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1
Thermal and electrical barrier performance testing of ultrathin atomic layer deposition tantalum-based materials for nanoscale copper metallization
2
Thermal and electrical beam steering on a GaInAs/GaAs slow-light Bragg waveguide amplifier
3
Thermal and electrical behavior of a resistive joint in the ATLAS toroids
4
Thermal and electrical behaviour of epoxy-based microcomposites filled with Al
2
O
3
and SiO
2
particles
5
Thermal and electrical behaviour of stress relieving coatings
6
Thermal and electrical characteristics of a multilayer thermionic device
7
Thermal and electrical characteristics of HfLaON with different nitridation annealings
8
Thermal and electrical characterization and modeling of thin copper layers
9
Thermal and electrical characterization of catastrophic degradation of silicon solar cells submitted to reverse current stress
10
Thermal and electrical characterization of eWLB (embedded Wafer Level BGA)
11
Thermal and electrical characterization of nanocomposites for thermoelectrics
12
Thermal and electrical characterization of poly(propylene terephthalate)
13
Thermal and electrical characterization of Polyvinyl Alcohol focusing on organic electronics applications
14
Thermal and Electrical Characterization of Silicon Photomultiplier
15
Thermal and electrical characterization of silicon photomultiplier
16
Thermal and electrical characterization of the intervertebral disc
17
Thermal and electrical characterization of the metal ball grid array (MBGA)
18
Thermal and Electrical Conductivities of Nanocrystalline Nickel Microbridges
19
Thermal and Electrical Effects of Partial Shade in Monolithic Thin-Film Photovoltaic Modules
20
Thermal and electrical effects of partial shade in monolithic thin-film photovoltaic modules
21
Thermal and electrical effects of staggered micropin-fin dimensions for cooling of 3D microsystems
22
Thermal and Electrical Evaluation of SiC GTOs for Pulsed Power Applications
23
Thermal and electrical experimental characterization of Ethylene Glycol and water mixture nanofluids for a 400w Proton Exchange Membrane Fuel Cell
24
Thermal and electrical imaging of surface properties with high lateral resolution
25
Thermal and electrical injury rate kinetics in shock victims
26
Thermal and electrical layout optimisation of multilayer structure solid-state devices based on the 2-D Fourier series
27
Thermal and electrical model of fuel cell in connected to grid/isolated mode
28
Thermal and electrical modelling of high power semiconductor devices
29
Thermal and electrical modelling of polymer cored BGA interconnects
30
Thermal and electrical performance and reliability results for cavity-up enhanced BGAs
31
Thermal and Electrical Performance Enhancement with a Cost-Effective Packaging for High Speed Memory Chips
32
Thermal and electrical performance for wafer level package
33
Thermal and electrical performance of a solar multifunctional roof
34
Thermal and Electrical Properties of Aluminum Nitride Filled Epoxy-resin Compound
35
Thermal and Electrical Properties of BCB-Liner Through-Silicon Vias
36
Thermal and electrical properties of brittleness improved epoxy for high voltage
37
Thermal and electrical properties of Czochralski grown germanium-silicon alloys
38
Thermal and electrical properties of Czochralski grown GeSi alloys
39
Thermal and electrical properties of poly(3-alkylthiophene)S prepared by the oxidative polymerization
40
Thermal and electrical properties of Si/Si
0.8
Ge
0.2
and B
4
C/B
9
C films
41
Thermal and electrical reliability of dual-stripe MR heads
42
Thermal And Electrical Reliability Of Dual-stripe MR Heads
43
Thermal and Electrical Reliability Tests of Air-Gap Through-Silicon Vias
44
Thermal and electrical resistances of bolted joints between plates of unequal thickness
45
Thermal and electrical sensitivities of optical devices under microwave intensity modulation
46
Thermal and electrical simulation of smart power circuits by network analysis
47
Thermal and Electrical Stabilities of Solid Nitrogen (SN2) Cooled YBCO Coated Conductors for HTS Magnet Applications
48
Thermal and electrical stability behavior of a magnetic tunnel junction with a new Zr-alloyed Al-oxide barrier
49
Thermal and electrical tests of air-gap TSV
50
Thermal and electrical transients during ESD stress
51
Thermal and electrical transport in carbon nanofiber interconnects
52
Thermal and Electrical Transport in Carbon Nanofiber Interconnects
53
Thermal and electroless deposition of copper on poly(tetrafluoroethylene-co-hexafluoropropylene) films modified by surface graft copolymerization
54
Thermal and electromagnetic analysis of a high-power divider
55
Thermal and electromagnetic analysis of an electromagnetic launcher
56
Thermal and electromagnetic behavior in NbTi/CuNi superconducting wires under fast changing transport current
57
Thermal and electromagnetic characteristics for cross-sectional design optimization of the integrated production umbilical
58
Thermal and electromagnetic models for radar sounding of the galilean satellite icy crusts
59
Thermal and electromagnetic properties of high temperature superconductors (HTS) for Quench Modelling
60
Thermal and electro-mechanical challenges in design and operation of high heat flux processors
61
Thermal and electromigration challenges for advanced interconnects
62
Thermal and electronic contributions to heat-transmission photoacoustic signals in semiconductors
63
Thermal and emission characteristics of high temperature air combustion: A technical review
64
Thermal and emission properties of engine fueled with diesel and bio-diesel blends of B20N, B80N, B20K and B80K
65
Thermal and energy analysis of ceiling and pitch insulation for buildings in Malaysia
66
Thermal and Energy Management of High-Performance Multicores: Distributed and Self-Calibrating Model-Predictive Controller
67
Thermal and fast neutron detection with two CLYC scintillators
68
Thermal and ferroelectric properties of potassium nitrate: polyvinyl fluoride composite films
69
Thermal and field dependencies of latent relaxation processes in irradiated MOS devices
70
Thermal and field enhanced emission of trapped holes in thin SiO
2
films
71
Thermal and flow analysis of SiC-based gas sensors for automotive applications
72
Thermal and fluid dynamical aspects in the design of an Axial Flux Permanent Magnet Synchronous Machine with Soft Magnetic Compound Stator
73
Thermal and fluid flow field calculation and analysis of preparation of semi-direct drive PMWG
74
Thermal and heat-flow aspects of actuators for hard disk drives
75
Thermal and hot spot evaluations on oil immersed power Transformers by FEMLAB and MATLAB software´s
76
Thermal and humidity stability of Ge
3
N
4
thin layers fabricated by high-density plasma nitridation
77
Thermal and hydraulic assessments of the cooling system for ITER vacuum vessel
78
Thermal and hydraulic behavior of plate fin and strip fin heat sinks under varying bypass conditions
79
Thermal and hydraulic behavior of plate fin and strip fin heat sinks under varying bypass conditions
80
Thermal and Hydraulic Design and Characterization of a Liquid-Cooled 3D Silicon Module
81
Thermal and hygro effect on EMC interface property characterization using cohesive zone modeling method
82
Thermal and Injection Annealing of Neutron-Irradiated p-Type Silicon between 76°K and 300°K
83
Thermal and Intermodulation Noise due to Two-Path Propagation in FM-FDM Systems Using Space Diversity
84
Thermal- and Laser-Induced Order–Disorder Switching of In-Doped Fast-Growth Sb
70
Te
30
Phase-Change Recording Films
85
Thermal and lifetime behavior of innovative insulation systems for rotating machines
86
Thermal and lighting analysis of a daylight-artificial light integrated office using Ecotect analysis
87
Thermal and lighting control system with energy saving and users comfort features
88
Thermal and magnetic characteristics of bulk superconductor and performance analysis of magnetic shielding type of superconducting fault current limiter
89
Thermal and magnetic design of 8 MB/s MO disk
90
Thermal and magnetic design of a dipolar superferric magnet for high uniformity magnetic field
91
Thermal and Magnetic Field Effect of Soft Under Layer for Perpendicular Media
92
Thermal and Magnetic Properties in (FeBSi)NbY Bulk Glassy Alloys
93
Thermal and magnetic responses of a solid nitrogen/magnetized YBCO disk system undergoing temperature cycles in the range of 8-60 K
94
Thermal and magnetic stability of unidirectional anisotropy in spin-valve magnetoresistive heads
95
Thermal and mechanical analysis and design of the IBM Power 775 water cooled supercomputing central electronics complex
96
Thermal and Mechanical Analysis of Cross-Linked Optical Fiber Coatings
97
Thermal and mechanical analysis of flip-chips on a liquid-cooled multichip module
98
Thermal and Mechanical Analysis of High-Power LEDs With Ceramic Packages
99
Thermal and mechanical analysis of high-power light-emitting diodes with ceramic packages
100
Thermal and Mechanical Analysis of Novel Transcranial Magnetic Stimulation Coil for Mice
101
Thermal and mechanical analysis of PFC for SST-1 tokamak
102
Thermal and mechanical analysis of recycled glass filled PET for printer part
103
Thermal and mechanical behavior of the first wall in fusion reactor
104
Thermal and mechanical behaviors of underfills for flip-chip packaging
105
Thermal and mechanical behaviour of an RFID based smart system embedded in a transmission belt determined by FEM simulations for Industry 4.0 applications
106
Thermal and Mechanical Characteristics of a Multifunctional Thermal Energy Storage Structure
107
Thermal and mechanical characteristics of a multi-functional Thermal Energy Storage structure
108
Thermal and mechanical characterization of ViaLux(TM) 81: a novel epoxy photo-dielectric dry film (PDDF) for microvia applications
109
Thermal and mechanical characterization of ViaLUX
TM
81: a novel epoxy photo-dielectric dry film (PDDF) for microvia applications
110
Thermal and mechanical considerations for a liquid-cooled high-fluence electron-beam transmission window
111
Thermal and Mechanical Considerations for Silicon-Resin High-Density Substrate
112
Thermal and mechanical design and analysis of 3D IC interposer with double-sided active chips
113
Thermal and mechanical design optimisation of a micro machined mid-infrared emitter for optical gas sensing systems
114
Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module
115
Thermal and mechanical effects on gyrotron gun anode electrical performance
116
Thermal and mechanical finite element analysis of a VLSI package including spatially varying thermal contact resistance
117
Thermal and Mechanical Loading Effects on the Reliability of COG-ACF with Thin Glass by FEA
118
Thermal and mechanical loading of particle and RF transmission windows exposed to atmospheric pressure
119
Thermal and mechanical optimization of water jacket of permanent magnet synchronous machines for EV application
120
Thermal and Mechanical Performance of the First MICE Coupling Coil and the Fermilab Solenoid Test Facility
121
Thermal and Mechanical Problems on 138-Kv Pipe Cable in New Jersey
122
Thermal and mechanical properties analysis for EHV XLPE cables with different operating years
123
Thermal and mechanical properties of EPR and XLPE cable compounds
124
Thermal and mechanical properties of polyimide nanocomposites
125
Thermal and mechanical reliability of low-temperature solder alloys for handheld devices
126
Thermal and Mechanical Reliability Tests of Lead - free soldered SMT Joints
127
Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2004 (IEEE Cat. No.04EX831)
128
Thermal and mechanical simulation of bulk resonators
129
Thermal and mechanical stability of soldering QFP with Sn-Bi-Ag lead-free alloy
130
Thermal and mechanical stress analysis for a Bitter-type toroidal field magnet for ZEPHYR
131
Thermal and mechanical stress in induction coilguns
132
Thermal and mechanical way of obtaining dry timber in an electromagnetic field of a very high frequency
133
Thermal and Microwave Constrained Focusing for Patient-Specific Breast Cancer Hyperthermia: A Robustness Assessment
134
Thermal and Microwave Nitrogen Plasma Nitridation Techniques for Ultrathin Gate Insulators of MOS VLSI
135
Thermal and Mn diffusion behaviors of CoNbZr based spin valves with nano-oxide layers
136
Thermal and Mn diffusion behaviors of CoNbZr-based spin valves with nano oxide layers
137
Thermal and moisture degradation in SSL system
138
Thermal and moisture induced stressing effects of RF power amplifier modules
139
Thermal and morphological influence on the B
1u
lattice mode in polyethylene observed using terahertz time-domain spectroscopy
140
Thermal and Narrowband Multispectral Remote Sensing for Vegetation Monitoring From an Unmanned Aerial Vehicle
141
Thermal and noise problems in avalanche microwave oscillators
142
Thermal and nonthermal aspects of nanosecond pulsed laser ablation
143
Thermal and non-thermal electric discharge processes for chemical synthesis in waste destruction
144
Thermal and non-thermal kinetics of defects and dopant in Si
145
Thermal and non-thermal lensing of Yb:YAG and Tm:YAG thin slab laser gain media
146
Thermal and nonthermal mechanisms of interaction of radio-frequency energy with biological systems
147
Thermal and nuclear events associated with Pd+D codeposition
148
Thermal and optical analysis of four-chip HPLED package with different thermal interface material
149
Thermal and optical analysis of multi-chip LED packages with different electrical connection and driving current
150
Thermal and Optical Characterization of Photonic Integrated Circuits by Thermoreflectance Microscopy
151
Thermal and Optical Characterization of Silicon-Based Tunable Optical Thin-Film Filters
152
Thermal and Optical Performance of a Light-Emitting-Diode Metal Package With an Integrated Reflector and Heat Spreader Structure
153
Thermal and optical properties of organic dyes for super-resolution recordable disc
154
Thermal and optical properties of power LEDs
155
Thermal and Optical Properties of SiO
2
/GaN Opals by Photothermal Deflection Technique
156
Thermal and Optical Properties of Yb
3+
- and Nd
3+
-Doped Phosphate Glasses Determined by Thermal Lens Technique
157
Thermal and optical simulation of high-power LED array based on silicon heatsink
158
Thermal and optical tuning of the resonant frequency in YBCO thin films
159
Thermal and package design of high power laser diodes
160
Thermal and package performance limitations in LDMOSFET´s for RFIC applications
161
Thermal and plasma-enhanced atomic layer deposition of hafnium oxide on semiconductor substrates
162
Thermal and power aware Internet of Things enable RAM design on FPGA
163
Thermal and Power Characterization of Real Computing Devices
164
Thermal and power considerations in class B transistorized amplifiers
165
Thermal and power generating performances of thermoelectric energy recovery modules
166
Thermal and power integrity based power/ground networks optimization
167
Thermal and power-aware task scheduling for Hadoop based storage centric datacenters
168
Thermal and quantum noise
169
Thermal and Radiation Stability of Thin-Film Cermet Resistive Elements
170
Thermal- and radiation-induced interface traps in MOS devices
171
Thermal and Reference Noise Analysis of Time-Interleaving SAR and Partial-Interleaving Pipelined-SAR ADCs
172
Thermal and reliability analysis of clip bonding package using high thermal conductivity adhesive
173
Thermal and reverse base current effects on heterojunction bipolar transistors and circuits
174
Thermal and slip effects on rotor time constant in vector controlled induction motor drives
175
Thermal and source bumps utilizing carbon nanotubes for flip-chip high power amplifiers
176
Thermal and spatial dependence of TSV-induced stress in Si
177
Thermal and spatial design of a high power density drive
178
Thermal and spatial profiling of TSV-induced stress in 3DICs
179
Thermal and spectroscopic characterization of quantum dot-enhanced solar cells
180
Thermal and spin-torque noise in CPP (TMR and/or GMR) read sensors
181
Thermal and Stark-Effect Roll-Over of Quantum-Cascade Lasers
182
Thermal and stress analysis of semiconductor wafers in a rapid thermal processing oven
183
Thermal and stress analysis of the Faraday shield for the ORNL/TFTR RF antenna
184
Thermal and structural analysis of a beam stop
185
Thermal and structural analysis of electron gun for high efficiency space TWT
186
Thermal and Structural Analysis of Ring Components by the Finite Element Method
187
Thermal and structural analysis of the first wall in the SIRIUS-P reactor
188
Thermal and structural analysis of the ITER ELM coils
189
Thermal and structural analysis of the TPX divertor
190
Thermal and structural analysis on output coupler of helix-TWT
191
Thermal and structural characterization of polyaniline-dbsa complexation without auxiliary solvents
192
Thermal and structural modeling of high efficient multi-stage depressed collector for space applications
193
Thermal and structural properties of elastic epoxy for high voltage
194
Thermal and Structural Simulation Techniques for Estimating Fatigue Life of an IGBT Module
195
Thermal and tangential-momentum accommodation coefficients for N
2
colliding with surfaces of relevance to disk-drive air bearings derived from molecular beam scattering
196
Thermal and thermal stress analysis of a thin-film thermoelectric cooler under the influence of the Thomson effect
197
Thermal and thermoelectric properties of III-nitride and III-oxynitride films
198
Thermal and Thermoelectric Properties of Nanostructured versus Crystalline SiGe
199
Thermal and thermo-mechanical aging of epoxy-mica insulated stator bars
200
Thermal and thermo-mechanical aging of epoxy-mica insulated stator bars
201
Thermal and thermo-mechanical behavior of silicon platform with direct lead attachment
202
Thermal and thermo-mechanical simulations on high power diode packaging for a typical power adapter
203
Thermal and thermomechanical study of micro-refrigerators on a chip based on semiconductor heterostructures
204
Thermal and thermo-oxidative aging effects on the dielectric properties of thin polyimide films coated on metal substrate
205
Thermal and topological characterization of Au, Ru and Au/Ru based MEMS contacts using nanoindenter
206
Thermal and transport modeling of high pressure discharge lamps
207
Thermal and trapping effects in GaN-based MESFETs
208
Thermal and trapping phenomena assessment on AlGaN/GaN microwave power transistor
209
Thermal and vibrational energy harvesting using PZT- and BT-based ceramics
210
Thermal and viscoelastic characterization of transfer-molded epoxy encapsulant during simulated post-mold cure
211
Thermal and Visual Image Registration in Hough Parameter Space
212
Thermal and visual information fusion for outdoor scene perception
213
Thermal and voltage distribution along insulator strings with semiconducting RTV coatings
214
Thermal and voltage testing and characterization of supercapacitors and batteries
215
Thermal and Wetting Properties of Water-Soluble Fluxes and Solder Pastes
216
Thermal anisotropic properties of composite materials
217
Thermal annealing action on plastic deformation of submicrocrystalline alpha-iron
218
Thermal annealing action on the capacity-voltage and siemens-voltage characteristic Ga
2
O
3
-GaAs structures
219
Thermal annealing affects vertical morphology, doping and defect density in BHJ OPV devices
220
Thermal annealing behavior of iron implanted into alumina
221
Thermal annealing characteristics of amorphous silicon-based solar cells incorporating stable protocrystalline silicon and unstable microcrystalline silicon at the onset of a microcrystalline regime
222
Thermal annealing effect on 1.3-μm GaInNAs/GaAs quantum well structures capped with dielectric films
223
Thermal Annealing Effect on Elastic-Plastic Behavior of Al-Si-Cu Structural Films Under Uniaxial and Biaxial Tension
224
Thermal annealing effect on electrical characteristics of CuPc thin-film transistors on glass with ZrO
2
as gate dielectric
225
Thermal annealing effect on self-assembled GaInNAs/GaAs quantum dots grown by chemical beam epitaxy
226
Thermal Annealing Effect on the Field Emission Characteristics of Double-Walled Carbon Nanotubes
227
Thermal annealing effect on the Mg doped AlGaN/GaN superlattice
228
Thermal annealing effect on the Mg doped AlGaN/GaN superlattice
229
Thermal annealing effects of n-docosylquinolium-TCNQ Langmuir-Blodgett films
230
Thermal Annealing Effects on the Performance of a Ga-Doped ZnO Transparent-Conductor Layer in a Light-Emitting Diode
231
Thermal Annealing for Improving Gold Nano-particles Charge Trapping Layer Nonvolatile Memory Reliability Applications
232
Thermal annealing in hydrogen for 3-D profile transformation on silicon-on-insulator and sidewall roughness reduction
233
Thermal annealing in irradiated garnet films
234
Thermal Annealing induced relaxation of compressive strain in porous GaN structures
235
Thermal annealing of AuPt Schottky contacts on GaAs and AlGaAs
236
Thermal annealing of fiber Bragg gratings directly inscribed by an ultrafast infrared laser
237
Thermal annealing of GaAs concentrator solar cells
238
Thermal annealing of He
+
implanted optical waveguides in LiNbO
3
239
Thermal annealing of magneto-optical (Cd,Mn)Te waveguide for wider operation wavelength range of optical isolator
240
Thermal annealing of metal-semiconductor contact for CZT detectors
241
Thermal annealing of Nb/Al-AlO
x
/Nb Josephson junctions
242
Thermal annealing of proton-irradiated silicon solar cells
243
Thermal Annealing of Radiation Damage in CMOS ICs in the Temperature Range -140°C to +375°C
244
Thermal Annealing of Radiation Induced Defects: A Diffusion-Limited Process?
245
Thermal annealing of radiation-induced defect centers during recovery of diffused junction and epitaxial InP solar cells
246
Thermal annealing of RF sputtered NbN
247
Thermal annealing of the Si/SiO
2
interface probed by surface nonlinear optical techniques
248
Thermal annealing of trapped holes in SIMOX buried oxides
249
Thermal annealing study of radiation induced defects in nitride-based multi- junction solar cell structures using Deep Level Transient Spectroscopy
250
Thermal Annealing Study On InGaAs/GaAs Quantum Dot Infrared Photodetectors
251
Thermal anomalies detection before 2013 Songyuan earthquake using MODIS LST data
252
Thermal anomaly detection for 2014 Jinggu earthquake using remote sensing data
253
Thermal anomaly prediction in data centers
254
Thermal application analysis of renewable water of sewage treatment plant in Hohhot city
255
Thermal Aspects and High-Level Explorations of 3D Stacked DRAMs
256
Thermal Aspects and Static/Dynamic Protrusion Behaviors in Heat-Assisted Magnetic Recording
257
Thermal aspects of a shipboard integrated electric power system
258
Thermal aspects of building integrated PV systems
259
Thermal aspects of burn-in of high power semiconductor devices
260
Thermal aspects of changes in the environment of underground cables
261
Thermal aspects of field weakening implementation for robotics applications
262
Thermal aspects of GaAs power FET attachment using isotropically conductive adhesive
263
Thermal aspects of high-average-power electrooptic switches
264
Thermal aspects of LED automotive headlights
265
Thermal aspects of post-arc recovery dielectric strength of solid insulators
266
Thermal aspects of pump-laser packaging
267
Thermal aspects of small electromagnetic devices for application in jet engine environments
268
Thermal aspects of soldering equipments
269
Thermal asperity detection and cancellation in perpendicular magnetic recording systems
270
Thermal asperity of TMR heads for removable disk drives
271
Thermal Asperity Sensor Application to Hard Disk Drive Operational Shock
272
Thermal asperity suppression in perpendicular recording channels
273
Thermal asperity suppression in perpendicular recording channels
274
Thermal asperity trends
275
Thermal assembly of polysilicon microactuators with narrow-gap electrostatic comb drive
276
Thermal assembly of polysilicon microstructures
277
Thermal assessment of glass-metal composition plasma display panels using design of experiments
278
Thermal assessment of RF integrated LTCC front end module (FEM)
279
Thermal assessment of RF-integrated LTCC front end modules
280
Thermal assisted finite element analysis of electrical machines
281
Thermal Assisted Switching Magnetic Tunnel Junctions as FPGA memory elements
282
Thermal asymmetry compensation of a wind sensor fabricated on ceramic substrate
283
Thermal auditing of buildings: essential step towards designing energy efficient houses
284
Thermal aware AND-OR-XOR network synthesis
285
Thermal aware automated load balancing for HPC applications
286
Thermal aware clock synthesis considering stochastic variation and correlations
287
Thermal aware clock tree optimization with balanced clock skew in 3D ICs
288
Thermal Aware Clocktree Optimization in Nanometer VLSI Systems Considering Temperature Variations
289
Thermal aware design method for VCSEL-based on-chip optical interconnect
290
Thermal aware design methodology for small signal discrete products
291
Thermal Aware Don´t Care Filling to Reduce Peak Temperature and Thermal Variance during Testing
292
Thermal aware energy efficient bengali unicode reader in Text analysis
293
Thermal aware energy efficient comparator design using LVMOS IO standards on 28nm FPGA
294
Thermal aware energy efficient Gurumukhi Unicode reader for natural language processing
295
Thermal aware FPGA architectures and CAD
296
Thermal aware FPRM based AND-XOR network synthesis of logic circuits
297
Thermal Aware Global Routing of VLSI Chips for Enhanced Reliability
298
Thermal aware Graphene based Through Silicon Via design for 3D IC
299
Thermal Aware Low Power Universal Asynchronous Receiver Transmitter Design on FPGA
300
Thermal aware modern VLSI floorplanning
301
Thermal Aware Module Placement for Heterogeneous 3D-IC Based FPGAs
302
Thermal aware output polarity selection of programmable logic arrays
303
Thermal Aware Placement in 3D ICs
304
Thermal aware power gated design
305
Thermal Aware Processor Operation Point Management
306
Thermal aware scheduling on an Intel desktop computer
307
Thermal Aware Task Scheduling for Embedded Systems
308
Thermal aware task sequencing on embedded processors
309
Thermal aware test scheduling for stacked multi-chip-modules
310
Thermal aware timing budget for buffer insertion in early stage of physical design
311
Thermal aware workload scheduling with backfilling for green data centers
312
Thermal axisymmetric waves in vortex-free beams from diodes and tetrodes
313
Thermal baffling of batteries in a simulated optical network unit: thermal design and analysis
314
Thermal balance in plane thermoionic cathodes of radio-frequency tubes without anodes
315
Thermal balance test of LNG engine at different coolant temperatures
316
Thermal balance testing for advanced, lightweight solar array designs
317
Thermal balancing of liquid-cooled 3D-MPSoCs using channel modulation
318
Thermal Balancing Policy for Multiprocessor Stream Computing Platforms
319
Thermal Balancing Policy for Streaming Computing on Multiprocessor Architectures
320
Thermal barrier sensor coatings - sensing damage and ageing in critical components
321
Thermal based angle fixing for micromirrors
322
Thermal based mass flow control for ion implant SDS(R) applications
323
Thermal Based Micro Flow Sensor Optimization Using Coupled Electrothermal Numerical Simulations
324
Thermal battery based on a new, high-voltage cathodic material
325
Thermal battery for aircraft emergency power
326
Thermal battery performance demonstration for advanced tactical and strategic applications
327
Thermal beam distortions in end-pumped Nd:YAG, Nd:GSGG, and Nd:YLF rods
328
Thermal behavior analysis of lead-free flip-chip ball grid array packages with different underfill material properties
329
Thermal behavior analysis of ZnO polymeric surge arrester using the finite elements method
330
Thermal behavior and end-of-life characteristics of the nickel-zinc battery
331
Thermal Behavior and Quench of the ITER TF System During a Fast Discharge and Possibility of a Secondary Quench Detection
332
Thermal behavior and stability of room-temperature continuous Al
x
Ga
1-x
As-GaAs quantum well heterostructure lasers grown on Si
333
Thermal behavior criteria of flame retarded wood obtained by Simultaneous Thermal Analysis: I. New thermal behavior criteria of wood
334
Thermal behavior criteria of flame retarded wood obtained by simultaneous thermal analysis: II. Flame retardancy criteria of wood
335
Thermal behavior criteria of flame retarded wood obtained by simultaneous thermal analysis: III. Thermal behavior criteria of plasma-aided flame retardancy
336
Thermal behavior depending on emitter finger and substrate configurations in power heterojunction bipolar transistors
337
Thermal behavior for induction motor using DC signal injection method by Matlab
®
Simulation
338
Thermal Behavior Investigation of Terahertz Quantum-Cascade Lasers
339
Thermal behavior of 1.55 µm (100) InAs/InP-based quantum dot lasers
340
Thermal behavior of a composite superconductor in stability margin experiments
341
Thermal behavior of a diamond window unit for fusion applications
342
Thermal behavior of a dynamic domain-wall motion model for hysteresis in power ferrites
343
Thermal behavior of a partition wall with phase change material between local non conditioned and different locals conditioned
344
Thermal behavior of a Sedum lineare green roof during subtropical summer period: A case study in Guangzhou, China
345
Thermal behavior of a soldered Cu-Si interface
346
Thermal behavior of a solid nitrogen impregnated high-temperature superconducting pancake test coil under transient heating
347
Thermal behavior of a superjunction MOSFET in a high-current conduction
348
Thermal behavior of a three phase inverter for EV (Electric Vehicle)
349
Thermal Behavior of a Three-Phase Induction Motor Fed by a Fault-Tolerant Voltage Source Inverter
350
Thermal behavior of aged lithium-ion batteries: calorimetric observations
351
Thermal behavior of AlGaN/GaN HEMT on silicon Microstrip technology
352
Thermal behavior of an electrical motor through a reduced model
353
Thermal behavior of atomic hydrogen passivated acceptors in p-InP
354
Thermal behavior of BAW filters at high RF power levels
355
Thermal Behavior of Composite Girder Bridges
356
Thermal behavior of connectors in joints
357
Thermal behavior of crystalline thin film silicon solar cells
358
Thermal behavior of distribution MV underground cables
359
Thermal behavior of doped polyaniline
360
Thermal behavior of doubly-fed induction generator wind turbine system during balanced grid fault
361
Thermal Behavior of EHV Gas-Insulated Lines in Brenner Pass Pilot Tunnel
362
Thermal behavior of etched tracks and embedded metallic nanotubules
363
Thermal behavior of flip chip LED packages using electrical conductive adhesive and soldering methods
364
Thermal behavior of freestanding microstructures fabricated by silicon frontside processing using porous silicon as sacrificial layer
365
Thermal behavior of GaAs/AlGaAs quantum-cascade-lasers: effect of the Al content in the barrier layers
366
Thermal behavior of high-performance temperature programmed microfabricated gas chromatography columns
367
Thermal behavior of IGBT subjected to short power pulses of high amplitude
368
Thermal behavior of InGaAs-THz photoconductive antennas
369
Thermal behavior of intrinsic polyaniline and its derivatrives
370
Thermal behavior of ITO/TiO2/CdS/CdTe solar cells
371
Thermal behavior of millimeter wavelength radio telescopes
372
Thermal behavior of PCM building material under periodic convection boundary conditions
373
Thermal Behavior of Remote Phosphor in Light-Emitting Diode Packages
374
Thermal behavior of residual damage in low-dose implanted silicon after high-temperature rapid thermal annealing
375
Thermal Behavior of Residual Defects in Low-Dose Arsenic- and Boron-Implanted Silicon After High-Temperature Rapid Thermal Annealing
376
Thermal behavior of self-heating effect in FinFET devices acting on back-end interconnects
377
Thermal behavior of silicon carbide valve blocks
378
Thermal behavior of simulated chips during power-off transient period
379
Thermal behavior of Sn nanowires for nano-interconnection
380
Thermal behavior of solder bonded and adhesive bonded folded fin assemblies
381
Thermal behavior of stack-based 3D ICs
382
Thermal behavior of tensile-strain InGaAsP-InP lasers with varying ridgewidth
383
Thermal behavior of the constant volume body plethysmograph
384
Thermal behavior of visible AlGaInP-GaInP ridge laser diodes
385
Thermal Behavior Optimization in Multi-MW Wind Power Converter by Reactive Power Circulation
386
Thermal behavior optimization in multi-MW wind power converter by reactive power circulation
387
Thermal behaviour and design of magnetic components in high-frequency static convertors
388
Thermal behaviour and reliability of solidly mounted Bulk Acoustic Wave Duplexers under high power RF loads
389
Thermal behaviour of 1.3 μm vertical cavity surface emitting laser
390
Thermal behaviour of a three-phase induction motor fed by a fault tolerant voltage source inverter
391
Thermal behaviour of cables installed via directional drilling
392
Thermal behaviour of different fuse enclosure packages in 24 kV.SF
6
main units
393
Thermal behaviour of epoxy resin filled with high thermal conductivity nanopowders
394
Thermal Behaviour of Fuse at Lightning Influences
395
Thermal behaviour of gate-less AlGaN/GaN heterostructures
396
Thermal behaviour of induction motors under different speeds
397
Thermal behaviour of lateral power devices on SOI substrates
398
Thermal behaviour of low voltage cables in smart grid — Related environments
399
Thermal behaviour of miniaturized surface mounted devices
400
Thermal behaviour of network components depending on outdoor weather conditions
401
Thermal behaviour of network components depending on outdoor weather conditions
402
Thermal behaviour of PT and NPT IGBT
403
Thermal behaviour of thin photoactive layer crystalline solar cells
404
Thermal behaviours of silicone-based optical interconnects with mirror optical coupling
405
Thermal bilateral control for reproduction of thermal contact between remote places
406
Thermal bilateral control with scaled thermal information using peltier device
407
Thermal bilateral coupling in teleoperators
408
Thermal Bimetallic Microactuators by Ni and Ni-diamond Nanocomposite
409
Thermal birefringence effect in Nd/sup 3+/-doped YAG ceramics
410
Thermal birefringence in Nd/sup 3+/-doped YAG ceramics
411
Thermal bit writing simulations in magneto-optic recording media
412
Thermal bit-writing dynamics in magneto-optic recording media
413
Thermal blooming and instability of light beams due to absorption
414
Thermal boundary layer flow on a stretching plate with radiation effect
415
Thermal Boundary Resistance Between GaN and Substrate in AlGaN/GaN Electronic Devices
416
Thermal Boundary Resistance in Optoelectronic Devices
417
Thermal Boundary Resistance Measurements for Phase-Change Memory Devices
418
Thermal boundary resistance of a YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta///SrTiO/sub 3/ multilayer strip
419
Thermal breakdown delay time in silicon p-n junctions
420
Thermal breakdown in silicon p-n junction devices
421
Thermal breakdown modeling in polyimide films by solving the heat balance equation
422
Thermal breakdown modeling in polyimide films considering different conduction models
423
Thermal Breakdown of Silicone Liquids under Pulsed High-Frequency Field
424
Thermal breakdown of solid dielectrics
425
Thermal breakdown of VLSI by ESD pulses
426
Thermal Brealdown and Thermal Runaway Phenomena in EHV Cables
427
Thermal broadening of two-dimensional electron gas mobility distribution in AlGaN/AlN/GaN heterostructures
428
Thermal bubble behaviour in liquid nitrogen between inclined plane electrodes
429
Thermal bubble breakdown in cryogenic liquids under non-uniform fields
430
Thermal bubble breakdown in liquid nitrogen under nonuniform fields
431
Thermal bubble dynamics in cryogenic liquids under non-uniform electric fields on superconducting power apparatus
432
Thermal Bubble Microfluidic Gate Based on SOI Wafer
433
Thermal bubble motion in liquid nitrogen under nonuniform electric fields
434
Thermal bubble-triggered breakdown under DC, AC and impulse nonuniform electric fields in liquid nitrogen
435
Thermal buckling actuator for micro relays
436
Thermal buckling of silicon sheet
437
Thermal budget adjustment of borophosphosilicate glass reflow-anneal for silicide process requirement
438
Thermal budget calculations, design aspects, and device performance of high-Tc air-bridged microbolometers
439
Thermal budget impact on HKMG Al
2
O
3
and La gate stacks for advanced DRAM periphery transistors
440
Thermal budget limits of quarter-micrometer foundry CMOS for post-processing MEMS devices
441
Thermal budget optimization on Strained Silicon-On-Insulator (SSOI) CMOS
442
Thermal budget reduction and throughput enhancement for CMOS Epi stressors via wet clean interface contamination evaluation and control
443
Thermal budget simulations and device performance of microstructured high-T/sub c/ transition edge bolometers on silicon
444
Thermal budgeting in a double level metal process with CVD tungsten as first metal
445
Thermal building model identification using time-scaled identification methods
446
Thermal CAD for power III-V devices and MMICs
447
Thermal CAD of power hybrid devices using light computer means [microcomputer application]
448
Thermal Calculation of a Buried Gas Pipeline
449
Thermal Calculation of Environmentally Friendly Gas-Fired Vacuum Hot Water Boiler
450
Thermal calculation of systems with distributed heat generation
451
Thermal calculation using a 3D-EM solver and thermal-electrical analogy
452
Thermal calculations for buried gas-insulated transmission lines (GIL) and XLPE-cable
453
Thermal calculations of gas insulated transmission lines GIL based on thermal networks
454
Thermal Calibration for the Accelerometer Triad Based on the Sequential Multiposition Observation
455
Thermal calibration of a 3 DOF ultra high-precision robot operating in industrial environment
456
Thermal Calibration of Heated Silicon Atomic Force Microscope Cantilevers
457
Thermal Calibration of Low Cost MEMS Sensors for Land Vehicle Navigation System
458
Thermal Calibration of MEMS Inertial Sensors for an FPGA-Based Navigation System
459
Thermal calibrators in millimeter-wave radiometry—A word of caution
460
Thermal camera cores - present and future
461
Thermal camera using FPGA-based system (ICCAS 2011)
462
Thermal camera utilizes infrared radiations
463
Thermal capability assessment for transformers
464
Thermal Capability Of Solid Dielectric Cable Materials
465
Thermal capacitance matching in 3D many-core architectures
466
Thermal capacity of collector system feeders in wind farms
467
Thermal carrier generation in charge-coupled devices
468
Thermal cesium beam frequency standard with optical pumping at CENAM
469
Thermal challenges and opportunities in concentrated photovoltaics
470
Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation
471
Thermal challenges in 3-D stacked packaging
472
Thermal challenges in high power optical parametric amplifiers
473
Thermal challenges in next generation electronic systems - summary of panel presentations and discussions
474
Thermal Challenges in Next-Generation Electronic Systems
475
Thermal challenges in Photonic Integrated Circuits
476
Thermal challenges in power electronics
477
Thermal challenges in the future generation solid state lighting applications: light emitting diodes
478
Thermal challenges in the next generation of computer, telecommunication, and military electronic equipment
479
Thermal challenges of a compact power entry module with 7,000 W output in a telecom system
480
Thermal challenges on solar concentrated thermoelectric CHP systems
481
Thermal challenges to building reliable embedded systems
482
Thermal challenges to building reliable embedded systems
483
Thermal challenges to gate length reduction of FET
484
Thermal Change of Complex Permeability in Photoexcited Yttrium Iron Garnet
485
Thermal channel noise of quarter and sub-quarter micron NMOSFET´s
486
Thermal Characteftistics of Potted Electronic Modules
487
Thermal characterisation and analysis of two tone intermodulation distortion in InGaP/GaAs DHBT
488
Thermal characterisation and heat transfer analysis of a wire bond chip-on-board package
489
Thermal Characterisation and Liquid Cooling System Integration for Stacked Modules
490
Thermal characterisation of a pulsed power amplifier by direct channel temperature measurement
491
Thermal characterisation of AlGaN/GaN HEMT on silicon carbide substrate for high frequency application
492
Thermal characterisation of cots electronic boards
493
Thermal characterisation of electrically conductive adhesive flip-chip joints
494
Thermal characterisation of human skin using differential thermometry
495
Thermal Characterisation of LTCC Frontend Modules with Integrated Power Amplifiers for Wireless LAN Application
496
Thermal Characterisation of LTCC Frontend Modules with Integrated Power Amplifiers for Wireless LAN Application
497
Thermal characterisation of novel crystalline semitransparent solar cell
498
Thermal characterisation of planar transformers
499
Thermal characterisation of threshold voltage and short channel effect of thin film SOI MOSFET
500
Thermal characterisation of vertical multichip modules MCM-V
501
Thermal characteristic analysis of new structure in 850nm VCSEL
502
Thermal Characteristic Analysis of Power Lithium-ion Battery System for Electric Vehicle
503
Thermal characteristic measurement in jacketed and unjacketed fibres by a spatial technique
504
Thermal characteristic of double-side tabular permanent magnet linear synchronous motor in different working models
505
Thermal characteristic simulation of semiconductor laser based on Abaqus
506
Thermal Characteristics Analysis of Die Attach Layer Based on Time-Constant Spectrum for High-Power LED
507
Thermal characteristics and thermal compensation of four frequency ring laser gyro
508
Thermal Characteristics and Thermomechanical Reliability of Board-Level Stacked-Die Packages Subjected to Coupled Power and Thermal Cycling Test
509
Thermal Characteristics in Motion Sensor for High Temperature environments
510
Thermal characteristics in square channel with 45° staggered baffle inserts
511
Thermal characteristics in turbulent channel flows with V-baffle vortex generators
512
Thermal characteristics of 1.3μm GaAsSb/GaAs-based edge- and surface-emitting lasers
513
Thermal Characteristics of 1.55-
m InGaAlAs Quantum Well Buried Heterostructure Lasers
514
Thermal Characteristics of 16- and 40-Pin Plastic DIP´s
515
Thermal Characteristics of 275 kV/3 kA Class YBCO Power Cable
516
Thermal Characteristics of 2G HTS Tape With Anodized Aluminum Stabilizer for Cryogen-Free 2G HTS Magnet
517
Thermal Characteristics of a 120-Kv High-Pressure, Gas-Filled Cable Installation
518
Thermal characteristics of a fiber Fabry-Perot etalon made of PANDA fiber
519
Thermal characteristics of a fixed disk drive
520
Thermal characteristics of a four-chip magnetic bubble package
521
Thermal characteristics of a Ka-band planar helix slow-wave structure
522
Thermal characteristics of a laboratory electromagnetic launcher
523
Thermal characteristics of a laboratory EM launcher
524
Thermal characteristics of a meta-aramid and cellulose insulated transformer at loads beyond nameplate
525
Thermal Characteristics of a Mets-Aramid and Cellulose Insulated Transformer at Loads Beyond Nameplate
526
Thermal characteristics of a PtMn GMR sensor subjected to square wave EOS pulses
527
Thermal Characteristics of All-Optical ADM Using Fiber Bragg Gratings and Mach-Zehnder Interferometer for WDM Optical Communication Networks
528
Thermal characteristics of an advanced bMPI-based 1T-DRAM cell
529
Thermal characteristics of batteries
530
Thermal Characteristics of Beam-Lead Chips
531
Thermal characteristics of buried resistors
532
Thermal characteristics of buried-heterostructure injection lasers
533
Thermal Characteristics of Chip Stack and Package Stack Memory Devices in the Component and Module Level
534
Thermal characteristics of deep red (0.77 mu m) vertical-cavity surface-emitting lasers
535
Thermal characteristics of diamond film coatings for GaN HEMT devices
536
Thermal characteristics of diving garments when Using argon as a suit inflation gas
537
Thermal characteristics of dot-matrix print heads
538
Thermal characteristics of edge-illumination type LED backlight system in a thin flat panel display
539
Thermal characteristics of energized coal mine trailing cables
540
Thermal characteristics of energized shielded and reeled trailing cables
541
Thermal characteristics of energized shielded drag and an unshielded reeled trailing cable
542
Thermal Characteristics of Enterprise-Class Hard Disk Drives
543
Thermal characteristics of Fe powders with micro-and nano-sized particles
544
Thermal characteristics of filled silicone rubber under laser heating
545
Thermal characteristics of GaAs-based quantum cascade lasers
546
Thermal characteristics of glass-metal composition plasma display panels
547
Thermal characteristics of high speed devices
548
Thermal characteristics of high voltage whole-solid-insulated polymeric ZnO surge arrester
549
Thermal Characteristics of High-Voltage Whole-Solid-Insulated Polymeric ZnO Surge Arrester
550
Thermal Characteristics of Horizontally Oriented Electronic Components in an Enclosed Environment
551
Thermal characteristics of InGaP/GaAs HBT ballasted with extended ledge
552
Thermal Characteristics of Integrated Module Board
553
Thermal characteristics of jacketed optical fibers with initial imperfection
554
Thermal characteristics of light-emitting diodes and their effect on passive optical networks
555
Thermal characteristics of multi-die, three-dimensional integrated circuits with unequally sized die
556
Thermal Characteristics of Multilayer Printed Wiring Boards During Lamination
557
Thermal characteristics of non-transferred DC plasma torches under various combinations of pure and mixture gases
558
Thermal characteristics of optical delay in fibers used in pulsed laser rangefinding
559
Thermal Characteristics of Plastic Small Outline Transistor (SOT) Packages
560
Thermal characteristics of quantum-cascade lasers by micro-probe optical spectroscopy
561
Thermal Characteristics of Reeled Trailing Cables for Shuttle Cars
562
Thermal characteristics of RTV silicone rubber coatings as a function of filler level
563
Thermal characteristics of scattering stencil reticle for EB stepper
564
Thermal characteristics of selected EV and HEV batteries
565
Thermal characteristics of semiconductor laser phase-locked arrays with diamond film heatsink
566
Thermal characteristics of shuttle car cable reels
567
Thermal characteristics of SiC diode assembly to ceramic substrate
568
Thermal characteristics of silicone rubber filled with ATH and silica under laser heating
569
Thermal characteristics of single and multilayer high performance PQFP packages
570
Thermal characteristics of single and multi-layer high performance PQFP packages
571
Thermal characteristics of submicron vias studied by scanning Joule expansion microscopy
572
Thermal characteristics of surface-wave recirculating loops on a y-cut quartz disc delay line
573
Thermal characteristics of TAB for small systems
574
Thermal characteristics of TAB for small systems
575
Thermal characteristics of the ethanol-filled hollow-core photonic-crystal- fiber modal interferometer
576
Thermal characteristics of TIMs with elliptical particles
577
Thermal characteristics of traveling wave rotary ultrasonic motors
578
Thermal Characteristics of Two Types of Concrete Conduit Installations
579
Thermal characteristics of two-dimensional photonic crystal lasers
580
Thermal characteristics of two-phase flow of a dielectric fluid in surface-augmented microchannels
581
Thermal characteristics of Ytterbium-doped phosphosilicate fiber amplifiers
582
Thermal characteristics simulation of semiconductor lasers packaging for high speed application
583
Thermal characteristics study of a water-cooled permanent magnet linear motor
584
Thermal Characterization and Compact Modeling of Stacked Die Packages
585
Thermal characterization and electrical performance of low profile power packages
586
Thermal characterization and modeling of BEOL for 3D integration
587
Thermal characterization and modeling of ultra-thin silicon chips
588
Thermal characterization and modelling of a gallium arsenide power amplifier MMIC
589
Thermal characterization and modelling of lithium-based batteries at low ambient temperature
590
Thermal Characterization and Optimization in Platform FPGAs
591
Thermal characterization and optimization of a blower heat sink for small form factor micro-computer desktop applications
592
Thermal Characterization and Simulation of Packaged Medium Power Amplifier
593
Thermal characterization and simulation study of 2.5D packages with multi-chip module on through silicon interposer
594
Thermal Characterization and Temperature Control of Piezoresistive Microcantilevers
595
Thermal characterization for a modular 3-D multichip module
596
Thermal Characterization for Reliability Assessment of Solidly Mounted Resonators
597
Thermal Characterization of
Thin Films Using Transient Thermoreflectance Technique
598
Thermal characterization of a 149-lead VLSI package with heat sink
599
Thermal characterization of a 149-lead VLSI package with heatsink
600
Thermal characterization of a 3-dimensional memory module
601
Thermal characterization of a coaxial calculable resistor
602
Thermal characterization of a fan-sink for an AGP card
603
Thermal characterization of a high power infrared emitter as a function of input current
604
Thermal Characterization of a Laser Diode and Its Peltier Cooler for Optical Communications: Measurements and Predictive Modeling
605
Thermal characterization of a liquid cooled AlSiC base plate with integral pin fins
606
Thermal characterization of a mercury arc lamp for a projection display system
607
Thermal Characterization of a Microfluidic Cell using the 3ω Method
608
Thermal characterization of a microwave generator and its effects on the frequency stability
609
Thermal characterization of a multi-heat source component with and without an external heat sink
610
Thermal characterization of a PLCC-expanded
R
jc
methodology
611
Thermal characterization of a PLCC-expanded R
jc
methodology
612
Thermal characterization of a printed circuit board with thermal vias for the application of high brightness light-emitting diodes
613
Thermal characterization of a radial micro-channel cooling plate
614
Thermal characterization of a Tape Carrier Package
615
Thermal characterization of a tape carrier package
616
Thermal characterization of a thermally enhanced QFN package
617
Thermal characterization of a thin film heater on glass substrate for lab-on-chip applications
618
Thermal characterization of a wide I/O 3DIC
619
Thermal characterization of an alumina ceramic MCM with conductive slugs
620
Thermal Characterization Of An Amtec Recirculating Test Cell
621
Thermal characterization of an axle-twin-drive with system integrated double-inverter
622
Thermal Characterization of an Ultrasonic Density-Measurement Cell
623
Thermal Characterization of an Ultrasonic Measurement Cell
624
Thermal characterization of bare-die stacked modules with Cu through-vias
625
Thermal characterization of BIST, scan design and sequential test methodologies
626
Thermal Characterization of Both Bare Die and Overmolded 2.5-D Packages on Through Silicon Interposers
627
Thermal characterization of cavity-down TBGA package with Flotherm simulation
628
Thermal characterization of chip packages-evolutionary development of compact models
629
Thermal characterization of chip packages-evolutionary development of compact models
630
Thermal characterization of cloud workloads on a power-efficient server-on-chip
631
Thermal characterization of compact electronic systems: a portable PC as a study case
632
Thermal Characterization of Compact Inductors and Capacitors for 3D MMICs
633
Thermal characterization of crystal ovens used in phase noise measurement system
634
Thermal characterization of DBC and MMC stacks for power modules
635
Thermal characterization of diamond-pressure-bond heat sinking for optically pumped mid-infrared lasers
636
Thermal characterization of distribution cable banks to dynamically rate circuit ampacities
637
Thermal Characterization of Electrically Injected Thin-Film InGaAsP Microdisk Lasers on Si
638
Thermal characterization of electronic components using a new high-resolution simulation tool
639
Thermal characterization of electronic devices with boundary condition independent compact models
640
Thermal Characterization of Electronic Packages Using the Nyquist Plot of the Thermal Impedance
641
Thermal characterization of electronic parts with compact models: interpretation, application, and the need for a paradigm shift
642
Thermal characterization of etched FBG for applications in oil and gas sector
643
Thermal characterization of eutectic alloy thermal interface materials with void-like inclusions
644
Thermal characterization of fan-heat sink systems in miniature axial fan and micro blower airflow
645
Thermal characterization of Fan-in Package-on-Packages
646
Thermal characterization of flat silicon heat pipes
647
Thermal characterization of fluorescent fixtures
648
Thermal characterization of GaAs MESFETs by means of pulsed measurements
649
Thermal characterization of GaN-on-diamond substrates for HEMT applications
650
Thermal characterization of high performance MCP with silicon spacer having low thermal impedance
651
Thermal characterization of high power AlGaN/GaN HEMTs using infra red microscopy and thermoreflectance
652
Thermal characterization of high power LED array in aluminum base copper clad laminate package
653
Thermal characterization of high power transistor arrays
654
Thermal characterization of high speed DDR devices in system environments [DRAM modules]
655
Thermal characterization of high thermal conductive graphites reinforced aluminum matrix composites
656
Thermal characterization of high voltage GaN-on-Si Schottky Barrier Diodes (SBD) for designing an on-chip thermal shutdown circuit for a power HEMT
657
Thermal characterization of high-density interconnects: A methodolgy tested on a model coupon
658
Thermal characterization of highly conductive die attach materials
659
Thermal characterization of hybrid photovoltaic module for the conversion of sunlight into microwave in Solar Power Satellite
660
Thermal characterization of hyperproduced glucose oxidase from Aspergillus niger BCG-5 mutant strain
661
Thermal characterization of Insulated Metal Substrates with a power test chip
662
Thermal characterization of IV-VI superlattice MBE films
663
Thermal Characterization of Junction in Solar Cell Packages
664
Thermal characterization of light-emitting sources of Cree types
665
Thermal characterization of Li-ion cells using calorimetric techniques
666
Thermal Characterization of Liquid Core Optical Ring Resonators
667
Thermal characterization of long electrical devices-application to a tubular linear induction motor
668
Thermal characterization of memory effects in MNOS capacitors
669
Thermal characterization of MESFETs using I-V pulsed and DC measurements
670
Thermal Characterization of Microheated Microchannels With Spatially Resolved Two-Color Fluorescence Thermometry
671
Thermal Characterization of Microliter Amounts of Liquids by a Micromachined Calorimetric Transducer
672
Thermal Characterization of Microwave Power FETs Using Nematic Liquid Crystals
673
Thermal characterization of MMIC by numerical analysis
674
Thermal Characterization of Multi Stack Packages Using Linear Superposition Method
675
Thermal characterization of multichip structures
676
Thermal characterization of multi-die BGA packages
677
Thermal characterization of multi-die packages
678
Thermal characterization of multilayer printed wiring boards during lamination
679
Thermal characterization of nanostructured superlattices of TiN/TaN: Applications as electrodes in Phase Change Memory
680
Thermal characterization of nonlinear charge trapping effects in GaN-FETs
681
Thermal characterization of organic light emitting devices
682
Thermal characterization of package-on-package (POP)
683
Thermal Characterization of Package-on-Package (PoP) Configuration through Modeling
684
Thermal characterization of percolating thermal underfills: Bulk and cavity
685
Thermal characterization of planar interconnect architectures under different rapid transient currents using the transmission line matrix and finite element methods
686
Thermal characterization of plastic and ceramic surface-mount components
687
Thermal characterization of plastic and ceramic surface-mount packages
688
Thermal characterization of plastic ball grid array packages via infrared thermography
689
Thermal characterization of point of used power supply
690
Thermal Characterization of Porous Silicon Micro-Hotplates using IR Thermography
691
Thermal characterization of power amplifiers for CDMA cellular phone applications
692
Thermal characterization of power devices using graphene-based film
693
Thermal characterization of power transistors
694
Thermal characterization of pulsating heat pipes
695
Thermal characterization of Silicon-on-SiC substrates
696
Thermal characterization of single event burnout failure in semiconductor power devices
697
Thermal characterization of SOI CMOS micro hot-plate gas sensors
698
Thermal characterization of solar module due to impact of solar heat flux as an effect of geographical topology
699
Thermal characterization of stacked aluminum nitride multichip modules
700
Thermal characterization of stacked-die packages
701
Thermal characterization of Surface Acoustic Wave devices
702
Thermal characterization of surface mount devices
703
Thermal characterization of surface-micromachined silicon nitride membranes for thermal infrared detectors
704
Thermal characterization of TBGA package for an integration in board level analysis
705
Thermal characterization of the IGBT modules used in hybrid electric vehicles
706
Thermal characterization of the intrinsic noise parameters for AlGaN/GaN HEMTs
707
Thermal Characterization of the Micro Bonding Process Using a Hot Air Stream
708
Thermal characterization of the VBIC dielectrically isolated device
709
Thermal characterization of thermal interface material bondlines
710
Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique
711
Thermal characterization of thermally-shunted heterojunction bipolar transistors
712
Thermal characterization of thin film Cu interconnects for the next generation of microelectronic devices
713
Thermal characterization of thin film heater for lab-on-chip application
714
Thermal characterization of thin film superlattice micro refrigerators
715
Thermal Characterization of THz Schottky Diodes Using Transient Current Measurements
716
Thermal characterization of TSV array as heat removal element in 3D IC stacking
717
Thermal characterization of TSV based 3D stacked ICs
718
Thermal characterization of vertical multichip modules MCM-V
719
Thermal characterization of vertically-oriented carbon nanotubes on silicon
720
Thermal characterization of vias using compact models
721
Thermal characterization through finite element analysis of the switched reluctance motor
722
Thermal Characterization Using Optical Methods of AlGaN/GaN HEMTs on SiC Substrate in RF Operating Conditions
723
Thermal Characterizations of Solid Thermal Interface Materials
724
Thermal Characters Analysis of Induction-Self-Heating-Reflow for Solders Bumping
725
Thermal chemical vapor deposition of epitaxial germanium tin alloys
726
Thermal Chip Evaluation of IC Packaging
727
Thermal Chip Placement in MCMs Using a Novel Hybrid Optimization Algorithm
728
Thermal Circuit for SOI MOSFET Structure Accounting for Nonisothermal Effects
729
Thermal circuit model of MQW VCSEL laser
730
Thermal classification of an epoxy integral insulation
731
Thermal classification of electrical pressure-sensitive adhesive tapes
732
Thermal classification of insulating materials
733
Thermal classification of insulating materials and systems
734
Thermal classification of magnet wire in NEMA MW-1000
735
Thermal classification of wire wound low voltage machines
736
Thermal cleaning and growth temperature effects on deep levels of Be-doped p-InAlAs grown on InP by molecular beam epitaxy
737
Thermal coastline - leadframes for high power at no cost
738
Thermal coefficient measurements of typical distribution transformers operating under imbalance conditions
739
Thermal coefficient measurements of typical distribution transformers operating under imbalance conditions [abstract only]
740
Thermal comfort analysis during power fluctuation compensation by use of air-conditioning system
741
Thermal Comfort and Indoor Air Quality of Task Ambient Air Conditioning in Modern Office Buildings
742
Thermal comfort control based on MEC algorithm for HVAC systems
743
Thermal comfort control based on neural network for HVAC application
744
Thermal comfort in air-conditioned learning environment
745
Thermal comfort inside residential building with varying window locations and size
746
Thermal comfort of naturally ventilated houses in countryside of subtropical region
747
Thermal comfort sensor
748
Thermal comfort sensor based on probabilistic energy neural network
749
Thermal comfort specific conditions in vehicles and real-time calculation of PMW and PPD thermal comfort indices
750
Thermal comfort study in urban low-cost residential building in Shah Alam
751
Thermal compact modeling of parallel plate heat sinks
752
Thermal compact models for electronic systems
753
Thermal compact models: an alternative approach
754
Thermal Comparison of Flip-Chip Relative to Chip-and-Wire Semiconductor Attachment in Hybrid Circuits: An Experimental Approach
755
Thermal comparison of long-wavelength vertical-cavity surface-emitting laser diodes
756
Thermal comparison of plate, extrusion heat sink, and skive heat sink
757
Thermal Comparison of Reflective and Non-Reflective Roofs with Thin-Film Solar Panels
758
Thermal compensation for a chirp fiber Bragg grating bonded substrate
759
Thermal compensation for aluminum nitride Lamb wave resonators operating at high temperature
760
Thermal compensation for frequency-hopped DBR lasers
761
Thermal compensation in GaPO
4
beam resonators: experimental evidence for length extensional mode
762
Thermal Compensation Method for CMOS Digital Integrated Circuits Using Temperature-Adaptive DC–DC Converter
763
Thermal compensation of gravimetric sensors using shear horizontal acoustic plate modes on quartz
764
Thermal compensation of semiconductor strain gauge type pressure transducers using a real-time process
765
Thermal component model for electrothermal analysis of IGBT module systems
766
Thermal component models for electro thermal analysis of multichip power modules
767
Thermal component models for electrothermal network simulation
768
Thermal component models for electro-thermal network simulations
769
Thermal compression bonding for fine pitch solder interconnects
770
Thermal compression bonding of 20 μm pitch micro bumps with pre-applied underfill - Process and reliability
771
Thermal compression bonding with non-conductive adhesive of 30μm pitch Cu pillar micro bumps on organic substrate with bare Cu bondpads
772
Thermal Computation in Railgun by Hybrid Time Domain Technique 3-D-FEM-IEM
773
Thermal computer aided design-advancing the revolution in compact motors
774
Thermal concentrator and electrical cloak bifunctionality: Towards transformation multiphysics
775
Thermal condition assessment for power transformers operated in tropical condition
776
Thermal condition assessment of power transformer
777
Thermal condition monitor system of turbine rotor
778
Thermal condition monitoring of electrical installations based on infrared image analysis
779
Thermal conditions for portable military electronic equipment
780
Thermal conditions of breast cancer progress-treatment
781
Thermal conditions of forming of gas thermal spray coatings
782
Thermal conductance enhancement of particle-filled thermal interface materials using carbon nanotube inclusions
783
Thermal Conductance Measurements of a Micron-Sized Transition-Edge Hot-Electron Micro-Bolometer
784
Thermal Conductance Measurements of Mechanical Supports for Superconducting Magnets
785
Thermal conductance of IC interconnects embedded in dielectrics
786
Thermal conductance of laterally-wetoxidised GaAs/Al/sub x/O/sub y/ bragg reflectors
787
Thermal Conductance of Metallic Interface in Vacuum
788
Thermal conduction and perfusion of ring-slot microwave antenna for treatment liver tumor
789
Thermal conduction in nanoporous copper inverse opal films
790
Thermal conduction in transparent carbon nanotube films
791
Thermal conduction normal to thin silicon nitride films on diamond and GaN
792
Thermal conduction path analysis in 3-D ICs
793
Thermal conduction through diamond - silicon heterostructures
794
Thermal conductivity and boundary resistance measurements of GeSbTe and electrode materials using nanosecond thermoreflectance
795
Thermal conductivity and contact conductance of BSCCO-2212 material
796
Thermal conductivity and dielectric characteristics of transformer oil filled with bn and Fe
3
O
4
nanoparticles
797
Thermal conductivity and dielectric properties of epoxy composites with hyperbranched polymer modified boron nitride nanoplatelets
798
Thermal conductivity and diffusivity in swine myocardium
799
Thermal conductivity and guest vibration in cage-size controlled Ba
8
In
16
Ge
30−x
M
x
(M=Si, Sn)
800
Thermal Conductivity and Interface Thermal Conductance in Films of Tungsten–Tungsten Silicide on Si
801
Thermal Conductivity and Interfacial Thermal Barrier Resistance of the Particle Reinforced Metal Matrix Composites
802
Thermal Conductivity and Magnetic Transitions in Mn/sup 3+//Mn/sup 4+/ Manganites
803
Thermal conductivity and microhardness of MWCNTs/copper nanocomposites
804
Thermal conductivity and morphology of non-covalent functionalized graphene/epoxy nanocomposites
805
Thermal conductivity and RF signal transmission properties of Ag-filled epoxy resin
806
Thermal conductivity and softening of gate oxide breakdown
807
Thermal conductivity and specific heat determinations of a set of lead-free solder alloys
808
Thermal Conductivity and Thermal Dilatation of Commercial BSCCO (DI-BSCCO) Tapes
809
Thermal conductivity and ultrasonic attenuation
810
Thermal conductivity characterization of skutterudite thin films
811
Thermal conductivity control of ZnO thermoelectric ceramics using hot-pressing method
812
Thermal Conductivity Detector for Gas Chromatography: Very Wide Gain Range Acquisition System and Experimental Measurements
813
Thermal Conductivity Detector for gas-chromatography: Acquisition system and experimental measurements
814
Thermal conductivity determination of micromachined membranes
815
Thermal Conductivity Enhancement of Benzocyclobutene With Carbon Nanotubes for Adhesive Bonding in 3-D Integration
816
Thermal Conductivity Enhancement of Epoxies by the use of Fillers
817
Thermal Conductivity Enhancement of Epoxy Composites by Interfacial Covalent Bonding for Underfill and Thermal Interfacial Materials in Cu/Low-K Application
818
Thermal conductivity enhancement of transformer oil using functionalized nanodiamonds
819
Thermal conductivity gas sensor based on LiNbO
3
SAW resonators
820
Thermal conductivity homogeneity and topography characterization
821
Thermal conductivity improvements for electric motors
822
Thermal conductivity in nanostructures: the role of acoustic phonons
823
Thermal conductivity in semiconductor thin films and nanowires
824
Thermal conductivity in Si/Ge and Si/SiGe superlattices
825
Thermal conductivity influence in SMT reflow soldering process
826
Thermal conductivity influence on failures of semiconductor ICs under powerful EMP action
827
Thermal conductivity manipulation in lithographically patterned single crystal silicon phononic crystal structures
828
Thermal conductivity manipulation in single crystal silicon via lithographycally defined phononic crystals
829
Thermal Conductivity Measurement about Fluid and Solid
830
Thermal conductivity measurement and microscopy of thin film structures
831
Thermal conductivity measurements of 2D complex liquids using nonequilibrium molecular dynamics simulations
832
Thermal conductivity measurements of bulk thermoelectric materials
833
Thermal conductivity measurements of nitrogen-doped Ge
2
Sb
2
Te
5
834
Thermal conductivity measurements of novel SOI films using submicron thermography and transient thermoreflectance
835
Thermal conductivity measurements of thin silicon dioxide films in integrated circuits
836
Thermal conductivity measurements of thin-film silicon dioxide
837
Thermal conductivity measurements of ultra-thin single crystal silicon films using improved structure
838
Thermal conductivity measurements with the 3ω method and scanning thermal microscopy
839
Thermal conductivity method of analyzing gases
840
Thermal conductivity microsensor to measure the methane number of natural gas
841
Thermal conductivity model for thin silicon-on-insulator layers at high temperatures
842
Thermal conductivity of 3D complex (dusty) plasmas using homogenous nonequilibrium modelcular dynamics computer experiment
843
Thermal conductivity of amorphous silica using non-equilibrium molecular dynamics simulations
844
Thermal conductivity of Bi/sub 2/Sr/sub 2/CaCu/sub 2/O/sub x/ superconductors in high magnetic fields
845
Thermal conductivity of Bi2Te3 nanowires and nanotubes
846
Thermal conductivity of boron nitride filled epoxy resins: temperature dependence and influence of sample preparation
847
Thermal Conductivity of Bulk
MgB
2
Produced by Infiltration of Different Boron Powders
848
Thermal conductivity of doped polysilicon layers
849
Thermal conductivity of epoxy composites with controlled high loading of ceramic particles
850
Thermal conductivity of epoxy/surface functionalized carbon nano materials
851
Thermal conductivity of filled silicone rubber and its relationship to erosion resistance in the inclined plane test
852
Thermal Conductivity of Frost Formation Theoretical Analysis and Numerical Method
853
Thermal conductivity of fullerene and TiO
2
nanofluids
854
Thermal conductivity of graphene and graphene oxide nanoplatelets
855
Thermal conductivity of heavily doped LPCVD polysilicon
856
Thermal conductivity of heavily-doped ZnSe
857
Thermal conductivity of high voltage stator coil groundwall insulation
858
Thermal conductivity of hollow nanowires
859
Thermal conductivity of indium phosphide based superlattices
860
Thermal Conductivity of Industrial
Wires Fabricated by Various Techniques
861
Thermal Conductivity of InGaAs/InGaAsP Superlattices measured with 3ω Method
862
Thermal conductivity of isotopically enriched silicon carbide
863
Thermal conductivity of isotropic conductive adhesives composed of an epoxy-based binder
864
Thermal conductivity of molding compounds for plastic packaging
865
Thermal conductivity of molding compounds for plastic packaging
866
Thermal conductivity of nano-filled epoxy systems
867
Thermal Conductivity of Nanoparticle Suspensions (Nanofluids)
868
Thermal conductivity of periodically microporous silicon membranes
869
Thermal conductivity of polyacrylonitrile nanofibre web in various nanofibre diameters and surface densities
870
Thermal conductivity of polycrystalline aluminum nitride films: Effects of the microstructure, interfacial thermal resistance and local oxidation
871
Thermal conductivity of polymeric composites: A review
872
Thermal conductivity of reinforced composites for electrical applications
873
Thermal conductivity of RNi
2
B
2
C (R=Gd, Dy, Ho, Er, Tm and Lu) systems
874
Thermal Conductivity of Rocks and the Analysis of Its Influence Factors
875
Thermal conductivity of Si/Ge quantum dot superlattices
876
Thermal conductivity of Si/Ge superlattices
877
Thermal conductivity of single layer graphene supported on silicon nitride/silicon substrates
878
Thermal Conductivity of Single-wall Carbon Nanotubes Filled with Argon
879
Thermal conductivity of SOI device layers
880
Thermal conductivity of solid solutions (Bi
y
Sb
1-y
)
2
Te
3
for y=0.7-0.8 grown by method of zone melting
881
Thermal conductivity of substitute lumbers molded from fiber wastes
882
Thermal conductivity of thermoelectric thick films deposited by an electrodeposition process
883
Thermal conductivity of thin films-experimental methods and theoretical interpretation
884
Thermal Conductivity of Thin Silicon Dioxide Films in Integrated Circuits
885
Thermal conductivity of water-filled single-wall carbon nanotubes
886
Thermal Conductivity of YBCO Coated Conductors Reinforced by Metal Tape
887
Thermal conductivity reduction by nanophononic metamaterials
888
Thermal conductivity reduction in an individual single crystalline Bi nanowire by size effect
889
Thermal conductivity reduction in GaAs-AlAs distributed Bragg reflectors
890
Thermal conductivity reduction in Si free-standing membranes investigated using Raman thermometry
891
Thermal conductivity reduction mechanisms in superlattices
892
Thermal conductivity studies of a GaN-sapphire structure by combined scanning thermal microscopy and electron backscatter diffraction
893
Thermal Conductivity Test of Backfilled Material in Dual-Cycle Geothermal Power Generation System
894
Thermal Conductivity Test of YBCO Coated Conductor Tape Stacks Interleaved With Insulated Stainless Steel Tapes
895
Thermal conductivity testing system of loose coal
896
Thermal conductivity versus Yb
3+
concentration in Yb:CALGO: A material for high power ultrafast laser
897
Thermal conductivity, anisotropy, and interface resistances of diamond on poly-AlN
898
Thermal conductivity, thermal diffusivity and thermoelectric power of Sm-based bulk superconductors
899
Thermal conductivity/diffusivity of Nd
3+
doped GdVO
4
, YVO
4
, LuVO
4
and Y
3
Al
5
O
12
measured by temperature wave method
900
Thermal Consideration in Transverse Geometries for High Power Copper Vapour Laser Pumped Ti: Sapphire Lasers
901
Thermal consideration of generators in high-speed aircraft
902
Thermal considerations about modern energy saving power-MOSFET: Is the reduced thickness of the silicon a drawback for short high power load conditions?
903
Thermal considerations for advanced SOI substrates designed for III-V/Si heterointegration
904
Thermal considerations for distributed power converter systems
905
Thermal considerations for hydroformed reflectors
906
Thermal Considerations for LED Components in an Automotive Lamp
907
Thermal considerations for monolithic integration of three-dimensional integrated circuits
908
Thermal considerations for outdoor bus conductor design
909
Thermal considerations for outdoor bus conductor design ampacity tables
910
Thermal Considerations for Plastic Encapsulation or Coating in Electronic Product Design
911
Thermal Considerations for Plastic Encapsulation or Coating in Electronic Product Design
912
Thermal considerations for systems with high speed memories
913
Thermal considerations in cooling large scale high compute density data centers
914
Thermal considerations in high average power microwave pin diode switches
915
Thermal considerations in high power microwave amplifiers design
916
Thermal considerations in specifying dry type transformers
917
Thermal considerations in specifying dry-type transformers
918
Thermal considerations in splicing of distribution class cables
919
Thermal considerations in the performance and design of high voltage power line insulators
920
Thermal Considerations In The Performance Of Distribution Class Joints
921
Thermal considerations of generators in high-speed aircraft
922
Thermal Considerations of Hydromechanical Constant Speed Drive Design for Supersonic Transport Application
923
Thermal considerations of space solar power concepts with 3.5 GW RF output
924
Thermal considerations of SWIFT XRT radiator at 35°C or colder in low Earth orbit
925
Thermal considerations on highly integrated module for small power drives
926
Thermal constrained resource management for mixed ILP-TLP workloads in dark silicon chips
927
Thermal constrained workload distribution for maximizing throughput on multi-core processors
928
Thermal constraints for BBL placement
929
Thermal constraints for heterostructure barrier varactors
930
Thermal consumptions: Control and monitoring
931
Thermal contact conductance between the bundle and the conduit in cable-in-conduit conductors
932
Thermal contact conductance of typical interfaces in electronic packages under low contact pressures
933
Thermal Contact Elastic-Plastic Finite Element Analysis of Hole-Structure
934
Thermal contact quality evaluation and real-time error correction during surface temperature measurements
935
Thermal contact resistance of cured gel polymeric thermal interface material
936
Thermal contact resistance of cured gel polymeric thermal interface material
937
Thermal contact resistance: effect of elastic deformation [microelectronics packaging]
938
Thermal Contact Simulation of Drill Bit and Bone during Drilling
939
Thermal contacts between multi-layer graphene and metals: Effect of laser annealing
940
Thermal contour map of the moon´s sea of tranquillity shows wide temperature variation during eclipse
941
Thermal contribution to the side-tuning of the lasing mode in multielectrode DBR lasers: influence on modulation bandwidth and laser linewidth
942
Thermal contribution to wavelength switching characteristics of widely tunable lasers
943
Thermal Control for Crossbar-Based Input-Queued Switches
944
Thermal Control for High Density Packaging
945
Thermal Control for Hypersonic Vehicle Propulsion
946
Thermal control mechanism with in-situ temperature sensor for TSV 3D-ICs
947
Thermal control method based on reactive circulating current for anti-condensation of wind power converter under wind speed variations
948
Thermal control microsystem for protein characterization and sensing
949
Thermal control of a dual mode parametric sapphire transducer
950
Thermal control of a dual mode parametric sapphire transducer
951
Thermal control of CCD focal plane assembly for attitude-varied space camera
952
Thermal control of diffraction wavelength in holographic polymer dispersed liquid crystal by using different grating structure
953
Thermal control of electrical motors for high-power humanoid robots
954
Thermal control of equipment enclosures-design strategies for enhanced reliability
955
Thermal control of railgun armatures
956
Thermal control system based on thin film heaters and amorphous silicon diodes
957
Thermal control system design and simulation of AMS-02 main radiator avionics
958
Thermal control wall for telecommunication equipment rooms
959
Thermal control with image processing and fuzzy controllers
960
Thermal Controllability of High Temperature (>1400°C) Rapid Thermal Oxidation for SiC MOSFET
961
Thermal convection loop control by continuous backstepping and singular perturbations
962
Thermal convention and spherical aberration distortion of laser beams in low-loss liquids
963
Thermal converter time constant and response time
964
Thermal converter with quartz crystal temperature sensor for ac-dc transfer
965
Thermal Converters for Audio-Frequency Voltage Measurements of High Accuracy
966
Thermal cooling system
967
Thermal Co-ordination of Motors, Control, and Their Branch Circuits on Power Supplies of 600 Volts and Less
968
Thermal co-ordination of motors, control, and their branch circuits on power supplies of 600 volts and less
969
Thermal co-ordination of motors, control, and their branch circuits on rower supplies of 600 volts and less
970
Thermal correlation between measurements and FEM simulations in 3D ICs
971
Thermal co-simulation of coaxial RF window and connector of a TWT
972
Thermal co-simulation of depressed collector of a TWT using CST studio
973
Thermal coupling aware task migration using neighboring core search for many-core systems
974
Thermal coupling effects and thermal resistance matrix research of multi-heat sources MCM
975
Thermal coupling in 2-finger heterojunction bipolar transistors
976
Thermal coupling in ICs: Applications to the test and characterization of analogue and RF circuits
977
Thermal coupling in integrated circuits: application to thermal testing
978
Thermal Coupling in Multi-finger Heterojunction Bipolar Devices
979
Thermal Coupling in Vertical-Cavity Surface-Emitting Laser Arrays
980
Thermal Coupling Phenomena in IC´s: Models for Analysis and Synthesis for Circuits based on Thermal Coupling
981
Thermal crisis: challenges and potential solutions
982
Thermal crosstalk in 4 x 4 vertical-cavity surface-emitting laser arrays
983
Thermal crosstalk in a group of pyroelectric sensitive elements for thermal imaging
984
Thermal crosstalk in integrated laser-Modulators
985
Thermal crosstalk in two-dimensional arrays of vertical-cavity surface-emitting diode lasers
986
Thermal crosstalk limits for silicon photonic DWDM interconnects
987
Thermal crosstalk of integrated multiwavelength transmitters
988
Thermal crosstalk of laser arrays and the influence on yield
989
Thermal curing of crystallographic defects on a slim-cut silicon foil
990
Thermal current converters for accurate AC current measurement
991
Thermal currents in polyblends of PMMA and PVC
992
Thermal CVD of homoepitaxial diamond using CF
4
and F
2
993
Thermal cycle annealing and its application to arsenic-ion implanted HgCdTe
994
Thermal Cycle Degradation of Charge Carrier Lifetime and Resistivity in Silicon
995
Thermal cycle fatigue life prediction for flip chip solder joints
996
Thermal cycle performance of Ag-bearing thick film conductors for automotive applications
997
Thermal cycle power conversion for the ARIES-I tokamak reactor
998
Thermal cycle reliability and failure mechanisms of CCGA and PBGA assemblies with and without corner staking
999
Thermal Cycle Reliability and Failure Mechanisms of CCGA and PBGA Assemblies With and Without Corner Staking
1000
Thermal Cycle Reliability of 3D Chip Stacked Package Using Pb-free Solder Bumps: Parameter Study by FEM Analysis
