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1
Fading prediction model for non-GEO satellites at land mobile satellite channels
2
Fading prediction on microwave links for airborne communications
3
Fading rates in coherent OTDR
4
Fading Reduction by Aperture Averaging and Spatial Diversity in Optical Wireless Systems
5
Fading reduction in Los microwave links due to path inclination
6
Fading relay channels: performance limits and space-time signal design
7
Fading resistance of orthogonal space-time block codes under correlation
8
Fading Resistant Multiuser Detection for Cdma Communications
9
Fading resistant multiuser detection over CDMA fading channels
10
Fading Results From Narrowband Measurements Of The Indoor Radio Channel
11
Fading simulations in channel modeling based on fast solutions of Maxwell equations
12
Fading spectrophotometric method for the determination of Benzbromarone with Cresol Red
13
Fading Statistics for the Joint Fading and Two Path Shadowing Channel
14
Fading statistics of bistatically scattered GPS signals detected from ocean and land in low earth orbit
15
Fading statistics of transhorizon microwave signals over a troposcatter path in northern India
16
Fading statistics on a 23 km link at 9.6 and 28.6 GHz
17
Fading statistics on an over-the-sea transhorizon link
18
Fading Studies of Natural Salt for Dosimetry Applications
19
Fading Techniques for Error Concealment in Block-Based Video Decoding Systems
20
Fading Two-Way Relay Channels: Physical-Layer Versus Digital Network Coding
21
Fading wiretap channel with no CSI anywhere
22
Fading-free fiber-optic transport of 60 GHz-optical DSB signal by using in-line phase conjugator
23
Fading-free transport of 60 GHz-optical DSB signal in non-dispersion shifted fiber using chirped fiber grating
24
Fading-noise suppressed cm-level resolution reflectometry over 10-km range with phase noise and chromatic dispersion compensation
25
Fading-noise suppressed OFDR using optical frequency comb source and tunable delay line
26
Fading-Resilient Super-Orthogonal Space-Time Signal Sets: Can Good Constellations Survive in Fading?
27
Fading-resistant and MUI-free codes for CDMA systems
28
Fading-resistant modulation using several transmitter antennas
29
Fading-resistant transmission from several antennas
30
Fading-resistant transmission using built-in time diversity and several antennas
31
FaDiS, a fast switch and combiner for high-power millimetre wave beams
32
FADIS: an integrated development environment for automatic design and implementation of FLC
33
FADIS: Project for Fast Directional Switching of Discrete High Power Millimeter Wave Beams
34
FADO - A CAD Tool for Analog Modules
35
Fads and Fallacies about Logic
36
Fads and fallacies in asset liability management for life insurance
37
Fads and fallacies in the name of small-sample microarray classification - A highlight of misunderstanding and erroneous usage in the applications of genomic signal processing
38
FADS: Flocking anomalies in data streams
39
FADyAD- Fault and congestion aware routing algorithm based on DyAD algorithm
40
FAemb: A function approximation-based embedding method for image retrieval
41
FAES: a CASE tool for information acquisition
42
FAFC: fast adaptive fuzzy AQM controller for TCP/IP networks
43
FAFNER2: A comparison between the Grid and the MPI versions of the code
44
FAFNER-accelerating nesting problems with FPGAs
45
FAFS: a new MAC protocol for wireless ATM
46
Fagot lasers
47
FAHP based evaluation of IT Outsourcing risk
48
FAHP evaluation of parts design scheme in supplier involved product development
49
FAHP Evaluation on the development of tourism eco-compensation
50
FAHP Model Application in Evaluating the Factors Influencing the Innovative Performance of Talents
51
FAHP-based evaluation of the group-buying website
52
FAHP-Basic Comprehensive Economic Assessment of Wind Power Project
53
FAHP-BOCR Based Framework for Single Item Multi-attribute Procurement in B2B Electronic Reverse Auctions
54
FAHP-TOPSIS risks ranking models in ISMS
55
FAHR: Focused A* Heuristic Recomputation
56
fAHRW
+
: Fairness-aware and locality-enhanced scheduling for multi-server systems
57
FAI and Production Researches on Bejie´s 12th 5-Year Plan of China
58
Fail Bit Analysis System For Semiconductor Memory Wafers
59
Fail fast [software debugging]
60
Fail output algorithm of vision sensing
61
Fail pattern identification for memory built-in self-repair
62
Fail Safe Operation of Audio Frequency Track Circuits for Railway Signalling
63
Fail safing human factors
64
FAIL*: An Open and Versatile Fault-Injection Framework for the Assessment of Software-Implemented Hardware Fault Tolerance
65
Fail
∗
: Towards a versatile fault-injection experiment framework
66
Fail-aware datagram service
67
Fail-aware failure detectors
68
Fail-Aware Publish/Subscribe
69
Fail-Aware Untrusted Storage
70
Fail-awareness: an approach to construct fail-safe applications
71
FailDetect: Gossip-Based Failure Estimator for Large-Scale Dynamic Networks
72
Failed Back Surgery Syndrome (FBSS) Prediction using Fuzzy Inference System (FIS)
73
Failed Fuel Location in CANDU-PHW Reactors Using a Feeder Scanning Technique
74
Failed motors - rewind or replace?
75
Failed motors: rewind or replace?
76
Failed node replacement policies for maximising sensor network lifetime
77
Failed ONU detection technique applicable to commercially available passive optical networks
78
Failed Societies of Computing: Committee Z and the Professionalization of Programming
79
Failed transformers: replace or repair?
80
Failing Frequency Signature Analysis
81
Failing returns force change
82
Failing to Communicate in an Educational Environment
83
Failing vector identification based on overlapping intervals of test vectors in a scan-BIST environment
84
Fail-in-Place Network Design: Interaction Between Topology, Routing Algorithm and Failures
85
FAIL-MPI: How Fault-Tolerant Is Fault-Tolerant MPI?
86
Fail-operational in safety-related automotive multi-core systems
87
Failover and load sharing in SIP -based IP telephony
88
Failover mechanisms for distributed SDN controllers
89
Failover Pattern with a Self-Healing Mechanism for High Availability Cloud Solutions
90
Failproof team projects in software engineering courses
91
Failsafe AC Hi-Lo Limit Detector
92
Fail-safe and fail-operational systems safeguarded with coded processing
93
Failsafe aspects of a decision unit inspired by cognitive sciences - the Id without Ego and Super-Ego
94
Fail-Safe Asynchronous Machines with Multiple-Input Changes
95
Fail-Safe Asynchronous Sequential Machines
96
Fail-Safe Circuits for Nuclear Protective Systems
97
Fail-safe components for rehabilitation robots - a reflex mechanism and fail-safe force sensor
98
Fail-safe control method for programmable electronic systems in railway applications
99
Fail-Safe Control Strategy of Traction Motor in Electric Mobility with Sensorless Control Scheme
100
Fail-Safe Data Management in Self-Healing Automotive Systems
101
Fail-safe design of a modern traction convertor compatible with railway track circuits
102
Failsafe design of closed loop systems
103
Failsafe Design of DDC Control System for Atmospheric Fluidized Bed Combustor
104
Failsafe Drive Performance of Electric Vehicles with the Structure Driven by the Front and Rear Wheels Independently
105
Failsafe Drive Performance of FRID Electric Vehicles With the Structure Driven by the Front and Rear Wheels Independently
106
Fail-Safe Dynamic Brake for Three-Phase Induction Machines
107
Fail-safe earth-fault-detection device for battery supplies
108
Fail-safe element using thin film parametron
109
Failsafe End-to-End Protocols in Computer Networks with Changing Topology
110
Fail-safe FPGA design features for high-reliability systems
111
Fail-safe gyromoment attitude control systems of communication, navigation, and land-survey satellites
112
Fail-Safe Hierarchical Organization for Wireless Sensor Networks
113
Fail-safe human/robot contact in the safety space
114
Fail-safe I/O to control RESET# pin of DDR3 SDRAM and achieve ultra-low system power
115
Fail-safe interfaces for VLSI: theoretical foundations and implementation
116
Fail-safe ion chamber errant beam detector tailored for personnel protection
117
Fail-Safe Logic Elements for Use with Reactor Safety Systems
118
Failsafe Logic Nets
119
Fail-safe modular control platform for power electronic applications in R&D environments
120
Fail-safe operation and reliability enhancement of distributed process plant with PLC
121
Fail-safe output modules for electronic control systems
122
Fail-safe over-the-air programming and error recovery in wireless networks
123
Fail-safe protection Circuit for industrial safety applications
124
Failsafe smart LED module with thermal management, string current balancing and commutation for lifetime extension
125
Fail-safe speed sensor for london transport automatic trains
126
Fail-safe synchronization circuit for duplicated systems
127
Fail-safe synchronization of redundant microprocessor control systems
128
Fail-safe system for burner control
129
Failsafe systems gain the flexibility of the PLC approach
130
Fail-Safe Test Generation in Safety Critical Systems
131
Fail-Safe Testing of Safety-Critical Systems
132
Fail-Safe Testing of Web Applications
133
Fail-safe traction control monitoring to ensure the safety of signalling
134
Failsafe wafer-level packaging of a piezoelectric MEMS actuator
135
Failsafe wireless sensor network using cooperative communication
136
FailSafe: A generalized methodology for converter fault detection, identification, and remediation in nanogrids
137
Fail-safeness in a multiprocessor system. a distributed strategy based on backward error recovery
138
Fail-safety in core-based system design
139
Fail-soft Circuit Design In A Cache Memory Control LSI
140
Fail-softness evaluation in multiple-bus local computer networks
141
Fail-Stop Distributed Combinatorial Auctioning Systems with fair resource allocation
142
Fail-Stop Failure Algorithm-Based Fault Tolerance for Cholesky Decomposition
143
Fail-stutter fault tolerance
144
Fail-to-safe and Fail-to-danger Analysis of Logic Protective Networks
145
Failure accommodating aircraft control
146
Failure adapted techniques to improve service dependability in systems using fault-tolerant converters
147
Failure analyse of the welding point in flip-chip BGA packages in the drop-free
148
Failure analyses of 3D Sip (system-in-package) and WLP (wafer-level package) by finite element methods
149
Failure Analyses of Communications Systems and Networks by Publicly Available Failure Information from the viewpoint of Dependability
150
Failure analyses of nonceramic insulators. Part 1: Brittle fracture characteristics
151
Failure analyses of nonceramic insulators: part II - the brittle fracture model and failure prevention
152
Failure Analysis
153
Failure analysis & diagnostics of power transformer using dielectric dissipation factor
154
Failure analysis and case study of plastic encapsulated microelectronics
155
Failure analysis and design improvement of the Alcator C-Mod toroidal field coil sliding joint
156
Failure analysis and elimination method of pitting problem on microchip Al bond pads in wafer fabrication
157
Failure analysis and elimination of poly residues contamination in wafer fabrication
158
Failure analysis and estimation of the healthcare system
159
Failure Analysis and Experimental Verification for Through-Silicon-via Underfill Dispensing on 3-D Chip Stack Package
160
Failure Analysis and Failure Mechanisms of High Voltage (530V) Gated Diode Crosspoint Arrays
161
Failure Analysis and Improved Method of Batch Cracks for Certain Fighter Aircraft
162
Failure analysis and modeling of a VAXcluster system
163
Failure analysis and optimization for synchronous rectifier Lateral DMOS transistor in DC-DC buck converter
164
Failure Analysis and Optimization of Metal Fuses for Post Package Trimming
165
Failure analysis and precaution of plastic encapsulated microcircuits
166
Failure Analysis and Radiation-Enabled Circuit Simulation of a Dual Charge Pump Circuit
167
Failure Analysis and Redesign of Coach Seat Recliner Based on FEM
168
Failure Analysis and Reliability of Thermal Printing Devices
169
Failure analysis and replacement strategies of distribution transformers using proportional hazard modeling
170
Failure analysis and stress simulation in small multichip BGAs
171
Failure analysis and stress simulation in small multichip BGAs
172
Failure analysis and test for high speed packaging, HDMI packaging and QSFP packaging
173
Failure Analysis and Test Solutions for Low-Power SRAMs
174
Failure analysis and virtual qualification of PBGA under multiple environmental loadings
175
Failure Analysis Applications of Auger Electron Spectroscopy
176
Failure Analysis Applications of the Scanning Electron Microscope
177
Failure analysis approach For TrenchMOS devices
178
Failure Analysis Approach in Memory Failure of SOI Devices
179
Failure analysis based on dummy TIVA spot
180
Failure analysis case studies on open defect
181
Failure analysis case studies using the IR-OBIRCH (infrared optical beam induced resistance change) method
182
Failure analysis challenges
183
Failure analysis challenges and solution for thin package
184
Failure analysis considerations in designing for EOS/ESD robustness
185
Failure analysis enhancement by evaluating the Thermal Laser Stimulation impact on analog ICs
186
Failure analysis for bumped-die device cratering via finite element modeling
187
Failure analysis for Copper Wire Bonding process from machine perspective
188
Failure analysis for cryogenic system operation at NSRRC
189
Failure analysis for electromagnetic relay contacts adhesion by using XES
190
Failure analysis for electronic devices on flexible substrate
191
Failure analysis for full-scan circuits
192
Failure analysis for IC plastic and substrate/lead-frame package
193
Failure Analysis for Materials Based on Failure Analysis Cases
194
Failure analysis for metal bridge defect in logic area of mixed-signal IC
195
Failure analysis for poor solderability of Au surface of PCB
196
Failure analysis for probe mark induced galvanic corrosion and bond degradation during HAST
197
Failure analysis for the 0.13 μm Cu/low k (Black Diamond™) interconnection by the passive voltage contrast
198
Failure analysis for ultra low power nano-CMOS SRAM under process variations
199
Failure analysis for via with solder bubble
200
Failure analysis from the back side of a die
201
Failure Analysis in a highly parallel processor for Ll Triggering
202
Failure Analysis in Ammunition Storage Life Modeling
203
Failure analysis in capacitors
204
Failure analysis in the integrated fabless manufacturer (IFM) environment
205
Failure Analysis in ZnO Arresters Using Thermal Images
206
Failure analysis matrix of light emitting diodes for general lighting applications
207
Failure analysis mechanisms of miniaturized multilayer ceramic capacitors under normal service conditions
208
Failure analysis methodology for battery powered product incidents
209
Failure analysis methodology for gate oxide breakdown induced by PID
210
Failure analysis methodology for the localization of thin and ultra-thin metal barrier residue
211
Failure analysis of μBGA-new approaches in fault isolation
212
Failure analysis of (DIMM hole) solder void in lead free process used OSP coated PCB
213
Failure analysis of 127mm G105 drill pipe
214
Failure analysis of 200 nm-thick gold interconnects induced by alternating current
215
Failure analysis of 65nm technology node SRAM soft failure
216
Failure analysis of 6T SRAM on low-voltage and high-frequency operation
217
Failure analysis of 7500 HP induction motors driving reciprocating compressors with three years service
218
Failure analysis of 850 nm proton-implanted VCSELs
219
Failure analysis of a 1500 kVA 13.2 kV/480 volt, delta-delta transformer
220
Failure analysis of a 2.5D stacking using μinsert technology
221
Failure analysis of a bipolar integrated circuit
222
Failure Analysis of a Complex Learning Framework Incorporating Multi-modal and Semi-supervised Learning
223
Failure analysis of a composite insulation system under impulse excitation
224
Failure analysis of a fault-tolerant 2-node server system
225
Failure analysis of a high voltage system by probing on the low voltage side
226
Failure analysis of a hybrid device exhibiting copper dendrite growth on thick film resistors
227
Failure analysis of a low yield mixed-signal product due to Deep-Nwell fabrication process marginality
228
Failure Analysis of a MEMS Micro-Injector Printing Head
229
Failure analysis of a network-on-chip for real-time mixed-critical systems
230
Failure analysis of a second level electronic package
231
Failure Analysis of A Unique Poly Defect
232
Failure analysis of a VLSI double metal microprocessor using advanced tools
233
Failure analysis of adhesive joining in electronics
234
Failure analysis of Ag sintered joints after power cycling under harsh temperature conditions from + 30?C up to + 180?C
235
Failure analysis of aged GaAs HEMTs
236
Failure analysis of aircraft Cabin Pressure Control System
237
Failure Analysis of Alternating Current Contactor
238
Failure Analysis of an Anomalous Subthreshold Current in Nano-Scale NAND Flash Memory
239
Failure analysis of an e-commerce protocol using model checking
240
Failure analysis of an injection molded modular tail section on an autonomous underwater vehicle
241
Failure Analysis of Anisotropic Conductive Film Packages With Misalignment Offsets
242
Failure analysis of assembly defect with IR-OBIRCH from backside
243
Failure Analysis of Asymmetric Aging Under NBTI
244
Failure analysis of Au-Ge solder in microwave circuit packaging
245
Failure analysis of BGA package by a TDR approach
246
Failure analysis of bond pad metal peeling using FIB and AFM
247
Failure analysis of bondpads peeling problem in 0.13 μm copper process in wafer fabrication
248
Failure analysis of cable accessories using Finite Element Method Magnetics (FEMM) software
249
Failure analysis of cathode filament formation in multilayer PWBs using combined electron spin resonance and micro-FTIR techniques
250
Failure analysis of ceramic feedthroughs used in traveling-wave tubes
251
Failure analysis of circuit breakers in the Upper Egypt Zone of the Egyptian Unified Power System network
252
Failure analysis of complex 3D stacked-die IC packages using Microwave Induced Plasma afterglow decapsulation
253
Failure analysis of complicated case by functional OBIRCH method
254
Failure Analysis of Components Due to 480-V Ground Faults
255
Failure analysis of composite dielectric of power capacitors in distribution systems
256
Failure analysis of composite dielectric of power capacitors used in distribution systems
257
Failure analysis of connector-terminated optical fibers: two case studies
258
Failure Analysis of Contaminated Gold-Plated Connector Contacts from Operating Communication Equipment
259
Failure Analysis of Crystals and Clock Oscillators
260
Failure analysis of Cu electroplating process with Polyimide substrate fabricated for flexible packaging
261
Failure analysis of CuCr contacts of Vacuum interrupter
262
Failure Analysis of damaged dielectric on resistor and capacitor with EMMI and IR-OBIRCH
263
Failure analysis of decay-like fracture of composite insulator
264
Failure analysis of deployment mechanism of a satellite solar array
265
Failure analysis of design qualification testing: 2007 VS. 2005
266
Failure analysis of die crack in lidless packages
267
Failure analysis of dielectric of low voltage power capacitors due to related harmonic resonance effects
268
Failure analysis of digital-analog mixed integrated circuit at high temperature
269
Failure Analysis of Diode (Thyristor) Dice from Power Semiconductor Modules after Operation above the Maximum Specified Temperature
270
Failure analysis of discolored and nonstick Al bondpad during wafer sorting process
271
Failure analysis of distributed scientific workflows executing in the cloud
272
Failure analysis of dry type power transformer
273
Failure analysis of dry-type power transformer
274
Failure Analysis of ECL Memories by Means of Voltage Contrast Measurements and Advanced Preparation Techniques
275
Failure analysis of EHV transformers
276
Failure analysis of electric circuit board by high resolution magnetic field microscopy
277
Failure Analysis of Electronic Parts
278
Failure Analysis of Electronic Parts
279
Failure analysis of electroplating on sliver termination in multilayer ceramic capacitors (MLCCs)
280
Failure analysis of ENIG surface finish pad
281
Failure analysis of EOS damage case study
282
Failure analysis of ESD damage in a high-voltage driver IC and the effective ESD protection solution [CMOS]
283
Failure Analysis of Evaporated Metal Interconnections at Contact Windows
284
Failure analysis of evaporated metal interconnections at contact windows
285
Failure Analysis of Exhaust Manifold Stud of Mahindra Tractor Using Finite Element Analysis
286
Failure analysis of extra-high voltage (EHV) hot sticks
287
Failure Analysis of Failure Analyses: The Rules of the Rue Morgue, Ten Years Later
288
Failure analysis of FMEA
289
Failure Analysis of Foreign Materials in Electronic Packaging Assembly
290
Failure analysis of full delamination on the stacked die leaded packages
291
Failure Analysis of GaAlAs Emitters
292
Failure analysis of Gate-all-around Nanowire Field Effect Transistor under TLP test
293
Failure analysis of halide of epoxy molding compound used for electronic packing
294
Failure analysis of high power white LEDs
295
Failure analysis of high-density CMOS SRAMs: using realistic defect modeling and I/sub DDQ/ testing
296
Failure analysis of hot-electron effect on power RF N-LDMOS transistors
297
Failure analysis of HV motors in thermal station auxiliary systems
298
Failure Analysis of I/O with ESD Protection Devices in Advanced CMOS Technologies
299
Failure analysis of IGBT in intelligent power module
300
Failure analysis of IGCTs (5SHX 08F4502) in series connection in three level VSI
301
Failure analysis of IMC cracking and voiding induced by molding compound voids in advanced wire bonding packages
302
Failure analysis of in service failed resin cable joints by means of a statistical approach
303
Failure Analysis of In/Au Solder Joints
304
Failure Analysis of Induction Motors: Magnetic Wedges in Compression Stations
305
Failure analysis of InGaAs/GaAs strained-Layer quantum-well lasers using a digital OBIC monitor
306
Failure analysis of integrated circuits beyond the diffraction limit: contact mode near-field scanning optical microscopy with integrated resistance, capacitance, and UV confocal imaging
307
Failure analysis of integrated detector dewar cryocooler assembly
308
Failure analysis of intermittent pin-to-pin short caused by phosphorous particle in molding compound
309
Failure analysis of inverter based anti-islanding systems in photovoltaic islanding events
310
Failure Analysis of Jobs in Compute Clouds: A Google Cluster Case Study
311
Failure analysis of laser diodes using transmission electron microscopy
312
Failure analysis of latent damage in low temperature poly-silicon TFT for OLED applications
313
Failure analysis of lead-free Sn-Ag-Cu solder joints for 316 I/O PBGA package
314
Failure analysis of lead-free solder joints for flip chip on board
315
Failure analysis of LEDs
316
Failure Analysis of Local Electrodes
317
Failure analysis of low voltage power and control circuits
318
Failure analysis of low-ohmic shorts using lock-in thermography
319
Failure analysis of low-voltage power and control circuits [power stations]
320
Failure analysis of Medium Voltage Cable accessories during qualification tests
321
Failure analysis of medium voltage capacitor banks: The Egyptian experience
322
Failure Analysis of Memory Organization for Utilization in a Self-Repair Memory System
323
Failure analysis of micro-hydroelectric sites in the province of Ifugao, Philippines
324
Failure analysis of microstructure under shock load
325
Failure Analysis of MIM and MIS Structures Using Point-to-Event Distance and Angular Probability Distributions
326
Failure analysis of MIM and MIS structures using spatial statistics
327
Failure analysis of module design qualification testing - III: 1997–2005 vs. 2005–2007 vs. 2007–2009
328
Failure Analysis of Multilayer Ceramic Substrates
329
Failure analysis of nanocrystals embedded high-k dielectrics for nonvolatile memories
330
Failure analysis of noise characteristics in GaAs MESFETs with parametric modeling approach
331
Failure Analysis of NSOP Problem Due to Al Fluoride Oxide on Microchip Al Bondpads
332
Failure analysis of NXN pads array using Anisotropic Conductive Films(ACF)
333
Failure analysis of odd/even word-line failure to improve the endurance performance of a NAND Flash
334
Failure analysis of off-state leakage in high-voltage word-line decoder circuit of memory device
335
Failure analysis of open faults by using detecting/un-detecting information on tests
336
Failure Analysis of Open Source J2EE Application Servers
337
Failure analysis of operational amplifier due to ESD stress in complementary bipolar process
338
Failure analysis of output stage due to ESD stress in submicron CMOS technology
339
Failure Analysis of Oxide Defects
340
Failure Analysis of Packaging Related Failures on Advance Devices with Low-K Dielectrics
341
Failure Analysis of Passive Devices
342
Failure Analysis of Pitting Problem on Microchip Al Bondpads in Wafer Fabrication
343
Failure analysis of pixel shorting problems in polymer light emitting diode (PLED) displays
344
Failure analysis of plastic encapsulated microcircuits during burn-in of screening test
345
Failure analysis of plastic packaged optocoupler light emitting diodes
346
Failure analysis of P-N junction degradation by high temperature reverse bias operating condition
347
Failure Analysis Of Polymeric-Insulated Power Cable
348
Failure Analysis of Polymeric-Insulated Power Cable
349
Failure Analysis of Power Distribution Systems in Thailand
350
Failure analysis of power modules: a look at the packaging and reliability of large IGBTs
351
Failure Analysis Of Power Modules; A Look At The Packaging And Reliability Of Large IGBTs
352
Failure Analysis of Power Silicon Devices at Operation above 200°C Junction Temperature
353
Failure analysis of process-induced particle contamination acting as masks that block implantation using C-AFM and chemical etching
354
Failure Analysis of Protective Devices in Power Distribution Systems for Reliability Purpose
355
Failure analysis of relay protection in digital substation based on fault tree
356
Failure analysis of resistive switching devices
357
Failure analysis of semiconductor device using Nano Electro-static field Probe Sensor (NEPS)
358
Failure analysis of shallow trench isolated ESD structures
359
Failure analysis of ship power system based on improved fuzzy analytic hierarchy process
360
Failure analysis of shrink fit tool chuck
361
Failure Analysis of Si Nanowire Field-Effect Transistors Subject to Electrostatic Discharge Stresses
362
Failure analysis of silver-cadmium oxide contacts
363
Failure analysis of single and double bolted joints for composite laminates
364
Failure analysis of Sm
2
Co
17
type permanent magnet for high temperature
365
Failure analysis of Sn-3.5Ag solder joints for FCOB using 2-D FEA model
366
Failure analysis of solder bumped flip chip on low-cost substrates
367
Failure analysis of solder bumped flip chip on low-cost substrates
368
Failure analysis of solder interconnects under the electro-thermal-mechanical coupling tests
369
Failure analysis of sub-50 /spl mu/m lead-free solder bumps on electroless Ni-P UBM for flip chip interconnects
370
Failure Analysis of Sub-Micrometer Devices and Structures Using Scanning Thermal Microscopy
371
Failure analysis of sub-micron VLSI memory devices: techniques and failure mechanisms
372
Failure Analysis of Superjunction VDMOS Under UIS Condition
373
Failure Analysis of Surface Inversion
374
Failure Analysis Of Synathetic Insulators With Fiberglass Rod Submitted To Mechanical Loads
375
Failure Analysis of Synthetic Insulators with Fiberglass Rod Submitted to Mechanical Loads
376
Failure analysis of TaN thin film resistors for microwave circuits
377
Failure analysis of the CdZnTe detector electrode contacts
378
Failure analysis of the contamination on the pins of the SOT packages
379
Failure analysis of the electrostatic parallel-plate micro-actuator
380
Failure analysis of the first wire’s bond
381
Failure analysis of the space Stirling cryocoolers
382
Failure analysis of the winding inductor caused by hot dip coating tin
383
Failure analysis of thermal degradation of TIM during power cycling
384
Failure analysis of thermally and mechanically stressed plastic core solder balls
385
Failure analysis of thick film resistors on stainless steel as sensing elements
386
Failure Analysis of Thin-Film Conductors Stressed with High Current Density by Application of Mattehiessen´s Rule
387
Failure analysis of thin-walled structure with delaminations
388
Failure analysis of three 230kV XLPE cables
389
Failure analysis of three slow speed induction motors for reciprocating load application
390
Failure Analysis of Three Slow-Speed Induction Motors for Reciprocating Load Application
391
Failure analysis of Through-Silicon-Vias Aided by high-speed FIB silicon removal
392
Failure analysis of THz GaAs photoconductive antenna by means of high resolution X-ray topography
393
Failure analysis of timing and IDDq-only failures from the SEMATECH test methods experiment
394
Failure analysis of timing and IDDq-only failures from the SEMATECH test methods experiment
395
Failure analysis of titanium nitride/titanium silicide barrier contacts under high current stress
396
Failure analysis of transmission devices using learning vector quantization
397
Failure analysis of transmission devices using self-organizing map
398
Failure Analysis of Transmission Tower under the Effect of Ice-Covered Power Transmission Line
399
Failure analysis of travelling wave MSM distributed photodetectors
400
Failure analysis of two-bit flipping decoding algorithms
401
Failure analysis of TWT cathodes
402
Failure analysis of ULSI circuits using photon emission
403
Failure analysis of VDMOS in DC/DC converter
404
Failure Analysis of Virtual and Physical Machines: Patterns, Causes and Characteristics
405
Failure Analysis of Wire Bonds
406
Failure analysis of Zn-Mo particle in the molding compound causing gate-source short in non-passivated MOSFET device
407
Failure Analysis on a 65 K MOS RAM with a New Type of Memory Display
408
Failure analysis on bad wetting of ENIG surface finish pads
409
Failure analysis on bolt-type power connector´s application
410
Failure Analysis on Damaged GaAs HEMT MMIC Caused by Microwave Pulse
411
Failure analysis on foreign object damage of aero-engine compressor blade
412
Failure analysis on gate-driven ESD clamp circuit after TLP stresses of different voltage steps in a 16-V CMOS process
413
Failure Analysis on Low Pull Strength of Thermo-sonic Wedge Bond between Gold Wire and Gold Substrate of MEMS Device
414
Failure analysis on multilayer ceramic capacitor (MLCC) with leakage failure caused by silver (Ag) migration in molded plastic package
415
Failure analysis on non-visible front-end defects in deep NWELL implantation related process
416
Failure Analysis on Open Defect with Logic Time Sequence Analysis and Simulation Experiment Method
417
Failure analysis on plasma charging induced damage due to effect of circuit layout & device structure marginality
418
Failure analysis on resistive opens with Scanning SQUID Microscopy
419
Failure Analysis on the BGA Solder Joint
420
Failure Analysis on the Chip Capacitor
421
Failure analysis on the standby current due to dislocation in STI structure of flash memory
422
Failure analysis on ultra-low k film de-lamination by TOF-SIMS composition analysis
423
Failure analysis on wafer edge issue in 0.13μm technology
424
Failure analysis overview and its new challenges
425
Failure analysis requirements for nanoelectronics
426
Failure analysis requirements for nanoelectronics
427
Failure analysis results systematization
428
Failure analysis tailored to demand a business model for high tech service
429
Failure Analysis Techniques
430
Failure Analysis Techniques and Failure Mechanisms Utilizing a Plasma Etcher
431
Failure Analysis Techniques Applied in Resolving Hybrid Microcircuit Reliability Problems
432
Failure analysis techniques for Cu-Ni-Sn solder joint separations on mounted PBGA devices
433
Failure analysis techniques for high power light emitting diodes
434
Failure Analysis Techniques for Microsystems-Enabled Photovoltaics
435
Failure Analysis Through Autopsy of Undersea Acoustic Transducers
436
Failure Analysis using a Scanning Electron Microscope
437
Failure analysis using I
DD
current leakage and photo localization for gate oxide defect of CMOS VLSI
438
Failure analysis using LVP for tolerant design about BEOL parasitic effects in nanoscale technology
439
Failure Analysis using the Electron Microprobe
440
Failure Analysis using the Ion Microprobe
441
Failure Analysis: The British Engine Technical Reports
442
Failure and acceleration models for MCM-Ls tested by HAST
443
Failure and Coverage Factors Based Markoff Models: A New Approach for Improving the Dependability Estimation in Complex Fault Tolerant Systems Exposed to SEUs
444
Failure and degradation modes and rates of PV modules in a hot-dry climate: Results after 16 years of field exposure
445
Failure and fault analysis for software debugging
446
Failure and Overheating of Aluminum-Wired Twist-On Connections
447
Failure and power utilization system models of differential equations by polynomial neural networks
448
Failure and root cause analysis for a system-on-chip: An industrial case study
449
Failure and safety assessment of systems using Petri nets
450
Failure and success factors in reuse programs: a synthesis of industrial experiences
451
Failure and switching mechanisms in semiconductor P-N junction devices
452
Failure and yield analysis of fabrication process of 155 Mbps optical transmitter modules
453
Failure anticipation in oil-paper insulation
454
Failure assessment and HALT test of electrical converters
455
Failure assessment software for circuit card assemblies
456
Failure Avoidance through Fault Prediction Based on Synthetic Transactions
457
Failure Aware Diverse Routing: A Novel Algorithm to Improve Availability in ASON/GMPLS Networks
458
Failure behavior analysis for reliable distributed embedded systems
459
Failure behavior and life prediction of through-hole solder joints under thermal cycling
460
Failure Behavior Identification for a Space Antenna via Neural Networks
461
Failure behaviors of Sn-0.3Ag-0.7Cu solder joint under creep and current stressing
462
Failure bitmap compression method for 3D-IC redundancy analysis
463
Failure Boundary Estimation for lateral collision avoidance manoeuvres
464
Failure by the Processes of Nucleation and Growth
465
Failure case analysis of fast handover in hierarchical mobile IPv6 networks
466
Failure case study: An instructive method for teaching computer network engineering
467
Failure cases in IT project Management
468
Failure cause analysis of pressure vessel protective fittings with load-sharing effect between valves
469
Failure causes and countermeasures analysis for a large-scale reciprocating compressor vibration
470
Failure characteristics of discrete power semiconductor packages exceeding electrical specifications
471
Failure characteristics of motor system using distributed inverters for PMSM
472
Failure characteristics of suspension-type porcelain insulators on a 154 kV transmission line
473
Failure Characteristics of Thin Film Capacitors
474
Failure characterization of BGA solder joint fracture during field application
475
Failure classification and analysis of the Java Virtual Machine
476
Failure classification with respect to detection
477
Failure coefficients and a characterization function for them
478
Failure compensation based on rectangular cut and linear programming for 2-D solid-state active phased arrays
479
Failure components detection in discrete event systems modeled by Petri net
480
Failure Concepts in Reliability Theory
481
Failure contagion and QoS elasticity in bandwidth markets
482
Failure contributors of MV electrical equipment and condition assessment program development
483
Failure contributors of my electrical equipment and condition assessment program development
484
Failure Control in Multipath Route Tracing
485
Failure correction in time-modulated linear arrays
486
Failure correlation in software reliability models
487
Failure correlation in software reliability models
488
Failure coverage in optimal virtual networks
489
Failure coverage of functional test methods: a comparative experimental evaluation
490
Failure Criterion Setting for the Wafer Level Isothermal Electromigration Test
491
Failure data analysis by models involving 3 Weibull distributions
492
Failure data analysis of a LAN of Windows NT based computers
493
Failure data analysis of a large-scale heterogeneous server environment
494
Failure data analytics to build failure prediction mechanisms
495
Failure decision-making based on contracted support vector machine for indiscernible system
496
Failure Defects Observed in Post-Breakdown High-κ/Metal Gate Stack Mosfet
497
Failure demand analysis technique for optimizing design reliability
498
Failure dependency analysis of series system with example of conveyor belt
499
Failure dependency-based protection scheme for multi-segment fiber-wireless (FiWi) access network
500
Failure dependent bandwidth in shuffle-exchange networks
501
Failure dependent performance analysis of a fault-tolerant multistage interconnection network
502
Failure Dependent Reliability Analysis for Component Based Software Systems
503
Failure detecting technique of laser-induced diode links
504
Failure detection algorithms for a reliable execution of parallel programs
505
Failure detection and accommodation in structural dynamics systems using analytic redundancy
506
Failure Detection and Adaptive Compensation for Fault Tolerable Flight Control Systems
507
Failure detection and adaptive compensation for fault tolerant flight control systems
508
Failure detection and classification of circular sheets through the methods of perceptron neural network, Lvq and neurofuzzy using matlab and fuzzytech software
509
Failure Detection and Correction for Appearance Based Facial Tracking
510
Failure detection and correction for clock ensemble in space
511
Failure detection and correction in switch reconfigurable antenna arrays
512
Failure detection and diagnosis of rotating machinery by orthogonal expansion of density function of vibration signal
513
Failure detection and diagnosis system of BLDCM with dynamic load
514
Failure detection and identification
515
Failure detection and identification and fault tolerant control using the IMM-KF with applications to the Eagle-Eye UAV
516
Failure Detection And Isolation Experiments With The Langley Mini-Mast
517
Failure detection and isolation in a nuclear power plant under steady-state conditions
518
Failure detection and isolation in ceramic tile edges based on contour descriptor analysis
519
Failure detection and isolation in integrator networks
520
Failure Detection and Isolation Methodology
521
Failure detection and isolation of ultrasonic ranging sensors for robotic applications
522
Failure Detection and Isolation using System Structure Knowledge and Eigenvalue Sensitivity
523
Failure detection and isolation: a new paradigm
524
Failure detection and localization in linear continuous dynamical systems
525
Failure Detection and Localization in OTN Based on Optical Power Analysis
526
Failure Detection and Location in Process Control - Integrating a New Model based Technique with Other Methods
527
Failure detection and membership management in grid environments
528
Failure Detection and Notification in GMPLS Control Plane
529
Failure Detection and Recovery in the Batch Process Automation Domain Using Automation Agents
530
Failure detection and validation of multifunctional self-validating sensor using WRVM predictor
531
Failure detection approach applying to GPS autonomous integrity monitoring
532
Failure Detection for Communication Networks Using Finite-State Models and Viterbi Decoding
533
Failure detection for control surface of aircraft based on electric actuator
534
Failure detection for LPV systems - a geometric approach
535
Failure Detection for Multiple Input Systems
536
Failure detection for over-discharged Li-ion batteries
537
Failure detection for quasi LPV systems
538
Failure detection for secure optical networks
539
Failure Detection Framework for Stochastic Discrete Event Systems With Guaranteed Error Bounds
540
Failure detection in an autonomous underwater vehicle
541
Failure detection in assembly: Force signature analysis
542
Failure detection in converter fed induction machines under different operation conditions
543
Failure detection in dynamic systems described by nonlinear uncertain models
544
Failure detection in dynamical systems
545
Failure Detection in FlexRay Networks through Asymmetry Assessment
546
Failure detection in large arrays through Bayesian compressive sensing
547
Failure Detection in Large Scale Systems: a Survey
548
Failure Detection in Large-Scale Internet Services by Principal Subspace Mapping
549
Failure Detection in P2P-Grid Environments
550
Failure detection in signal processing and sensing in flight control systems
551
Failure detection mechanism for distributed object computing using CORBA
552
Failure detection methods to predict loss of control involving human-interface devices. I. Theory
553
Failure detection methods to predict loss of control involving human-interface devices. II. Empirical validation
554
Failure Detection of BGA Transition Structures at High Frequencies
555
Failure detection of dual-redundancy BLDC motor based on wavelet transform
556
Failure detection of eccentricity in asynchronous machine
557
Failure Detection of Fire Alarm Sensors Based on Information Fusion
558
Failure detection of mobile nodes in medical asset tracking system
559
Failure detection of stationary lead-acid batteries in service in various regions of Brazil
560
Failure detection of the capacitor bank of the three phase diode rectifier
561
Failure Detection Performance Analysis of the Optimal Nonlinear Filter for the Identification Problem
562
Failure detection using optimal parity vector sensitive to special sensor failure
563
Failure detection via recursive estimation for a class of semi-Markov switching systems
564
Failure detection with HMM waveforms
565
Failure Detection with Uncertain Models
566
Failure Detection Without Excessive Hardware Redundancy
567
Failure Detection, Isolation, and Recovery of Multifunctional Self-Validating Sensor
568
Failure detection/management in launch vehicle avionics
569
Failure Detectors and Extended Paxos for k-Set Agreement
570
Failure detectors as first class objects
571
Failure detectors for large-scale distributed systems
572
Failure Detectors in Homonymous Distributed Systems (with an Application to Consensus)
573
Failure diagnosis & reliability assessment of NiTi shape memory alloy spring for micro - Actuators
574
Failure diagnosis and decision making in industrial processes: A fuzzy set application
575
Failure Diagnosis and Performance Monitoring
576
Failure diagnosis and recovery based on DES framework
577
Failure diagnosis by trajectory parallel measure on attractor
578
Failure diagnosis by using fuzzy logic
579
Failure diagnosis for a large-scale, nonlinear and time-varying plant based on a new identification method of small variations of parameters
580
Failure diagnosis for pneumatic control valves by neural network
581
Failure Diagnosis Method for ISDN Systems
582
Failure diagnosis method for machinery in unsteady operating condition by instantaneous power spectrum and genetic programming
583
Failure diagnosis of a cement kiln using expert systems
584
Failure Diagnosis of a Uniform Linear Array in the Presence of Mutual Coupling
585
Failure diagnosis of asymmetric aging under NBTI
586
Failure diagnosis of brushless DC motor with rotor magnet defect
587
Failure diagnosis of discrete event systems with linear-time temporal logic fault specifications
588
Failure diagnosis of discrete event systems: the case of intermittent faults
589
Failure diagnosis of discrete-event systems with linear-time temporal logic specifications
590
Failure diagnosis of discrete-time stochastic systems subject to temporal logic correctness requirements
591
Failure diagnosis of dynamic systems: an approach based on discrete event systems
592
Failure diagnosis of high speed gear
593
Failure diagnosis of hydraulic lifting system based on multistage telescopic cylinder
594
Failure diagnosis of integrated circuits using ir laser images
595
Failure diagnosis of rotating machine by frequency modulation
596
Failure diagnosis of skew-configured aircraft inertial sensors using wavelet decomposition
597
Failure diagnosis of steam turbine-generator based on improving BP network and particle swarm optimization algorithm
598
Failure Diagnosis of Steam Turbine-Generator Set Based On Genetic Algorithm and BP Network
599
Failure diagnosis of structured VLSI
600
Failure diagnosis system of continuous miner cutting system based on hybrid optimization neural network
601
Failure diagnosis system on pneumatic control valves by neural network
602
Failure diagnosis techniques of grounding grid of substations and the urgent problems existing in the area
603
Failure diagnosis technology discussion of vehicle based on oil detection
604
Failure diagnosis using decision trees
605
Failure diagnosis using discrete event models
606
Failure diagnosis using discrete-event models
607
Failure Diagnosis Using Quadratic Programming
608
Failure diagnosis using the state chi-square test and the ARTMAP neural networks
609
Failure diagnosis: a case study on modeling and analysis by Petri nets
610
Failure diagnostics for railway point machines using expert systems
611
Failure distance based bounds for steady-state availability without the knowledge of minimal cuts
612
Failure distributions and area transformation of thin SiO
2
films
613
Failure distributions for local vs. global and replicate vs. standby redundancies
614
Failure Distributions of Consecutive-k-out-of-n:F Systems
615
Failure distributions of successive dielectric breakdown events
616
Failure dynamics of the IGBT during turn-off for unclamped inductive loading conditions
617
Failure dynamics of the IGBT during turn-off for unclamped inductive loading conditions
618
Failure Engineering And Analysis Toolkit (feat) - An Integrated Reliability Tool
619
Failure environment analysis system-MSFC an enhanced tool for hardware reliability in design
620
Failure evaluation model of oil-paper insulation under AC-DC combined voltages
621
Failure evaluation of disk array organizations
622
Failure evaluation of flexible-rigid PCBs by thermo-mechanical simulation
623
Failure Event Prediction Using Hidden Markov Model Approaches
624
Failure factor based yield enhancement for SRAM designs
625
Failure factors of The Malaysian IT technopreneurship
626
Failure Feedback for User Obligation Systems
627
Failure forecast engine for power plant expert system shell
628
Failure Frequencies for High-Voltage Circuit Breakers, Disconnectors, Earthing Switches, Instrument Transformers, and Gas-Insulated Switchgear
629
Failure gas generation within the oil-paper insulation system of shunt reactor
630
Failure handling and coordinated execution of concurrent workflows
631
Failure handling for transaction hierarchies
632
Failure handling in a reliable multicast protocol for improving buffer utilization and accommodating heterogeneous receivers
633
Failure handling in an optimized two-safe approach to maintaining primary-backup systems
634
Failure handling of E-Business Services in an extensible constraint service model
635
Failure identification and analysis for high voltage induction motors in petrochemical industry
636
Failure identification and analysis for high-voltage induction motors in the petrochemical industry
637
Failure Identification in Smart Grids Based on Petri Net Modeling
638
Failure identification of induction motors by sensing unbalanced stator currents
639
Failure Identification of Induction Motors by Sensing Unbalanced Stator Currents
640
Failure impact on coverage in linear wireless sensor networks
641
Failure Importance Analysis and Adjustment Based on Bayesian Networks
642
Failure importance analysis models based on Bayesian network
643
Failure in CMOS circuits induced by hot carriers in multi-gate transistors
644
Failure in CMOS circuits induced by hot carriers in multi-gate transistors
645
Failure in GTO circuits due to the change in recovery characteristic of snubber diodes
646
Failure inferencing based fast rerouting for handling transient link and node failures
647
Failure Inferencing Based Fast Rerouting for Handling Transient Link and Node Failures
648
Failure Influence: Robustness Measure for Scalable Switch Fabric
649
Failure initiation of IGBT due to emitter contact degradation: A 2D finite elements electro-thermal multi-cell simulation approach under hard switching, short-circuit and avalanche operations
650
Failure insert testing method for automatic transmission based on hardware in the loop system
651
Failure intensity determination for renewal doubling system with parallel redundancy
652
Failure Investigation/Evaluation System and Technical Aides (FIESTA)
653
Failure is looking more like success these days
654
Failure is NOT an option
655
Failure Isolation for a Minimally Redundant Inertial Sensor System
656
Failure isolation for advanced packages using time-domain reflectometry
657
Failure isolation using an associative memory algorithm
658
Failure isolation using FIB assist Photon Emission Microscopy analysis and microprobe analysis
659
Failure libration model of bearing and its fault diagnosis based on EMD
660
Failure localization and mechanism analysis in system-on-chip (SOC) using advanced failure analysis techniques
661
Failure Localization for Shared Risk Link Groups in All-Optical Mesh Networks Using Monitoring Trails
662
Failure localization in IC packages using time domain reflectometry: technique limitations and possible improvements
663
Failure localization in Transparent Optical Networks
664
Failure localization methods for system-on-chip (SoC) using photon emission microscopy
665
Failure Localization of Logic Circuits Using Voltage Contrast Considering State of Transistors
666
Failure localization on a Low-Dropout Voltage Regulator with Reset Automotive Device due to wire bonding issue
667
Failure Location Algorithm for Transparent Optical Networks
668
Failure management for cost-effective and efficient spacecraft Operation
669
Failure management for FT-CORBA applications
670
Failure management for reliable automotive start up process
671
Failure management in spatio-temporal redundant, integrated navigation and flight control reference-systems
672
Failure map functions and accelerated mean time to failure tests: new approaches for improving the reliability estimation in systems exposed to single event upsets
673
Failure map functions and accelerated MTTF tests: now approaches for improving the reliability estimation in systems exposed to seus
674
Failure margin and performance degradation in "F-Cycle ring" networks
675
Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study
676
Failure mechanism analysis of quartz accelerometer under vibration condition
677
Failure mechanism and diagnosis strategy of MMIC
678
Failure mechanism and improvement on gate oxide failure at the edge of LOCOS
679
Failure mechanism and improvement potential of IGBT´s short circuit operation
680
Failure mechanism and microstructural evolution of Pb-free solder alloys in thermal cycling tests: Effect of solder composition and Sn grain morphology
681
Failure mechanism and mitigation of PCB pad cratering
682
Failure Mechanism and Solution Study of IC Wire Bond Heel Crack on Leadframe
683
Failure mechanism based failure rate model
684
Failure mechanism diagnosis on plastic package integrated circuit basing on Fault Tree Analysis
685
Failure Mechanism for Fine Pitch Microbump in Cu/Sn/Cu System During Current Stressing
686
Failure Mechanism for GaN-Based High-Voltage Light-Emitting Diodes
687
Failure mechanism for input buffer under CDM test
688
Failure Mechanism in MOS Gates Resulting from Particulate Contamination
689
Failure Mechanism in Silicon
690
Failure Mechanism in Thick Film Materials for 300
Operation
691
Failure mechanism investigation of stacked via cracking in organic chip carrier
692
Failure mechanism models for brittle fracture
693
Failure mechanism models for cyclic fatigue
694
Failure mechanism models for ductile fracture
695
Failure mechanism models for electromigration
696
Failure mechanism models for material aging due to interdiffusion
697
Failure mechanism models for plastic deformation
698
Failure mechanism observed through static latchup simulation
699
Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture
700
Failure mechanism of anisotropic conductive adhesive interconnections in flip chip ICs on flexible substrates
701
Failure mechanism of avalanche photodiodes in the presence of water vapor
702
Failure mechanism of brittle solder joint fracture in the presence of electroless nickel immersion gold (ENIG) interface
703
Failure mechanism of Cu/SnAg/Ni microbumps in three-dimensional integral circuits under electromigration
704
Failure mechanism of flip-chip circuit interconnects induced by electromigration
705
Failure Mechanism of Fly Die in Eutectic Bonding
706
Failure Mechanism of Gold-Plated Contacts in Mobile Phones Under Dust Contamination Jointing With Micromotion Condition
707
Failure Mechanism of High Energy Surge Resistors
708
Failure mechanism of hole formation in laser welding technique for optoelectronic packaging
709
Failure mechanism of interfacial thermal stress of MCM
710
Failure mechanism of leakage induced by pattern-dependent photo resist distortion
711
Failure Mechanism of Metal-Polysilicon-Doped Silicon Butting Contacts
712
Failure mechanism of power DMOS transistors under UIS stress conditions
713
Failure mechanism of rotating machines in industrial service
714
Failure mechanism of silicon germanium (SiGe) technology on 90nm PMOS
715
Failure mechanism of smaller substrate bond pad size in flip chip technology
716
Failure mechanism of Sn3.0Ag0.5Cu flip-chip solder joints under electric current stress
717
Failure Mechanism of Sn-Ag-Cu Flip-chip Solder Joints with Different Cu Weight Contents Under Comparatively Low Current Stressing
718
Failure mechanism of solder interconnections under thermal cycling conditions
719
Failure mechanism of solidification cracks in semiconductor laser packaging
720
Failure Mechanism of stacked CSP module under board-level drop impact
721
Failure mechanism of subgrade when surface water infiltrating through fault and fissure
722
Failure mechanism of the interturn insulation of low voltage electric machines fed by pulse controlled inverters
723
Failure mechanism of the interturn insulation of low voltage electric machines fed by pulse-controlled inverters
724
Failure mechanism of the transmission shaft of a new power split hybrid vehicle
725
Failure mechanism of three-level power amplifier for active magnetic bearings
726
Failure mechanism of variable frequency drives in ungrounded distribution systems
727
Failure mechanism of VCSELs in optical mouse applications at non-hermitic conditions
728
Failure mechanism of winding insulations in inverter-fed motors
729
Failure Mechanism on Accelerated ac Test for High Voltage Capacitors
730
Failure mechanism study for high resistance contact in CMOS devices
731
Failure mechanism study for high resistance gate contact in dram devices for 2008 IRPS
732
Failure mechanism study of anisotropic conductive film (ACF) packages
733
Failure mechanism study of conventional active methods based on inverter disturbances and a novel islanding detection method
734
Failure Mechanism Study of GaAs MODFET Devices and Integrated Circuits
735
Failure mechanisms and color stability in light-emitting diodes during operation in high-temperature environments in presence of contamination
736
Failure Mechanisms and comparative study of ruggedness in IGBTs Devices (IR, IXYS)
737
Failure mechanisms and design considerations for fault tolerant aerospace drives
738
Failure Mechanisms and Device Reliability
739
Failure mechanisms and fault classes for CMOS-compatible microelectromechanical systems
740
Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)
741
Failure mechanisms and protection methods of spacecraft power system
742
Failure mechanisms and recent improvements in ZnO arrester elements
743
Failure Mechanisms and Reliability of Low-Noise GaAs FETs
744
Failure Mechanisms Associated with Die-to-Header Bonds of Planar Transistors
745
Failure Mechanisms Associated with Lens Shape of High-Power LED Modules in Aging Test
746
Failure Mechanisms Associated With Lens Shape of High-Power LED Modules in Aging Test
747
Failure mechanisms associated with the fabrication of InGaN-based LEDs
748
Failure Mechanisms at Surfaces and Interfaces
749
Failure mechanisms based prognostics
750
Failure mechanisms detected in memory chips during routine construction analysis
751
Failure mechanisms in AlGaAs/GaAs power heterojunction bipolar transistors
752
Failure Mechanisms in Beam Lead Semiconductors
753
Failure mechanisms in chip-metallization in power applications
754
Failure mechanisms in CMOS-based RF switches subjected to RF stress
755
Failure mechanisms in film-based power capacitors
756
Failure Mechanisms in Gold and Aluminum Microwave Power Transistors
757
Failure mechanisms in Gunn diodes
758
Failure mechanisms in high power diode lasers: wide -vs- narrow band gap materials
759
Failure Mechanisms in High Power Four-Layer Diodes
760
Failure Mechanisms in Integrated Circuit Interconnect Systems
761
Failure mechanisms in large-scale integrated circuits
762
Failure mechanisms in mems
763
Failure Mechanisms in MEMS Based Silicon Carbide High Temperature Pressure Sensors
764
Failure mechanisms in MOSFET square-wave drivers for wireless power transfer applications
765
Failure Mechanisms in Packaged Light-Emitting Diodes Under Gamma Radiations: Piezoelectric Model Based on Stark Effect
766
Failure Mechanisms in Passivated P+ -N Junctions Under Temperature and Bias Stress
767
Failure Mechanisms in Pulsed RF Power Transistors
768
Failure Mechanisms in Reverse-Biased Oxide-Passivated Silicon Diodes
769
Failure mechanisms in semiconductor laser packaging
770
Failure mechanisms in semiconductor memory circuits
771
Failure Mechanisms in Semiconductors
772
Failure mechanisms in stationary low current contacts
773
Failure mechanisms in TAB inner lead bonding and the relationship between design and reliability
774
Failure Mechanisms in Traveling-wave Tubes
775
Failure Mechanisms of AIN based RF-MEMS Switches Under DC and ESD Stresses
776
Failure mechanisms of aluminum bondpad peeling during thermosonic bonding
777
Failure Mechanisms of Direct Copper Bonding Substrates (DCB)
778
Failure Mechanisms of Dummy IGBT Assembles Constructed using Liquid In-Sn/Nb System
779
Failure Mechanisms of Electronic Components
780
Failure mechanisms of flash cell in program/erase cycling
781
Failure mechanisms of flip chip DCA assembly using eutectic solder
782
Failure mechanisms of gallium nitride LEDs related with passivation
783
Failure Mechanisms of GaN Metal–Semiconductor–Metal Photodetectors After Stressing
784
Failure mechanisms of GaN-based LEDs related with instabilities in doping profile and deep levels
785
Failure mechanisms of guard-drain in mitigating n-hit single-event transient via 45-nm CMOS process
786
Failure mechanisms of IGBTs under short-circuit and clamped inductive switching stress
787
Failure mechanisms of interconnections in drop impact
788
Failure mechanisms of legacy aircraft wiring and interconnects
789
Failure mechanisms of low-voltage trench power MOSFETs under repetitive avalanche conditions
790
Failure mechanisms of Ni/Sn3.0Ag0.5Cu/OSP flip chip solder under high current stressing
791
Failure mechanisms of polyimide and perfluoroalkoxy films under high frequency pulses
792
Failure mechanisms of pressurized microchannels, model and experiments
793
Failure mechanisms of pressurized microchannels: model and experiments
794
Failure Mechanisms of Shielded Power Cable Related to High Ground Shield Resistance and/or Insulation of Neutral Wires from the Ground Shield
795
Failure mechanisms of shielded power cable related to high ground shield resistance and/or insulation of neutral wires from the ground shield
796
Failure mechanisms of sintered silver interconnections for power electronic applications
797
Failure mechanisms of SOI high-voltage LIGBTs and LDMOSes under unclamped inductive switching
798
Failure mechanisms of spiral-helix antenna under high power conditions
799
Failure mechanisms of thin silicon tantalum integrated circuit (STIC) resistors on multi-chip module (MCM)
800
Failure mechanisms of Trench IGBT under various short-circuit conditions
801
Failure Mechanisms Study of a Standard GaAs IC Technology
802
Failure mitigation for quality of service of wireless networks
803
Failure mitigation in linear, sesquilinear and bijective operations on integer data streams via numerical entanglement
804
Failure mitigation of semi active multi beam antenna array for portable surveillance radar using genetic algorithm
805
Failure Mitigation Techniques for 1T-1MTJ Spin-Transfer Torque MRAM Bit-cells
806
Failure mode analysis and optimization of assembled high temperature pressure sensors
807
Failure Mode Analysis and Protection of Non-Regenerative Three-level Boost Rectifier
808
Failure mode analysis for TAB inner lead bonding
809
Failure mode analysis for the solder joints for the flip-chip light emitting diodes
810
Failure mode analysis of al
2
O
2
-parylene c bilayer encapsulation for implantable devices and application to penetrating neural arrays
811
Failure mode analysis of lead-free solder joints under differential reflow profiles by high speed impact testing
812
Failure mode analysis of NC Turret based on random fuzzy method
813
Failure mode analysis of oil-free pulse capacitors
814
Failure mode analysis of oxide VCSELs in high humidity and high temperature
815
Failure mode analysis of photonic components on InP using low-coherence reflectometry: case of burned DBR lasers
816
Failure mode analysis on capacitor energy banks
817
Failure mode analysis using multilevel flow models
818
Failure mode and effect analysis and fault modelling of wind turbine for FTC approach
819
Failure mode and effect analysis based on electric and electronic architectures of vehicles to support the safety lifecycle ISO/DIS 26262
820
Failure mode and effect analysis of Chitra heart valve prosthesis
821
Failure mode and effects analysis (FMEA) and model-checking of software for embedded systems by sequential scheduling of vectors of logic-labelled finite-state machines
822
Failure Mode and Effects Analysis of a new telemonitoring system
823
Failure mode and effects analysis of a process of reflow lead-free soldering
824
Failure mode and test method of sulfur induced light decay in lead-frame LED package
825
Failure mode assumptions and assumption coverage
826
Failure mode databases and their knowledge-based management
827
Failure Mode Detection and Process Optimization for 65 nm CMOS Technology
828
Failure Mode Distribution of Transformers in Thailand
829
Failure Mode Effect Analysis Applied to the Use of Infusion Pumps
830
Failure mode effects and criticality analysis for system/Safety assessment
831
Failure mode evaluation of LDC for electric bus by HILs
832
Failure mode evolution of WLCSP on board by dynamic bend method
833
Failure mode for AC drives on high resistance grounded systems
834
Failure mode investigation of die pick process with high speed camera and numerical analysis
835
Failure mode investigation of high power multi-mode InGaAs-AlGaAs strained quantum well lasers using time-resolved EL and EBIC techniques
836
Failure mode of different irradiated power IGBT structures
837
Failure mode of high power fixed RF resistor of RuO
2
thick film on AlN substrate
838
Failure mode of SAC305 lead-free solder joint under thermal stress
839
Failure mode prioritization by improved RPN calculation method
840
Failure mode risk analyzing based on grey theory for power plant steam turbine proper
841
Failure mode testing of underground polymer surge arresters
842
Failure mode testing tool set for automotive electronic controllers
843
Failure mode tests for distribution type metal-oxide surge arresters with polymeric housing
844
Failure mode visualization modeling based on the three-dimensional model
845
Failure mode workload theory and planning
846
Failure mode, effects and criticality analysis (FMECA) use in the Federal Aviation Administration (FAA) reusable launch vehicle (RLV) licensing process
847
Failure Mode, Mechanism and Effect Analysis for Single Board Computers
848
Failure Model Determination in a Knowledge-Based Control System
849
Failure Model for Electromigration
850
Failure Model for Silver Electrochemical Migration
851
Failure Model of Fretting Wear Based on Self-Organizing Method
852
Failure modeling and process monitoring for flexible manufacturing systems using colored timed Petri nets
853
Failure modeling for the ATM switching system under the development phase using Weibull distribution
854
Failure modeling in a WDM optical burst switched network
855
Failure modeling of BGA package for reliability evaluation of handheld products under drop event
856
Failure modelling in flexible electronics
857
Failure modelling of satellite systems and use in contingency simulation
858
Failure models for mechanical wear modes and mechanisms
859
Failure models in power device interconnects
860
Failure Modes & Effective Analysis And Continuous Improvement
861
Failure modes & effects analysis (FMEA) of flip chip devices attached to printed wiring boards (PWB)
862
Failure Modes Analysis for the MSU RIA Driver Linac
863
Failure modes and effect analysis of module level power electronics
864
Failure modes and effects analysis (FMEA) system deployment in a semiconductor manufacturing environment
865
Failure modes and effects analysis based on fuzzy TOPSIS
866
Failure modes and effects analysis during design of computer software
867
Failure modes and effects analysis for MV cable systems
868
Failure modes and effects analysis for software reliability
869
Failure modes and effects analysis of dynamic environment test
870
Failure modes and effects criticality analysis and accelerated life testing of LEDs for medical applications
871
Failure modes and energy absorption capability of ZnO varistors
872
Failure modes and failure analysis of white LEDs
873
Failure Modes and Fatigue Testing Characteristics of SMT Solder Joints
874
Failure modes and FEM analysis of Conductive Anodic Filament resistance during high-frequency electromagnetic of PCB
875
Failure modes and field testing of medium voltage motor windings
876
Failure modes and field testing of medium-voltage motor windings
877
Failure modes and hardness assurance for linear integrated circuits in space applications
878
Failure Modes and Hardness Assurance for Linear Integrated Circuits in Space Applications
879
Failure modes and mechanisms for VLSI ICs¿a review
880
Failure Modes and Mechanisms in Solid Tantalum Capacitors
881
Failure Modes And Prognostic Techniques For H-60 Tail Rotor Drive System Bearings
882
Failure modes and reliability of dynamic RAMS
883
Failure modes and robustness of SiC JFET transistors under current limiting operations
884
Failure modes effects test for flight control system
885
Failure modes for stiction in surface-micromachined MEMS
886
Failure modes in CLIC
887
Failure Modes in Feedback Error Learning
888
Failure Modes in GaAs Power FETs: Ohmic Contact Electromigration and Formation of Refractory Oxides
889
Failure Modes in Gold-Aluminum Thermocompression Bonds
890
Failure modes in GZO FC-light-emitting diodes
891
Failure Modes in Integrated and Partially Integrated Microelectronic Circuits
892
Failure Modes in Naval Electronic Equipment
893
Failure modes in overhead lines
894
Failure modes in silicon avalanche transit-time microwave devices
895
Failure modes in surface micromachined microelectromechanical actuators
896
Failure Modes in Textile Interconnect Lines
897
Failure Modes in Thin Film Circuits
898
Failure Modes of Beam-Lead Semiconductors in Thin-Film Hybrid Microcircuits
899
Failure Modes of InGaAsP/InP Lasers Due to Adhesives
900
Failure modes of LV overhead insulated mains
901
Failure modes of outdoor polymeric insulators
902
Failure modes of porcelain and toughened glass suspension insulators
903
Failure modes of Sn3.0Ag0.5Cu flip-chip solder joints under current stress
904
Failure Modes of Solder Interconnections under Mechanical Shock Loading at Elevated Temperatures
905
Failure modes of Wafer Level Thin Film MEMS packages during wafer thinning
906
Failure modes of wound electrical coils in wet environment with voltage stress
907
Failure modes, effects and criticality analysis (FMECA)
908
Failure modes, mechanisms, and effects analysis for LED backlight systems used in LCD TVs
909
Failure monitoring in composite structures using embedded FBG strain sensors
910
Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Sn–3.8Ag–0.7Cu and Eutectic SnPb Solders
911
Failure notifications: a useful extension to the object programming model
912
Failure observations and mechanical modeling
913
Failure of 345 kV pipe type oil filled cable
914
Failure of a big transformer in HPP — Assessment of damage, repair and tests
915
Failure of a MEMS switch after environmental test
916
Failure of a parallel adaptive identifier with adaptive error filtering
917
Failure of aluminum connections in residential applications
918
Failure of Arcing Contacts in Low Voltage Switching Devices --Examples, Root Causes, Counter Measures
919
Failure of chip sized packaging (CSP) under coupling fields of electrical current and thermal cycle
920
Failure of digital IC under the influence of electromagnetic radiation
921
Failure of disk insulators on high-tension transmission lines
922
Failure of Disk Insulators on High-Tension Transmission Lines
923
Failure of disk insulators on high-tension transmission lines
924
Failure of effective-channel length extraction methods due to the effect of the relative doping level of source and drain in short-channel LDD MOSFETs
925
Failure of E-Government Implementation: A Case Study of South Sulawesi
926
Failure of Electromagnetic Voltage Transformer Due to Sustained Over-Voltage on Switch off - Preventive Measures
927
Failure of Electromagnetic Voltage Transformer Due to Sustained Over-Voltage on Switch Off??? Preventive Measures
928
Failure of Electromagnetic Voltage Transformer Due to Sustained Over-Voltage on Switching - an Indepth Field Investigation and Analytical Study
929
Failure of Electromagnetic Voltage Transformer Due to Sustained Over-Voltage on Switching??? An Indepth Field Investigation and Analytical Study
930
Failure of gold and copper ball bonds due to intermetallic oxidation and corrosion
931
Failure of Large-Area Epitaxial-Diffused Silicon Devices
932
Failure of lead-free solder joint under thermal cycling
933
Failure of LV ASD supply-side fuses due to MV motor fuse operation
934
Failure of Matthiessen´s rule in the calculation of carrier mobility and alloy scattering effects in Ga0.47In0.53As
935
Failure of mica capacitors
936
Failure of moments-based transport models in nanoscale devices near equilibrium
937
Failure of multiple-cell power DMOS transistors in avalanche operation
938
Failure of Ohm´s Law: Its Implications on the Design of Nanoelectronic Devices and Circuits
939
Failure of On-Chip Power-Rail ESD Clamp Circuits During System-Level ESD Test
940
Failure of optical fibers with thin hard coatings
941
Failure of Pareto-based MOEAs: does non-dominated really mean near to optimal?
942
Failure of polyester spacer at low voltage equipment
943
Failure of power DMOS transistor arrays under unclamped inductive switching stress conditions
944
Failure of random materials: A large deviation and computational study
945
Failure of Rotary Forging Die and Its Finite Element Simulation
946
Failure of scalar analyses in dielectric optical waveguides with perturbed refractive-index profile
947
Failure of service aged 230 kV current transformers
948
Failure of single electron descriptions of molecular orbital collision processes
949
Failure of Small Thin Film Conductors Due to High Current-Density Pulses
950
Failure of small thin-film conductors due to high current-density pulses
951
Failure of State-Owned Enterprises in Benin
952
Failure of successive refinement for symmetric Gaussian mixtures
953
Failure of surge arresters on low-voltage mains
954
Failure of TCP congestion control under diversity routing
955
Failure of the Classical Circuit Model in the Analysis of Low-Loss Band-Limited Mixers
956
Failure of the Classical Mathematical Model in the Analysis of Low-Loss Band-Limited Mixers
957
Failure of the linear Raman gain approximation in supercontinuum generation
958
Failure of the London Underground´s 22 kV power supply system: An exercise in logic and transport management
959
Failure of the Routh-Hurwitz method of reduction
960
Failure of the scalar approximation near cutoff frequency of a step-index fiber mode
961
Failure of the Scalar Dielectric Function Approach for the Screening Modeling in Double-Gate SOI MOSFETs and in FinFETs
962
Failure of transmission line cap and pin insulators under DC stresses
963
Failure ontology of board-level electronic product for reliability design
964
Failure Performance Study of Hierarchical Agent Based Patient Health Monitoring in Wireless Body Sensor Mesh Network
965
Failure Physics and Accelerated Testing
966
Failure Physics: an Essential Discipline for Reliability Engineering
967
Failure planning in STESCA
968
Failure Precursors for Polymer Resettable Fuses
969
Failure prediction analysis of an ACCC conductor subjected to thermal and mechanical stresses
970
Failure prediction and diagnosis for satellite monitoring systems using Bayesian networks
971
Failure prediction and health prognostics of electronic components: A review
972
Failure Prediction based on multi-parameter analysis in support of autonomic networks
973
Failure Prediction Based on Multi-Scale Frequent Anomalous Behavior Identification in Support of Autonomic Networks
974
Failure prediction by marginal checking
975
Failure prediction by means of advanced usage data analysis
976
Failure prediction by means of cepstral analysis and coherence function between thrust force and torque signals
977
Failure Prediction Employing Continuous Monitoring Techniques
978
Failure Prediction for an On-Line Maintenance System in a Poisson Shock Environment
979
Failure prediction for autonomic management of networked computer systems with availability assurance
980
Failure Prediction for Cloud Datacenter by Hybrid Message Pattern Learning
981
Failure prediction for multivariable and multi-failure-mode complex systems based on performance degradation
982
Failure Prediction for Publish/Subscribe System on MANET
983
Failure Prediction in Computational Grids
984
Failure Prediction in Electronic Systems
985
Failure prediction in fully coupled thermal and deformational fields with peridynamics
986
Failure prediction in IBM BlueGene/L event logs
987
Failure Prediction in IBM BlueGene/L Event Logs
988
Failure Prediction Mechanisms in Cluster Systems
989
Failure prediction method for Network Management System by using Bayesian network and shared database
990
Failure prediction method of gearbox based on BP neural network with genetic optimization algorithm
991
Failure prediction methodology calculations can mislead: use them wisely, not blindly
992
Failure Prediction Models for Proactive Fault Tolerance within Storage Systems
993
Failure prediction of banks using threshold accepting trained kernel principal component neural network
994
Failure Prediction of Data Centers Using Time Series and Fault Tree Analysis
995
Failure prediction of electrolytic capacitor using DSP methods
996
Failure prediction of electrolytic capacitors during operation of a switchmode power supply
997
Failure prediction of electrolytic capacitors in Switching-Mode Power Converters
998
Failure prediction of IGBT modules based on power cycling tests
999
Failure Prediction of Jobs in Compute Clouds: A Google Cluster Case Study
1000
Failure prediction of laser gyro based on neural network method
