced resistance at low temperature RTA
414
Thermal scanning dielectric instrumentation-the PL-dielectric thermal analyser
415
Thermal Select MRAM with a 2-bit Cell Capability for beyond 65 nm Technology Node
416
Thermal self-actions of laser beams
417
Thermal self-limiting effects in the long-term AC stress on n-channel LDD MOSFETs
418
Thermal sensing performance of lateral SOI PIN diodes in the 90–400 K range
419
Thermal Sensing With Lithographically Patterned Bimetallic Thin-Film Thermocouples
420
Thermal sensitivities and d/sub eff/´s for second harmonic generation (SHG) In LaCa/sub 4/O(BO/sub 3/)/sub 3/ (LaCOB) and GdCa/sub 4/O(BO/sub 3/)/sub 3/ (GdCOB) compared to LiB/sub 3/O/sub 5/ (LBO)
421
Thermal sensitivity analysis for TEFC induction motors
422
Thermal sensitivity analysis for the 119 PBGA-a framework for rapid prototyping
423
Thermal sensitivity analysis for the 119 PBGA-a framework for rapid prototyping
424
Thermal sensitivity analysis of on-chip interconnects
425
Thermal sensitivity of a DMTD used in a composite clock
426
Thermal sensitivity of an rf SQUID
427
Thermal sensitivity of elastic coefficients of langasite and langatate
428
Thermal Sensitivity of the Birefringence of Air-Core Fibers and Implications for the RFOG
429
Thermal sensitivity of transverse waves on thin quartz plates
430
Thermal Sensitivity of UBM Adhesion in WLCSP
431
Thermal Sensor Allocation and Placement for Reconfigurable Systems
432
Thermal sensor allocation for SoCs based on temperature gradients
433
Thermal sensor and test technology improving for automotive ICS
434
Thermal sensor based multi-occupancy motion tracking and visualisation in smart environments
435
Thermal sensor design for 3D ICs
436
Thermal sensor distribution method for 3D Integrated Circuits using efficient thermal map modeling
437
Thermal sensor microfabrication and related undergraduate research projects
438
Thermal Sensor Using Poly-Si Thin-Film Transistor With Widened Detectable Temperature Range
439
Thermal Sensor Using Poly-Si Thin-Film Transistors With Self-Aligned and Offset Gate Structures
440
Thermal sensor variation reduction in deep sub 100nm process technologies
441
Thermal sensors based on ytterbium-erbium doped nano-glassceramics
442
Thermal Shearing Effects on the Temperature Stability of SAW Devices
443
Thermal Shift in Electrical Behavior of Substrate Materials with Improved Flame Resistance
444
Thermal shifts of the spectral lines in the /sup 4/F/sub 3/2/ to /sup 4/I/sub 11/2/ manifold of an Nd:YAG Laser
445
Thermal shock analysis of windows interacting with energetic, focused beam of the BNL muon target experiment
446
Thermal shock and drop test performance of lead-free assemblies with no-underfill, corner-underfill and full-underfill
447
Thermal shock and thermal NF
3
in-situ furnace cleaning
448
Thermal shock behavior of ceramic dielectrics
449
Thermal shock fatigue enhancement of solder joints by using novel reinforcing fabrics
450
Thermal shock problem of piezoelectric materials with temperature-dependent properties
451
Thermal Shock Reliability Analysis Of Insulated Metal Substrates(IMS)
452
Thermal shock reliability tests of multilayer LTCC modules with thick film conductors
453
Thermal shock structural analyses of a positron target
454
Thermal Shocks Due to Repeated Moderate Arcing on Line Insulators
455
Thermal shunt approach for microwave power heterojunction bipolar transistors-a review (invited)
456
Thermal shutdown characteristics of insulating materials used in lithium ion batteries
457
Thermal Sigma-Delta Modulator: A Temperature Measurement Application
458
Thermal signal analysis in smart home environment for detecting a human presence
459
Thermal signal behaviour for air flow measurements as fundamentals to Time-of-Flight
460
Thermal signals in MR heads due to asperity contacts
461
Thermal signature: A simple yet accurate thermal index for floorplan optimization
462
Thermal signatures for breast cancer screening comparative study
463
Thermal signatures for pattern recognition approach applied to induction motor diagnosis
464
Thermal Signatures of Emotional Arousal: A Functional Infrared Imaging Study
465
Thermal simulation analysis of high power LED system using two-resistor compact LED model
466
Thermal simulation and analysis of intelligent power module (IPM) package
467
Thermal simulation and characterization for the design of ultra-low power micro-hotplates on flexible substrate
468
Thermal simulation and design of a GaAs HBT sample and hold circuit
469
Thermal simulation and design of GaAs HBTs
470
Thermal simulation and heat transfer optimization of electron equipment chassis based on FLOTHERM
471
Thermal simulation and optimization of high-power white LED lamps
472
Thermal simulation and package investigation of wireless gas sensors microsystems
473
Thermal simulation and power map modeling sensitivity study for chipset silicon
474
Thermal simulation and ultrafast IR temperature mapping of a Smart Power Switch for automotive applications
475
Thermal simulation and validation of 5W high power LED luminaire
476
Thermal simulation and validation of 8W LED Lamp
477
Thermal simulation and validation of the fast static RAM 164-lead FC-PBGA package with investigations of package thermal performance in a generic CPU module
478
Thermal simulation approach to the cooling of a power IGBT by heat pipes
479
Thermal simulation for a hybrid powered scooter by using Simulink
480
Thermal Simulation for Development Speed-Up
481
Thermal simulation for distribution transformers in underground vaults
482
Thermal simulation for distribution transformers in underground vaults
483
Thermal simulation for geometric optimization of metallized polypropylene film capacitors
484
Thermal simulation for IC devices with large number of heat sources
485
Thermal simulation for power equipment using natural cooling
486
Thermal simulation for predicting substrate temperature during reflow soldering process
487
Thermal simulation for SOI devices combining a thermal circuit model with device simulation
488
Thermal simulation for the packaging structures of Radio frequency power amplifier chamber
489
Thermal simulation in power electronics
490
Thermal Simulation of a 34-140 Mbit/s Optical Fibre Terminal - The Brio Rack
491
Thermal simulation of a high power loudspeaker
492
Thermal Simulation of and Characterization of AlGaN/GaN/Si High Electron Mobility Transistors
493
Thermal simulation of bionic transpiration heat pipe system for high-power LED
494
Thermal simulation of defect localisation using Lock-In Thermography in complex and fully packaged devices
495
Thermal simulation of energetic transients in multilevel metallisation systems
496
Thermal simulation of GaAs-based midinfrared quantum cascade lasers
497
Thermal simulation of heterogeneous GaN/ InP/silicon 3DIC stacks
498
Thermal Simulation of High Power Transistors and MIC and a New Flip-Chip Technology
499
Thermal simulation of high-lead count packages
500
Thermal simulation of integrated circuits based on a reduced-order model
501
Thermal simulation of nanosecond laser annealing of 3D sequential VLSI
502
Thermal simulation of PCBs with embedded resistors
503
Thermal simulation of power electronic systems
504
Thermal simulation of small capacity AC contactor based on ANSYS
505
Thermal simulation of stirling cooler in IR system based on Flotherm
506
Thermal simulation of surface micromachined polysilicon hot plates of low power consumption
507
Thermal simulation of switchgear
508
Thermal simulation of switchgear
509
Thermal simulation of System in Package (SiP) in soak zone of reflow process
510
Thermal Simulation of the Solidification of Lead-Free Solder Interconnections
511
Thermal simulation of thin-film interconnect failure caused by high current pulses
512
Thermal simulation of transients in microwave devices
513
Thermal Simulation of Underground Power Distribution Transformers
514
Thermal Simulation of UV Laser Ablation of Polyimide
515
Thermal simulation on typical high power diode packaging
516
Thermal simulation study of die attach delamination effect on TQFP package thermal resistance
517
Thermal simulation techniques for nanoscale transistors
518
Thermal simulation technology for Engine Control Unit
519
Thermal Simulation with Coupled Network Models on System Level
520
Thermal simulations and design propositions for LEDs used in automotive applications
521
Thermal simulations for electronic equipment using the software package THEBES
522
Thermal simulations of III/V HEMTs
523
Thermal simulations of multi-chips modules
524
Thermal simulator benchmarking using an SOIC package
525
Thermal simulator of 3D-IC with modeling of anisotropic TSV conductance and microchannel entrance effects
526
Thermal SiO
2
films on n
+
polycrystalline silicon: Electrical conduction and breakdown
527
Thermal Sizing and Electric Shock Calculations for Equipment Grounding Conductors
528
Thermal sizing and electric shock calculations for equipment grounding conductors
529
Thermal smooth control based on orthogonal circulating current for multi-MW parallel wind power converter
530
Thermal smooth control for Multi-MW parallel wind power converter
531
Thermal solution development for high-end server systems
532
Thermal solutions for discrete and wafer-level RF MEMS switch packages
533
Thermal Solutions for Multi-chip Chip Scale Packages
534
Thermal solutions to Pentium processors in TCP in notebooks and sub-notebooks
535
Thermal solutions to Pentium processors in TCP in notebooks and sub-notebooks
536
Thermal sounding of the atmospheric boundary layer in the oxygen absorption band center at 60 GHz
537
Thermal Spectral Imaging for Air-to-Ground Target Detection
538
Thermal spin transport and applications
539
Thermal sprayed coatings characterization by acoustic waves
540
Thermal sprayed thick-film anisotropic magnetoresistive sensors
541
Thermal Spreading Resistance and Heat Source Temperature in Compound Orthotropic Systems With Interfacial Resistance
542
Thermal Spreading Resistance for Square and Rectangular Entities
543
Thermal Spreading Resistance of Arbitrary-Shape Heat Sources on a Half-Space: A Unified Approach
544
Thermal spreading resistance of ring-geometry diodes
545
Thermal stabilisation of high-Q sapphire microwave resonator using thermosensitive quartz sensor
546
Thermal Stabilities of Cu/Co/Cu/NiFe Multilayers
547
Thermal Stability Analysis for Superconducting Coupling Coil in MICE
548
Thermal stability analysis of AlGaAs/GaAs heterojunction bipolar transistors with multiple emitter fingers
549
Thermal Stability Analysis of Disconnect Switch Based on FEM
550
Thermal stability analysis of multiple emitter finger microwave AlGaAs/GaAs heterojunction bipolar transistors
551
Thermal stability analysis of power LED during aging
552
Thermal stability analysis of UV-induced fiber Bragg gratings
553
Thermal stability analysis on pattern dependent BER and SNR decay
554
Thermal Stability Analysis on Pattern-Dependent BER and SNR Decay
555
Thermal stability and corrosion resistance of Fe based high moment magnetic materials for thin film recording heads
556
Thermal stability and corrosion resistance of HDDR processed Sm-Fe-Ti-B-N bonded magnets
557
Thermal Stability and Dopant Segregation for Schottky Diodes With Ultrathin Epitaxial
558
Thermal stability and dynamic coercivity measurements of longitudinal magnetic recording media
559
Thermal Stability and Electrical Properties of High-k Gate Dielectric Materials
560
Thermal stability and electronic structure of hafnium and zirconium oxide films for nanoscale MOS device applications
561
Thermal stability and interface improvement of thin NiSiGe by C
+
ion implantation
562
Thermal Stability and its Prediction in Cable Backfill Soils
563
Thermal Stability and Life of the Gapless Surge Arrester
564
Thermal Stability and Life of the Gapless Surge Arrester
565
Thermal stability and magnetic properties of Fe-Al-Ga-P-C-B-Si amorphous thick sheets
566
Thermal Stability And Magnetic Properties Of Fe-Al-Ga-P-C-B-Si Amorphous thick sheets with wide super cooled Liquid Region
567
Thermal stability and nanostructure of CoCrPt longitudinal recording media
568
Thermal Stability and Nanostructure of CoCrPt Longitudinal Recording Media
569
Thermal stability and organic component analysis of HTV silicone rubber composite insulator
570
Thermal stability and oxidation resistance of HDDR processed Sm-Fe-Ti-B-N bonded magnets
571
Thermal stability and performance data for Sm-Co 2:17 high temperature magnets on PPM focusing structures
572
Thermal stability and performance data for SmCo 2:17 high-temperature magnets on PPM focusing structures
573
Thermal stability and read-write performance of AFC media
574
Thermal stability and read-write performance of AFC media
575
Thermal stability and recording characteristics of thin film media with a CoCr based interlayer
576
Thermal stability and recording characteristics of thin film media with a CoCr based non-magnetic interlayer
577
Thermal stability and reliability in SiGe pMOSFETs for sub-20nm DRAM applications
578
Thermal Stability and Reliability of Magneto-Optical Media with Periodic Structures
579
Thermal stability and reliability of spin-valve films with synthetic antiferromagnet exchange-biased by IrMn
580
Thermal stability and scalability of Zr-aluminate-based high-k gate stacks
581
Thermal stability and secondary breakdown in planar power MOSFET´s
582
Thermal stability and SNR of coupled granular/continuous media
583
Thermal stability and structural investigations of sulfonated polystyrene pore-filled poly(vinylidene fluoride) membranes
584
Thermal stability and the effectiveness of coatings for Sm-Co 2 : 17 high-temperature magnets at temperatures up to 550°C
585
Thermal Stability at 1.9 K and 4.3 K of
Cables for Quadrupole Magnets for the LHC Upgrade
586
Thermal stability at 300-500/spl deg/C for a new series of Sm/sub 2/TM/sub 17/ materials with maximum use temperature up to 550/spl deg/C
587
Thermal stability at the anisotropic conductive films (ACFs)/ organic solderability preservatives (OSPs) Interface
588
Thermal Stability Characterization of the Au–Sn Bonding for High-Temperature Applications
589
Thermal Stability Considerations in the Design of a Transistorized TV Horizontal Output Amplifier
590
Thermal stability dependence on states for multi-state MRAM
591
Thermal stability dependence on Tb content in TbFeCo thin film
592
Thermal stability dependence on Tb content in TbFeCo thin film
593
Thermal stability enhancement of electrooptic polymer modulator
594
Thermal stability enhancement of Ni-based silicides, germano-silicides and germanides using W and F implantation for 3D CMOS sequential integration
595
Thermal stability enhancement of perpendicular media with high-order uniaxial anisotropy
596
Thermal stability evaluation of 0.03/spl mu/m MO domains in MAMMOS
597
Thermal stability evaluation of die attach for high brightness LEDs
598
Thermal stability for Ti-22 atomic percent Nb superconducting cables and solenoids
599
Thermal stability improvement for longitudinal magnetic recording media
600
Thermal stability improvement of Ni germanide utilizing Ni-Pd alloy for nano-scale Ge MOSFETs
601
Thermal Stability Improvement of Ni–Germano silicide Utilizing Ni–Pd Alloy for Nanoscale CMOS Technology
602
Thermal Stability improvement of Nickel Germanosilicide Utilizing Ni-Ta Alloy and Co/TiN Cappling layer for Nano-scale CMOS Technology
603
Thermal Stability Improvement of Vertical Conducting Green Resonant-Cavity Light-Emitting Diodes on Copper Substrates
604
Thermal stability in CoFe/Os/OsMn films
605
Thermal Stability in HVDC Cables: Whether it is Internal or External?
606
Thermal stability in longitudinal thin film media
607
Thermal Stability in Textured CoFe/IrMn Films with Os Buffer and Barrier Layer
608
Thermal Stability in Uniaxial Nanomagnets Driven by Spin-Polarized Currents
609
Thermal stability in wavelength discrimination using synchro-scanned optical disk filter
610
Thermal stability investigation in highly- uniform and low-voltage tantalum oxide-based RRAM
611
Thermal stability issues in copper based metallization
612
Thermal Stability Measurement of Amorphous Ribbons by High-Sensitive AC-Calorimeter
613
Thermal stability modeling and evaluation of piggy-back microactuator for hard disk drives
614
Thermal stability of 5 nm barrier InAlN/GaN HEMTs
615
Thermal stability of a defect-tolerant dielectric
616
Thermal stability of a high performance PTGVMOS with native-tie
617
Thermal stability of a new insulating material used in traction motors
618
Thermal stability of a quasi-isotropic strand consisting of coated conductors
619
Thermal stability of a synthetic antiferromagnet free layer
620
Thermal stability of Al/AlGaAs and Al/GaAs/AlGaAs (MBE) Schottky barriers
621
Thermal stability of Al
0.48
In
0.52
As/Ga
0.47
In
0.53
As/InP heterostructure and its improvement by phosphidization
622
Thermal Stability of Amorphous InGaZnO Thin-Film Transistors With Different Oxygen-Contained Active Layers
623
Thermal stability of bias point of packaged linear modulators in lithium niobate
624
Thermal Stability of Butt Joint for CS Conductor in JT-60SA
625
Thermal stability of cables metallic covers in the case of double earth faults in middle voltage networks
626
Thermal Stability of Co/Cu Giant Magneto Resistance (GMR) System
627
Thermal stability of Co
80
Pt
20
-SiO
2
granular films sputtered on DC pulse biased substrates
628
Thermal stability of cobalt and nickel silicides in amorphous and crystalline silicon
629
Thermal stability of CoCr films for perpendicular recording media
630
Thermal stability of coercivity in grain boundary modified anisotropic hot-deformed Nd-Fe-B magnets
631
Thermal stability of CoFe, Co and NiFe/Co spin valves
632
Thermal stability of Co-modified iron oxides. III. Effect on overwrite, erasability and dynamic coercivity
633
Thermal Stability of Compositionally Modulated Amorphous Nitride Alloy Films
634
Thermal Stability of Compositionally Modulated Amorphous Nitride Alloy Films
635
Thermal Stability of Conduction-Cooled YBCO Pancake Coil
636
Thermal stability of copper Through-Silicon Via barriers during IC processing
637
Thermal Stability of CoSi
2
on Submicron Polycrystalline Silicon Lines
638
Thermal stability of CoSi
2
film for CMOS salicide
639
Thermal stability of Cu/CoSi
2
contacted p
+
n shallow junction with and without TiN
x
diffusion barrier
640
Thermal Stability of Cu-Nb Micro-Composites by Bundling and Drawing Process
641
Thermal stability of deuterium in InAlN and InAlGaN
642
Thermal stability of directly UV-written waveguides and devices
643
Thermal Stability of Earth´s Ionosphere under Power Transmitting Satellites
644
Thermal stability of electrodeposited soft-magnetic iron alloy layers
645
Thermal stability of electroless nickel/immersion gold surface finish for direct bond copper
646
Thermal stability of electroplated copper thin-film interconnections
647
Thermal stability of emitter ballasted HBT´s
648
Thermal stability of exchange-biased magnetic tunnel junctions with stabilizing layer
649
Thermal Stability of FePt-Based Exchange Coupled Composite Films
650
Thermal stability of ferroelectric memories
651
Thermal Stability Of FeTaN As A Function Of N And Ta Content
652
Thermal stability of FeTaN as a function of N and Ta content
653
Thermal Stability of Fe-Zr/Fe-Zr-N Soft Magnetic Multilayered Films
654
Thermal stability of GaAs MESFETs fabricated using only spin-on metal sources
655
Thermal stability of GaAs/InAs/GaAs heterostructure studied by X-ray crystal truncation rod scattering measurement
656
Thermal stability of giant Hall effect in percolating NiFe-SiO
2
granular films
657
Thermal stability of GMR sensors with Co-Cu artificial antiferromagnetic [AAF] hard subsystem
658
Thermal stability of gold free fully Cu/Ge metalized GaAs pHEMT
659
Thermal stability of granular-type FePt-MgO perpendicular recording media with soft underlayers
660
Thermal stability of granular-type FePt-MgO perpendicular recording media with soft underlayers
661
Thermal stability of heterojunction interfaces in GaAs/AlGaAs structures
662
Thermal stability of Hf
x
Ta
y
N metal gate electrodes for advanced MOS devices
663
Thermal stability of HfON, HfSiON and HfTaON gate dielectrics
664
Thermal stability of highly compressive strained germanium-tin (GeSn) grown by molecular beam epitaxy
665
Thermal Stability of High-Power LEDs Analyzed With Efficient Nondestructive Methodology
666
Thermal stability of hydrogen annealed aluminum doped zinc oxide films investigated by thermal desorption spectroscopy
667
Thermal stability of IGBT high-frequency operation
668
Thermal stability of indium-tin-oxide/n-GaAs Schottky diodes
669
Thermal stability of intrinsic stress birefringence in optical fibers
670
Thermal stability of IrO
2
gate based AlGaN/GaN HEMT
671
Thermal stability of IrO
2
nanowires
672
Thermal Stability of Junction Transistors and Its Effect on Maximum Power Dissipation
673
Thermal Stability of Lead Sulfide Nanocrystals Synthesized through Green Chemical Route
674
Thermal stability of longitudinal media for >20 Gbits/in
2
recording
675
Thermal stability of longitudinal media for > 20 Gbit/In
2
recording
676
Thermal stability of magnet wire evaluated by viscoelastic behavior
677
Thermal Stability of Magnet Wire Evaluated by Viscoelastic Behavior
678
Thermal stability of magnetic properties of amorphous and nanocrystalline Fe/sub 85.4-x/Co/sub x/Zr/sub 5.8/Nb/sub 1/B/sub 6.8/Cu/sub 1/ (x=0 or 42.7) alloys
679
Thermal stability of magnetic properties of electroplated Ni -Fe-In ternary alloy films
680
Thermal stability of magnetic recording in perpendicular thin film media
681
Thermal stability of magnetic tunnel junctions with FeO
x
doped tunnel barrier
682
Thermal stability of magnetic tunnel junctions with new amorphous ZrAl alloy films as under and capping layers
683
Thermal stability of magnetic tunnel junctions with new amorphous ZrAl-alloy films as the under and capping layers
684
Thermal stability of magnetization in perpendicular thin film media
685
Thermal stability of MBE-grown Si-doped InGaAs/InAlAs heterostructures
686
Thermal stability of ME recording media by measuring time and temperature effects
687
Thermal Stability of Micaceous Insulation
688
Thermal Stability of Micaceous Insulation of High Voltage Machines
689
Thermal stability of MISFET with low-temp molecular-beam epitaxy-grown GaAs and Al
0.3
Ga
0.7
As gate ins
690
Thermal stability of mo-based schottky contact for AiGaN/GaN HEMT
691
Thermal stability of MTJ using Zr capping layer
692
Thermal Stability Of Narrow Track Bits In A 5 GBIT/IN/sub 2/ Medium
693
Thermal stability of narrow track bits in a 5 Gbit/in
2
medium
694
Thermal stability of Ni monosilicide formed with Ti capping layer
695
Thermal stability of Ni(Zr)Si silicide and Ni(Zr)Si/Si Schottky diode
696
Thermal Stability of Nickel Germanide Formed on Tensile-Strained Ge Epilayer on Si Substrate
697
Thermal stability of nickel silicide films in submicron p-type polysilicon lines
698
Thermal Stability of Nickel Silicide with Stressed Inter-Layer Dielectric Layer on Doped Si Substrate
699
Thermal stability of nickel silicides in different silicon substrates
700
Thermal Stability Of NiFe/Co and NiFe1Co/sub 90/Fe/sub 10/ spin valves
701
Thermal stability of NiMn spin valve heads
702
Thermal stability of NIMN valve heads
703
Thermal stability of NiSi controlled by post silicidation metal doping method
704
Thermal stability of NLO effects in polymers
705
Thermal Stability of Non-Alloyed Ohmic Contact to n-GaAs
706
Thermal Stability of Nonequilibrium Fe-Ag and Fe-Cu Alloys Produced by Vapor Quenching
707
Thermal stability of optical add/drop gratings for WDM systems
708
Thermal Stability of Optical Coupling Solutions in Silicone-Based Optical Interconnects
709
Thermal stability of oscillatory systems based on split dielectric resonator
710
Thermal stability of oxide superconductor at various temperatures
711
Thermal stability of oxide superconductors in flux flow state
712
Thermal stability of Pd-In ohmic contacts to n-GaAs formed by scanned electron beam and rapid thermal annealing
713
Thermal Stability of PECVD SiN
x
Films
714
Thermal stability of perpendicular exchange bias in [Pd/Ferromagnet]
N
/FeMn films
715
Thermal stability of pinned layer in PtMn based synthetic spinvalve
716
Thermal stability of pinned layer in PtMn-based synthetic spin-valve
717
Thermal stability of polarization in P(VDF-TFE) copolymer films
718
Thermal stability of polarization structures in corona-charged P(VDF-HFP) copolymer films
719
Thermal stability of polymer-bonded isotropic Nd-Fe-B magnets
720
Thermal Stability of Poly-Si Phototransistors Incorporating Ge Quantum Dots for Near-Ultraviolet Light Detection and Amplification
721
Thermal stability of polysilicon resistors
722
Thermal stability of polysilicon resistors
723
Thermal stability of pseudomorphic In
x
Ga
1-x
As/In
y
Al
1-y
As/InP heterostructures
724
Thermal Stability of Pt and C-Doped NiSi Films
725
Thermal stability of Pt/doping element/Pd ohmic contacts to GaAs
726
Thermal stability of PVD TiN gate and its impacts on characteristics of CMOS transistors
727
Thermal stability of Re Schottky contacts to 6H-SiC
728
Thermal Stability Of Recorded Information At High Densities
729
Thermal stability of recorded information at high densities
730
Thermal stability of ruthenium MOS gate electrodes
731
Thermal stability of Se/CdSe multilayers
732
Thermal Stability of Self-Assembled Monolayer Copper Preservatives for Fluxless Soldering
733
Thermal stability of self-assembled monolayers for epoxy control in optoelectronic assembly
734
Thermal stability of SiC JFETs in conduction mode
735
Thermal stability of SiGe dynamic threshold pMOSFET
736
Thermal Stability of Silicon Carbide Power Diodes
737
Thermal Stability of Silicon Carbide Power JFETs
738
Thermal stability of single layer pulsed — DC reactive sputtered AlO
X
film and stack of ICP ℄ CVD SiN
X
on AlO
X
for p-type c-Si surface passivation
739
Thermal stability of Sm-TM high temperature magnets at 300-550°C
740
Thermal stability of sodium-nitrogen-C/sub 60/ superconductor prepared from Na-AZIDE
741
Thermal Stability of Soft Magnetic Properties in Fe/CoZr Multilayer Films
742
Thermal stability of softmagnetic properties of Co-(Nb,Ta)-(Zr, Hf) films with high saturation magnetization
743
Thermal Stability of Specialty Optical Fibers
744
Thermal stability of spin dependent tunnel junctions with antiferromagnetic IrMn
745
Thermal stability of spin dependent tunneling junctions pinned with IrMn
746
Thermal stability of spin valve with NiO/α-Fe
2
O
3
bilayer antiferromagnets
747
Thermal stability of spin valves incorporating new amorphous ZrAl alloy films as under and capping layers
748
Thermal Stability Of Spin Valves With Fe-Mn And NiO Pinning Layers
749
Thermal stability of sputtered GdDyFeCo films with trilayer structure
750
Thermal Stability of strained-SOI (sSOI)
751
Thermal stability of the current regulator diodes
752
Thermal stability of the dielectric properties of the low-loss, organic material RT/duroid 6002 from 30 GHz to 70 GHz
753
Thermal stability of the dipole orientation in nonlinear optical guest-host, side-chain and cross-linked polymer electrets
754
Thermal Stability Of The Fe/sub 17/R/sub 2/Phases. R= PR,ND AND SM
755
Thermal Stability of the Ferromagnetic In-Plane Uniaxial Anisotropy of Fe-Co-Hf-N/Ti-N Multilayer Films for High-Frequency Sensor Applications
756
Thermal Stability of the High Strength High Conductivity Cu–Nb, Cu–V, and Cu–Fe Nanostructured Microcomposite Wires
757
Thermal stability of the power SiGe HBT with non-uniform finger length
758
Thermal stability of thermoelectric properties for nondoped PbTe
759
Thermal stability of thin CoSi
2
layers on polysilicon implanted with As, BF
2
and Si
760
Thermal stability of thin CoSi
2
layers on polysilicon implanted with As, BF
2
and Si
761
Thermal Stability of Ultrathin Amorphous Carbon Films for Energy-Assisted Magnetic Recording
762
Thermal Stability of Ultra-Thin Co Recording Media
763
Thermal stability of ultra-thin Co recording media
764
Thermal stability of ultra-thin InGaAs-on-insulator substrates
765
Thermal stability of ultrathin RuC film as Cu diffusion barrier
766
Thermal Stability of Uniform-Period, Chirped, and Bandpass Fibre Grating Structures Fabricated in Hydrogenated Optical Fibres
767
Thermal stability of various ball-limited-metal systems under solder bumps
768
Thermal stability of various ball-limited-metal systems under solder bumps
769
Thermal Stability Of Wavelength Division Multiplexers With 20 Channels Spaced At INM
770
Thermal Stability of Written Bits in an 8 Gbit/in/sup 2/ CoCrPtNaNb/CrMo Longitudinal Media
771
Thermal stability of written bits in double-layered perpendicular recording media
772
Thermal stability of written bits in double-layered perpendicular recording media
773
Thermal stability of written bits in high density magneto-optical recording media
774
Thermal stability of WSi
2
polycide structures for 1 Gbit DRAMs
775
Thermal stability of ZnMgSSe/ZnSe laser heterostructures
776
Thermal stability on hard disk media beyond 10-20 GBit/Inch
777
Thermal Stability on Spin Valves with NiO//spl alpha/-Fe/sub 2/O/sub 3/ Bilayer Antiferromagnets
778
Thermal Stability Performance of Metamorphic High Electron Mobility Transistors (MHEMTs)
779
Thermal Stability Properties of
Coated Conductor Tape Under the Cryocooling Condition
780
Thermal stability study of AlGaN/GaN MOS-HEMTs using Gd
2
O
3
as gate dielectric
781
Thermal stability study on highly oriented longitudinal thin film media
782
Thermal stability study on highly oriented longitudinal thin film media
783
Thermal stability test methods to establish dielectric loss limits in EHV bushings and current transformers
784
Thermal stability testing of Fischer-Tropsch fuel and various blends with Jet A, as well as aromatic blend additives
785
Thermal stability testing of GMR recording heads
786
Thermal stability testing of GMR recording heads
787
Thermal stabilization of a microring resonator using bandgap temperature sensor
788
Thermal stabilization of low level RF distribution systems at SLAC
789
Thermal stabilization of microwave sapphire resonator references
790
Thermal stabilization processes on CrO
2
powders modified with Fe dopants
791
Thermal stabilized front-end PCB with active cold calibration load for L-band radiometer
792
Thermal Stabilizer for Laser Diode
793
Thermal stable microwave dielectrics
794
Thermal Stable Nickel Silicide Utilizing Ni/Co/Ni/TiN structure and Two-Step RTP on Doped Substrate
795
Thermal standards for the 21/sup st/ century
796
Thermal state quantum correlation in lithium atom
797
Thermal status and workload prediction using support vector regression
798
Thermal steady state in human head under continuous EM exposure
799
Thermal step and TSDC measurement in PVC
800
Thermal step method for space charge measurements under applied dc field
801
Thermal Stereo Odometry for UAVs
802
Thermal storage capacity to enhance network flexibility in Dual Demand Side Management
803
Thermal storage cooling tower for underground commercial building
804
Thermal storage heaters
805
Thermal Storage of AlGaN/GaN High-Electron-Mobility Transistors
806
Thermal storage of off-peak electrical energy in solar heating and cooling systems
807
Thermal storage power balancing with model predictive control
808
Thermal strain analysis in optical planar waveguides
809
Thermal strain effects of acoustic surface waves in layered media
810
Thermal Strain in Lightweight Composite Fiber-Optic Gyroscope for Space Application
811
Thermal strain magnification for wide wavelength tunability of 1.55 μm lasers
812
Thermal strain measurement of a double ring structure using digital image correlation method
813
Thermal Strains and Acoustic Nonlinearity in Crystalline Solids
814
Thermal stress analyses of inductive proximity sensors under thermal cycling condition
815
Thermal Stress Analysis and Design of the Stator of a 300 MVA Superconducting Generator
816
Thermal Stress Analysis and Design of the Stator of a 300-MVA Superconducting Generator
817
Thermal stress analysis and failure mechanisms for through silicon via array
818
Thermal stress analysis and failure mechanisms for through silicon via array
819
Thermal Stress Analysis and Optimization Design of High Temperature and High Pressure Valve Based on the Workbench
820
Thermal stress analysis and optimization for a power controller SiP module
821
Thermal stress analysis and structural design of Al
x
Ga
1−x
N/GaN epilayers based on Si substrate
822
Thermal stress analysis and structural optimization of ultra-thin chip stacked package device
823
Thermal stress analysis for IGBT inverter systems
824
Thermal stress analysis for rapid thermal processor
825
Thermal stress analysis for rotor of 600MW supercritical steam turbine
826
Thermal Stress Analysis of
-Based Phase-Change Memory Devices
827
Thermal stress analysis of 3D die stacks with low-volume interconnections
828
Thermal Stress Analysis of 600MW Steam Turbine Rotor in Different Governing Modes
829
Thermal stress analysis of a flip-chip parallel VCSEL (vertical-cavity surface-emitting laser) package with low-temperature lead-free (48Sn-52In) solder joints
830
Thermal stress analysis of a multichip package design
831
Thermal stress analysis of a multichip package design
832
Thermal stress analysis of colored LEDs
833
Thermal Stress Analysis Of Conductive Adhesive Joints
834
Thermal Stress Analysis of Cu/Low-k Interconnects in 3D-IC Structures
835
Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration
836
Thermal stress analysis of direct chip attach electronic packaging assembly
837
Thermal stress analysis of FCBGA during cooling under reflow process
838
Thermal stress analysis of IGBT modules in VSCs for PMSG in large offshore Wind Energy Conversion Systems
839
Thermal stress analysis of mesoporous perovskite solar cell by finite element method
840
Thermal stress analysis of PBGA under natural convection using a fluid-solid coupling method
841
Thermal stress analysis of PBGA using a fluid-solid coupling method under steady convective heat transfer
842
Thermal stress analysis of plastic leaded chip carriers
843
Thermal stress analysis of tape automated bonding packages and interconnections
844
Thermal stress analysis of tape automated bonding packages and interconnections
845
Thermal stress analysis of the microtoroid under CO
2
laser
846
Thermal Stress Analysis of the Rails and the Armature of an Electromagnetic Launcher
847
Thermal stress and debonding in Cu/low k damascene line structures
848
Thermal stress and defect reduction in undercut GaAs on Si substrate
849
Thermal stress and deformation depend on thickness of CCD composite dielectrics
850
Thermal stress and die-warpage analyses of 3D die stacks on organic substrates
851
Thermal stress and fracture in shear-constrained semiconductor device structures
852
Thermal stress and high temperature effects on power devices in a fault-resilient NPC IGCT-based converter
853
Thermal stress and intrinsic residual stress in embedded power modules
854
Thermal stress and mechanical strain real time mapping in Intelligent Power Switches device
855
Thermal stress and relaxation behaviour of Al(Cu) submicron interconnects
856
Thermal stress and reliability analysis of microstrip isolator under temperature shock
857
Thermal stress and reliability characterization of barriers for Cu interconnects
858
Thermal stress aware design for stacking IC with through glass via
859
Thermal Stress Birefringence in Buried-Core Waveguides With Over-Etch
860
Thermal stress characteristics and impact on device keep-out zone for 3-D ICs containing through-silicon-vias
861
Thermal stress characteristics and reliability impact on 3-D ICs containing through-silicon-vias
862
Thermal stress characteristics of Cu interconnects using Air-Gap
863
Thermal stress comparison in modular power converter topologies for smart transformers in the electrical distribution system
864
Thermal stress computation for steam-electric generator dispatch
865
Thermal stress control in Cu interconnects
866
Thermal stress destruction analysis in low-k layer by via-last TSV structure
867
Thermal stress distribution in a high temperature heat pipe
868
Thermal stress effects on capacitance and current characteristics of Cu/si and Cu/TiN/Si schottky-diodes
869
Thermal stress effects on capacitance and current characteristics of Cu/Si and Cu/TiN/Si Schottky-diodes
870
Thermal stress effects on higher order modes in highly elliptical core optical fibers
871
Thermal Stress Effects on the Electrical Properties of p-Channel Polycrystalline-Silicon Thin-Film Transistors Fabricated via Metal-Induced Lateral Crystallization
872
Thermal stress evaluation of a PCRAM material Ge2Sb2Te5
873
Thermal stress evaluation of printed circuit board and connector due to current flow by using holography
874
Thermal stress in blood vessels during cryopreservation processes
875
Thermal stress in EML rail-conductor overlays
876
Thermal stress in semiconductor encapsulating materials
877
Thermal stress in silica disk resonators
878
Thermal stress in thin films using real-time holographic interferometry
879
Thermal stress induced delamination of through silicon vias in 3-D interconnects
880
Thermal stress measurements in optical-fibre preforms using preform-profiling techniques
881
Thermal stress modeling in electronics and photonics: Brief review
882
Thermal stress monitoring using gradient direction sensors
883
Thermal stress of 140 nm-width Cu damascene interconnects
884
Thermal stress on silver conductive adhesive solder joints: Performance evaluation of medical ultrasound array transducer
885
Thermal stress on ZnO surge arresters in polluted conditions. I. Laboratory test methods
886
Thermal stress on ZnO surge arresters in polluted conditions. I. Laboratory test methods
887
Thermal stress on ZnO surge arresters in polluted conditions. II. Field test results
888
Thermal stress on ZnO surge arresters in polluted conditions. II. Field test results
889
Thermal stress reduced maximum power point tracking for two stages photovoltaic converters
890
Thermal stress related packaging failure in power IGBT modules
891
Thermal stress relief with power management [desktop computer systems]
892
Thermal stress simulation and temperature crack control for RCCD during construction period
893
Thermal Stress Simulation for HV Inverter Module
894
Thermal stress simulation in the metal-insulator-metal (MIM) wafer fabrication process
895
Thermal Stress Simulation Of Electronic Device By Boundary Element Method
896
Thermal stress singularities in microelectronics
897
Thermal stress test for PLED
898
Thermal stress/strain analysis of ceramic quad flat pack packages and interconnections
899
Thermal Stresses Analysis of the Rails and the Armature of an Electromagnetic Launcher
900
Thermal stresses and deformations of Cu pillar flip chip BGA package: Analyses and measurements
901
Thermal stresses and fatigue in silicon power rectifiers
902
Thermal stresses and microstructural transformations in thin copper samples irradiated with a high-current electron beam
903
Thermal stresses around TSV structure in stacked Si chips
904
Thermal stresses around void in Through Silicon Via in 3D SiP
905
Thermal stresses at interfaces in a semiconductor package
906
Thermal stresses in aluminum lines bounded to substrates
907
Thermal stresses in an actively cooled two-piece rail structure
908
Thermal stresses in L and T shaped metal interconnects: a three dimensional analysis
909
Thermal stresses in multilayer ceramic capacitors: numerical simulations
910
Thermal stresses in the bulk and epitaxial growth of III-V materials
911
Thermal stresses in the bulk and epitaxial growth of III-V materials
912
Thermal stresses of conformal coatings on printed circuit boards
913
Thermal stresses of TSV and Si chip in 3D SiP under device operation and reflow process
914
Thermal Stress-Free Package for Flip-Chip Devices
915
Thermal Stress-Induced Breakdown in an S-Band Isolator
916
Thermal structure coupling analysis and sensitivity optimization of the macro-micro motion platform
917
Thermal structure design for enhanced heat spreading in 3D ICs
918
Thermal studies of a high gradient quadrupole magnet cooled with pressurized, stagnant superfluid
919
Thermal Studies of a Plastic Dual-in-Line Package
920
Thermal studies of a plate bundle waveguide for use as an ultrasonic flow meter buffer
921
Thermal studies of DC traction motors
922
Thermal studies of finned LSI packages under forced convection
923
Thermal studies on finned LSI packages using forced convection
924
Thermal studies on heterostructure bipolar transistors using electroluminescence
925
Thermal Studies on Pin Grid Array Packages for High Density LSI and VLSI Logic Circuits
926
Thermal study for flip chip on FR-4 boards
927
Thermal study of a plasma of a highpressure mercury electric discharge
928
Thermal study of additive multilayer circuitry on polymer and metal substrates
929
Thermal study of an electric vehicle servo PMSM housing
930
Thermal study of GaN-based HFET devices
931
Thermal Study of High-Power Nitride-Based Flip-Chip Light-Emitting Diodes
932
Thermal study of HOM couplers for superconducting RF cavities
933
Thermal study of induction machine using Motor-CAD
934
Thermal study of induction motors by phantom loading using multi-slice time stepping finite element modeling
935
Thermal study of inverter components
936
Thermal Study of Inverter Components
937
Thermal study of nanometer spaced head-disk systems
938
Thermal study of semiconductor-superconductor hybrids
939
Thermal study of the DIII-D machine heat removal capacity
940
Thermal Study of the High-Frequency Noise in GaN HEMTs
941
Thermal sub-modeling of high density interconnect substrates
942
Thermal sub-modeling of the wirebonded plastic ball grid array package
943
Thermal success of GGS SWE and hydra instruments: design, analysis, verification, flight performance
944
Thermal supervision during robotic laser microsurgery
945
Thermal survivability characterization of quantum dot multi-junction photovoltaic cells
946
Thermal switch and variable capacitance designed for micro electrostatic converter by using CMOS MEMS process
947
Thermal switch design by using complementary metal??oxide semiconductor MEMS fabrication process
948
Thermal switchback in high f
t
epitaxial transistors
949
Thermal switchback in high f
t
epitaxial transistors
950
Thermal switches based on coplanar EWOD for satellite thermal control
951
Thermal Switching Distribution of FePt Grains Through Atomistic Simulation
952
Thermal Switching Error Versus Delay Tradeoffs in Clocked QCA Circuits
953
Thermal switching in chalcogenide glasses
954
Thermal switching of terahertz surface plasmon polaritons in semiconductors
955
Thermal system identification (TSI): A methodology for post-silicon characterization and prediction of the transient thermal field in multicore chips
956
Thermal Systems Design at the junior level
957
Thermal Ta
2
O
5
- alternative to SiO
2
for high density dynamic memories
958
Thermal Tactile Presentation with On-Site Parameter Identification of Finger
959
Thermal tactile sensing
960
Thermal techniques as applied to functional electronic blocks
961
Thermal techniques to improve ZnO-based FBAR devices characteristics
962
Thermal test- and field cycling induced degradation and its FE-based prediction for different SAC solders
963
Thermal test and monitoring [microelectronic structures]
964
Thermal Test Chip Design and Performance Considerations
965
Thermal test method for high power three-phase grid-connected inverters
966
Thermal Test Performance of a Modern Apparatus Bushing
967
Thermal test procedure and analytical model calibration method for electrical machines
968
Thermal test procedure for mixed mode solar dryer
969
Thermal test vehicle for the validation of thermal modelling of hot spot dissipation in 3D stacked ICs
970
Thermal testing methods for evaluating thin thermally conductive materials
971
Thermal testing methods to increase system reliability
972
Thermal testing of a 3-die stacked chip scale package including evaluation of simplified and complex package geometry finite element models
973
Thermal testing of antennas in spherical near field multi-probe system
974
Thermal testing of small antennas in spherical near field system
975
Thermal testing on programmable logic devices
976
Thermal testing on reconfigurable computers
977
Thermal testing using oscillation based test structures
978
Thermal testing: fault location strategies
979
Thermal tests and analyses of potted leadless chip carriers
980
Thermal tests and analysis of thin graphite heat spreader for hot spot reduction in handheld devices
981
Thermal theory based feature extraction method for high noise PET images
982
Thermal therapy in the Dunning AT-1 prostate tumor using a wet electrode RF probe
983
Thermal therapy using flexible fibers as transmission line (SoFT)
984
Thermal time constant of Nb diffusion-cooled superconducting hot-electron bolometer mixers
985
Thermal time constants in SOI-MOSFETs
986
Thermal time response of microfilaments
987
Thermal time shifting: Leveraging phase change materials to reduce cooling costs in warehouse-scale computers
988
Thermal touch: Thermography-enabled everywhere touch interfaces for mobile augmented reality applications
989
Thermal tracking system
990
Thermal Tracking-A Rational Approach to Motor Protection
991
Thermal transfer impedance variations by forced convective heat transfer in microchannels
992
Thermal transfer in magnetooptic printing of servo patterns
993
Thermal transfer measurements at microwatt power levels
994
Thermal transfer simulating for concentrator photovoltaic module under concentration condition
995
Thermal transfer through the walls of an enclosed area — Different methods of simulation
996
Thermal transference in transformer oils
997
Thermal transient analysis of GaN-based HEMTs based on spectral-element method
998
Thermal Transient Analysis of High-Power Green LED Fixed on BN Coated Al Substrates as Heatsink
999
Thermal transient analysis of LED array system with in-line pin fin heat sink
1000
Thermal transient analysis of semiconductor device degradation in power cycling reliability tests with variable control strategies
