<< مقالات لاتين فني مهندسي >>
<< بر اساس عنوان >>
1
W
2
W and Ag induced magnetization profile in multilayer with 3d metals
3
W- and G-Band Solid State Power Combining
4
W band communication link, design and on ground experimentation
5
W band CW solid-state transceiver front-end
6
W band monolithic multipliers
7
W band power amplifier based on 1 µm InP DHBT
8
W band silicon dielectric resonator for semiconductor substrate characterization
9
W band technologies for data collection experiment of the DAVID mission
10
W band whispering gallery dielectric resonator mode oscillator
11
W CMP evaluation for 0.25 μm logic device
12
W CMP for C14nm and Beyond: Barrier selective approach
13
W CMP process integration
14
W CMP process integration
15
W E Sykes in gear and rolling
16
W orkshop on Intelligent Information Technology Application - Copyright
17
W pleasure, W fun [3D graphics]
18
W riter Flux Closure and Transition Degradation Mechanism in Perpendicular Recording
19
W TaaS: An architecture of website analysis in a cloud environment
20
WαSH-ing visual repositories: Searching Europeana using local features
21
W* effect considered harmful [Internet WAP]
22
W*-Grid: A Robust Decentralized Cross-layer Infrastructure for Routing and Multi-Dimensional Data Management in Wireless Ad-Hoc Sensor Networks
23
W. A. Del Mar is honored by friends at testimonial dinner
24
W. B. Bruene Director, 1962-1963
25
W. C. Ainslie
26
W. Cullen Moore, Chairman, Chicago Section, 1946
27
W. David Sincoskie, pioneer of packet communications [Society News]
28
W. Edwards Deming - the first management engineer
29
W. F. Davidson heads NRC insulation conference
30
W. F. Thompson succeeds andrew fletcher as UET president
31
W. G. Shepherd, Director, 1960-1962
32
W. H. Grinsted: pioneer of teletraffic engineering
33
W. H. Harrison receives Hoover medal
34
W. Howard Tasker
35
W. K. Lewis designated John Fritz medalist for 1966
36
W. L. Doxey [Biography]
37
W. M. Rust, Jr., Board of Directors, 1951-1952
38
W. Network Analyzer Techniques [breaker page]
39
W. P. J. Fawcus
40
W. R. Bennett--Some early memories
41
W. R. G. Baker Prize Award - Will E. Leland, Waiter Willinger, Daniel V. Wilson. and Murad S. Taaau
42
W. R. G. Baker, Director, 1950
43
W. R. G. Baker, Treasurer, 1957
44
W. Ryland Hill, Jr. Chairman, Seattle Section, 1948-1949 and Andrew Friedenthal, Chairman, Detroit Section, 1948-1949
45
W. Stanley Jevons, Allan Marquand, and the origins of digital computing
46
W. Stratford Andrews
47
W.ave propagatibn and solitons in 2d photonic structures
48
W.C. Carter Award
49
W.C. Carter Award
50
W.J. Morgan
51
W.P. Dayawansa [In Memoriam]
52
W.R. Bottoms [biography]
53
W.R. Tackaberry´s Statement To The Federal Energy Regulatory Commission On October 23, 1987
54
W.R.G. Baker - An Appreciation
55
W.R.G. Baker awards
56
W.R.G. Baker, Chairman, National Television System Committee
57
W.R.G. Baker, Winner of the 1958 Founders Award
58
W/AGE: the Windsor Attribute Grammar Programming Environment
59
W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress
60
W/Pt/Ge/Pd contact optimization for the measurement of GaAs quantum structures
61
W/T SPR codes offer higher throughput in OCDMA networks
62
W/Ta
2
O
5
/TaN MIM capacitor for high density one time programmable memory
63
W/WN/poly gate implementation for sub-130 nm vertical cell DRAM
64
W/WNx/poly-Si gate technology for future high speed deep submicron CMOS LSIs
65
W/WSi gate self-aligned HIFETs (heterointerface FETs) using an AlInAs/GaInAs heterostructure grown by MOCVD
66
W@nderland: image-based constructable virtual space on the WWW
67
W
+6
/W
+5
redox reactions at the interface of the nanocrystalline TiO
2
photoactive electrode
68
W
3
-OLSR-ETX: Wired-cum-wireless WMN OLSR-ETX for scalable networks
69
W
4
: A Real Time System for Detecting and Tracking People
70
W
4
: real-time surveillance of people and their activities
71
W
4
: Who? When? Where? What? A real time system for detecting and tracking people
72
W=Shockley, the transistor pioneer-portrait of an inventive genius
73
W01: wireless ad hoc and sensor networks
74
W02: networking issues in multimedia entertainment
75
W03: computer-aided modeling, analysis, and design of communication links and networks
76
W04: the quest to control next-generation transport networks: the role of GMPLS
77
W05: high-performance global grid networks
78
W06: adaptive wireless networks
79
W1 - Future green communications: WCNC 2012 workshop on future green communications - Committees and welcome
80
W1 - Future green communications: WCNC 2012 workshop on future green communications - Program
81
W1 Committee
82
W1: Indoor and outdoor femto cells (IOFC 2010)
83
W2 - Broadband femtocell technologies: WCNC 2012 workshop on broadband femtocell technologies - Committees and welcome
84
W2 - Broadband femtocell technologies: WCNC 2012 workshop on broadband femtocell technologies - Program
85
W2 Committee
86
W2 leading RF-CMOS technology and product
87
W2: International workshop on green wireless (W-GREEN)
88
W2E — Wellness Warehouse Engine for semantic interoperability of consumer health data
89
W2GIS organizing committee
90
W2ME: A workflow meta model for OTO-oriented E-commerce
91
W2T 2009: The 2009 Workshop Web2Touch Living Experience through Web
92
W2TS A novel IEEE 802.11 multi-hop mesh network for tracking systems
93
W-2W Current Steering DAC for Programming Phase Change Memory
94
W2W permanent stacking for 3D system integration
95
W2W wafer level vacuum packaging of MEMS devices using solder
96
W3 - IoT-ET 2012: WCNC 2012 workshop on internet of things enabling technologies, embracing machine-to-machine communications and beyond - Committees and welcome
97
W3 - IoT-ET 2012: WCNC 2012 workshop on internet of things enabling technologies, embracing machine-to-machine communications and beyond - Program
98
W3 RF transceiver for wireless communication
99
W3: COGCLOUD 2010 (Cognitive Wireless Cloud Networks)
100
W3C proposal ignites standards controversy
101
W3C Speech Interface Languages: VoiceXML [Standards in a Nutshell]
102
W3QS-a system for WWW querying
103
W3SC Preface and Committee List
104
W4 - 4G mobile radio access networks: WCNC 2012 workshop on 4G mobile radio access networks - Committees and welcome
105
W4 - 4G mobile radio access networks: WCNC 2012 workshop on 4G mobile radio access networks - Program
106
W4 - The Wireless World Wide Web
107
W4 Committee
108
W4: a World Wide Web browser with CSCW support
109
W4: WiMAGIC — Huawei workshop: Towards IMT — Advanced and beyond
110
W-40G Guided Millimeter-Wave Transmission System
111
W42 - a scalable spatial database system for holding Digital Elevation Models
112
W4-the Wireless World Wide Web
113
W5 - Wireless vehicular communications and networks: WCNC 2012 workshop on wireless vehicular communications and networks - Committees and welcome
114
W5 - Wireless vehicular communications and networks: WCNC 2012 workshop on wireless vehicular communications and networks - Program
115
W5: Enabling technologies for wearable and implantable body sensors (BAN 2010)
116
W6: International workshop on advances in positioning and location-enabled communications (APLEC 2010)
117
W7 - Wireless cloud and white space oriented networks: WCNC 2012 workshop on wireless cloud and white space oriented networks - Committees and welcome
118
W7 - Wireless cloud and white space oriented networks: WCNC 2012 workshop on wireless cloud and white space oriented networks - Program
119
W7: WDN 2010 (International workshop on wireless distributed networks)
120
W7-X commissioning: Progress and lessons learned for future devices
121
W7-X DEMO coil cryogenic tests in the CEA/Saclay test facility
122
W7-X precision metrology
123
WA 80 BGO calorimetry electronics
124
WA1 - Far-infrared molecular lasers
125
WA1 session: Embedded memory and systems 1
126
WA1: special session: digital imaging techniques 2
127
WA2 session: Network on chip 1
128
WA2: special session: detectors for nuclear and particle physics
129
WA2--Comparison of theory and experiment for a transversely excited high-pressure CO
2
laser
130
WA3 session: Network on chip 2
131
WA3: electrical measurements 1
132
WA4: analog-to-digital converters 3
133
WA4--Intracavity breakdown in CO and CO
2
lasers
134
WA5 - Laser-excited electronic-to-electronic energy transfer in sodium
135
WA5: medical instrumentation
136
WA6: microwave-based measurements
137
WA7--Electron-beam-controlled CO
2
laser amplifiers
138
WA80 BGO calorimetry electronics
139
WA-A1 a channel-collector transistor
140
WA-A1 functional integration of bipolar and MOS structures
141
WA-A1 silicon monolithic RF power amplifier technology
142
WA-A2 an ac power MOS technology
143
WA-A2 High-speed Silicon CCD´s fabricated on high-lifetime epitaxial material
144
WA-A2 stratified-channel charge-coupled devices
145
WA-A3 a Schottky collector transistor switch with merged vertical n-p-n load
146
WA-A3 formation of n-p-n structures by a combination of double implantation and single-pulse laser annealing
147
WA-A3 transient subthreshold conduction over small potential barriers in dynamic MOS structures
148
WA-A4 a device model for an ion-implanted buried channel MOSFET and buried-channel CCD
149
WA-A4 characteristics of the currents in p-n-p bipolar transistors with degenerate base region
150
WA-A4 Electrical trimming of polycrystalline Silicon resistors and its application to analog IC´s
151
WA-A5 a new doping technique without SiO
2
patterning using an inorganic photoresist
152
WA-A5 separation of the basic mechanisms in optically illuminated metal-semiconductor contacts
153
WA-A5 transport physics in submicrometer semiconductor devices
154
WA-A6 amorphous silicon integrated circuit
155
WA-A6 Determination of intrinsic noise contributions in surface-channel CCD´s
156
WA-A6 short-channel nonequilibrium effects in buried-channel structures
157
WA-A7 capacitance modeling for SOS transistors
158
WA-A7 correlation between capacitance deep level measurements and low-frequency noise in InP Schottky diodes
159
WA-A7 the effect of electron trapping on the performance of short-channel MOS/Bulk and MOS/SOS transistors
160
WA-A8 A channel hot-electron degradation model for IGFET´s
161
Waalbot: Agile climbing with synthetic fibrillar dry adhesives
162
Waalbot: An Agile Small-Scale Wall Climbing Robot Utilizing Pressure Sensitive Adhesives
163
Waalbot: An Agile Small-Scale Wall-Climbing Robot Utilizing Dry Elastomer Adhesives
164
WAAS Geostationary Communication Segment (GCS) requirements analysis
165
WAAS measurement processing; current design and potential improvements
166
WAAS performance in the 2001 Alaska Flight Trials of the high speed Loran data channel
167
WAAS space segment antenna based on EBG superstrate gain enhancement technique
168
WAAS, EGNOS, MSAS, and SNAS for telecom sync applications
169
WAAS/EGNOS-ready 2-chip GPS chipset
170
WAAS: a security service for wireless ATM networks
171
WaaS: Wisdom as a Service
172
WAAS-Based Threat Monitoring for a Local Airport Monitor (LAM) that Supports Category I Precision Approach
173
WA-B1 AlgaAs/GaAs solar cells for concentrator applications
174
WA-B1 direct ion implantation studies of large-diameter undoped GaAs prepared by LEC growth for monolithic X-band power FET circuits
175
WA-B1 domain electroluminescence in ac thin-film devices
176
WA-B2 improved high-energy response of Ga
1-x
Al
x
As-GaAs solar cells using fluorescent capping layers
177
WA-B2 Monolithic amplifiers and FET´s formed by direct selected area, ion implantation into undoped and Chromium-doped Gallium Arsenide substrates
178
WA-B2 on the memory behavior of thin-film electroluminescent devices
179
WA-B3 electrical and optical characteristics of thin-film electroluminescent devices and device models
180
WA-B3 orientation effect on planar GaAs MESFET
181
WA-B3 polymer-semiconductor solar cells
182
WA-B4 avalanching optoelectronic microwave gate
183
WA-B4 Leakage current in GaAs MESFET´s with GaAs and Ga
1-x
Al
x
As buffer layers
184
WA-B4 optical-fiber sensors with the "BOTTLE" single-mode fiber coupler
185
WA-B5 high-electron mobility transistors with selectively doped GaAs/n-AlGaAs heterojunctions
186
WA-B5 narrow-base Al
0.5
Ga
0.5
As/GaAs heterojunction phototransistors grown by metalorganic chemical vapor deposition
187
WA-B5 nonalloyed and "In situ" ohmic contacts to highly doped n-type GaAs layers grown by molecular beam epitaxy (MBE) for field-effect transistors
188
WA-B6 ballistic electron transport in thin layers of GaAs
189
WA-B6 GaAs Schottky-barrier gate CCD
190
WA-B6 semiconductor laser with integral Si Schottky diode detector
191
WA-B7 a prototype integrated optical EM field detector
192
WA-B7 Planar GaInSb CCD´s
193
WA-B7 the potential and present status of an MIS microwave technology on InP
194
WA-B8 Double-heterostructure Ga
0.47
In
0.53
As MESFET´s
195
WA-B8 photosensor array for integrated optical spectrum analyzer systems
196
WABOT-2: Autonomous robot with dexterous finger-arm--Finger-arm coordination control in keyboard performance
197
Wabtec ECP system update
198
WAC 2004
199
WAC 2004
200
WAC 2004
201
WAC 2004
202
WACA: A Hierarchical Weighted Clustering Algorithm Optimized for Mobile Hybrid Networks
203
WACA: Workload and cache aware load balancing policy for web services
204
WACCO and LOKO: Strong Consistency at Global Scale
205
WACCPD´14 Committee
206
WACCPD´14 Message
207
W-ACE: a logic language for intelligent Internet programming
208
Wachet auf! Computer security and the millennium
209
WACHM: Weight based adaptive clustering for large scale heterogeneous MANET
210
WACI 2011 Committee
211
Wacky oxides: Rich properties in search of devices
212
WACL: supporting telecommunications using - wearable active camera with laser pointer
213
WACNet - Wireless Ad-hoc Community Network
214
WACNet: wireless ad-hoc community network
215
WACO: Workload Aware Column Order for Scan Operator in Wide Table
216
WACSIS-Wave Crest Sensor Intercomparison Study at the Meetpost Noordwijk measurement platform
217
WACS-wide-area stability and voltage control system: R&D and on-line demonstration
218
WACS-Wide-Area Stability and Voltage Control System: R&D and Online Demonstration
219
WACV - table of contents
220
WACV 2015 Area Chairs
221
WACV 2015 Organizing Committee
222
WAD project where attractor dynamics aids wheelchair navigation
223
WAD project where attractor dynamics aids wheelchair navigation
224
WAD Workflow System: Data-Centric Workflow System
225
WAD: A Feasibility study using the Wicked Audio Debugger
226
WADA Service: An Extension of DICOM WADO Service
227
WADE: a Web-based automated parallel CAD environment
228
WADE: an object-oriented environment for modeling and simulation of workcell applications
229
WaDer: a middleware system for modeling and searching the Web
230
Wading and jumping into a new job-exploring dynamics of knowledge flow for systems engineers
231
Wadkin all set to compete with the Japanese
232
Wadkin chief hits out at "dumping"
233
Wadkin machining centre wins design council award
234
WADM and MHD modeling of wire array precursor formation for the loads of different materials and geometries
235
WADP: A wormhole attack detection and prevention technique in MANET using modified AODV routing protocol
236
W-Aegis: A Propagation Behavior Based Worm Detection Model for Local Networks
237
WAEX: Web Accessibility Evaluator in a Single XSLT File
238
WAF: an adaptive protocol framework for multihop wireless networks
239
WAF: wireless-adaptive fair scheduling for multimedia stream in time division multiplexed packet cellular systems
240
WAFA: Fine-grained dynamic analysis of web applications
241
WAF-based document clustering algorithm
242
WaFeR — A framework for testing Ul-based applications
243
Wafer 3D effect study with finite difference time domain (FDTD) simulation method
244
Wafer admission control for clustered photolithography tools
245
Wafer ambient control for Agile FAB
246
Wafer- and piece-wise Si tip transfer technologies for applications in scanning probe microscopy
247
Wafer and/or chip bonding adhesives for 3D package
248
Wafer applied and no flow underfill screening for 3D stacks
249
Wafer arcing phenomena and resolution through a capacitively coupled low gap plasma reactor
250
Wafer back side inspection applications for yield protection and enhancement
251
Wafer backside coating development for die attach process
252
Wafer Backside Coating/sup TM/ of Electrically Conductive Die Attach Adhesives for Packaging of Discrete Semiconductor Devices
253
Wafer Backside Coating
TM
of electrically conductive die attach adhesives for small IC packaging
254
Wafer backside inspection applications in lithography
255
Wafer Bevel Protection During Deep Reactive Ion Etching
256
Wafer bevel shape inducing high defect density in shallow trench isolation process
257
Wafer Bin Triggering: Containment of Statistically Abnormal Wafers
258
Wafer bonded all-optical switching devices
259
Wafer bonded capacitive micromachined underwater transducers
260
Wafer bonded silicon photonics
261
Wafer Bonded Subwavelength Metallo-Dielectric Laser
262
Wafer bonding and its application on compliant universal (CU) substrates
263
Wafer bonding and layer transfer processes for 4-junction high efficiency solar cells
264
Wafer bonding and smartcut for formation of silicon-on-insulator materials
265
Wafer bonding for CMOS integration and packaging
266
Wafer bonding for intelligent power ICs: integration of vertical structures
267
Wafer bonding for Planar Double Gate Technology
268
Wafer bonding for the fabrication of high-performance photodetectors: a mature technology ?
269
Wafer bonding for use in mechanically stacked multi-bandgap cells
270
Wafer bonding for vacuum encapsulated MEMS
271
Wafer bonding of 50 mm diameter mirror substrate to AlGaInP light-emitting diode wafer
272
Wafer bonding of damascene-patterned metal/adhesive redistribution layers for via-first three-dimensional (3D) interconnect
273
Wafer bonding of InP and GaAs: interface characterization and device applications
274
Wafer bonding of polycrystalline spinel with LiNbO
3
/LiTaO
3
for temperature compensation of RF surface acoustic wave devices
275
Wafer bonding of Si with dissimilar materials
276
Wafer bonding of SiC-SiC and SiC-Si by modified suface activated bonding method
277
Wafer bonding technique based GaN/Quantum Dots/GaN system
278
Wafer bonding techniques for hybrid silicon photonic devices based on surface modifications
279
Wafer bonding technology and its applications in optoelectronic devices and materials
280
Wafer bonding technology for optoelectronic integration
281
Wafer Bonding Technology for Soi Applications: A Review
282
Wafer bonding type selection for 3D IC designs
283
Wafer bonding using fluxless process with Sn-rich Sn-Au dual-layer structure
284
Wafer bonding using low temperature melting glass
285
Wafer bonding using microwave heating of parylene for MEMS packaging
286
Wafer bonding using parylene and wafer-level transfer of free-standing parylene membranes
287
Wafer Bonding with BCB and SU-8 for MEMS Packaging
288
Wafer bonding with intermediate Parylene layer
289
Wafer bonding with metal layers for MEMS applications
290
Wafer Bonding with Nanoprecision Alignment for Micro/Nano Systems
291
Wafer bonding: a flexible approach to materials integration
292
Wafer bonding: an overview
293
Wafer bow of substrate transfer process for GaNLED on Si 8 inch
294
Wafer bump inspection with transparent film layer using vertical scanning interferometer for semiconductor packaging
295
Wafer Bumping & Wafer Level Packaging for 300mm Wafer
296
Wafer Bumping Process and Inter-Chip Connections for Ultra-High Data Transfer Rates in Multi-Chip Modules With Superconductor Integrated Circuits
297
Wafer bumping technology for LDI application by electroless nickel plating
298
Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration
299
Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration
300
Wafer burn-in (WBI) technology for RAM´s
301
Wafer by wafer control in CMP system with metrology delay
302
Wafer by Wafer Low Dose Rate Qualification in a Production Environment
303
Wafer characterization via sub-nanosecond time-correlated single photon counting
304
Wafer charge monitoring by disk current
305
Wafer charge neutralization systems-simulation and experiment
306
Wafer charging during ion implantation and its effect on the degradation of thin oxide of mos device
307
Wafer charging evaluation method of ion milling in GMR head manufacturing using antenna test element group
308
Wafer charging in process equipment and its relationship to GMR heads charging damage
309
Wafer charging in process equipment and its relationship to GMR heads charging damage
310
Wafer chip scale packages with efficient power dissipation have small foot-print for portable applications
311
Wafer Classification Using Support Vector Machines
312
Wafer contamination and particles resulting from cooling-pad elastomer
313
Wafer cooling for a high current serial ion implantation system
314
Wafer cost reduction through design of high performance fully silicided ESD devices
315
Wafer counter-bonding for integrating cte-mismatched substrates and its application to MEMS tuneable metamaterials
316
Wafer current measurement for process monitoring
317
Wafer Defects Detecting and Classifying System Based on Machine Vision
318
Wafer deposition/metallization and back grind, process-induced warpage simulation
319
Wafer Design
320
Wafer dice process improvement using Six Sigma approach
321
Wafer dicing process optimization and characterization for C90 low-k wafer technology
322
Wafer die yield prediction by heuristic methods
323
Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics
324
Wafer distribution system for a clean room using a novel magnetic suspension technique
325
Wafer eccentricity estimation with disturbance caused by alignment notch
326
Wafer edge defect study of temporary bonded and thin wafers in TSV process flow
327
Wafer edge overlay control for 28 nm and beyond technology node
328
Wafer edge roll-off improvement by protective agent in polishing slurry at double side polishing process
329
Wafer edge uniformity considering ion inertia in single- and dual-frequency capacitively coupled discharges
330
Wafer extreme-far edge related study in BEOL (Back-End-of-Line) including BEOL chemical mechanical polishing at 28nm technology node and beyond
331
Wafer fab construction cost analysis and cost reduction strategies: applications of SEMATECH´s future factory analysis methodology
332
Wafer fab control via distributed pricing mechanism
333
Wafer fab conversion through theory of constraint project management techniques
334
Wafer fab cycle forecast under changing loading situations
335
Wafer FAB exhaust management strategies
336
Wafer fab line yield improvement at TriQuint semiconductor
337
Wafer fab production controls for the 90s
338
Wafer fabrication factory simulation language
339
Wafer fabrication ion implant charging-impact on gate oxide breakdown
340
Wafer fabrication scheduling using flow rate control strategy
341
Wafer flatness requirements for 45nm node (65nm hp) lithography process
342
Wafer flatness: An overview measurement considerations and equipment correlation
343
Wafer floating potential for a high current serial ion implantation system
344
Wafer fused AlGaAs/GaAs/GaN HBTs with current gain of ~ 20 and f
T
of ~ 2.6 GHz
345
Wafer fused long wavelength vertical cavity lasers
346
Wafer fused long-wavelength VCSELs with InP-based active cavities
347
Wafer fused optically-pumped semiconductor disk laser operating at 1220- nm
348
Wafer fused optoelectronics for switching
349
Wafer fusion of infrared laser diodes to GaN light-emitting heterostructures
350
Wafer fusion technology for optoelectronic devices
351
Wafer fusion: materials issues and device results
352
Wafer IMS (Injection molded solder) — A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility
353
Wafer level 3D system integration based on silicon interposers with through silicon vias
354
Wafer Level ACA Packages and their Applications to Advanced Electronic Packaging
355
Wafer level and flip chip design through solder prediction models and validation
356
Wafer level and substrate level chip scale packaging
357
Wafer level applied near-hermetic protection for semiconductors
358
Wafer level approaches for the integration of carbon nanotubes in electronic and sensor applications
359
Wafer Level Assembly Methods for Complex Pathway Micro-Fluidic PCR Reactor
360
Wafer Level Autoclave
361
Wafer level batch fabrication and assembly of small form factor optical pickup head
362
Wafer level batch packaging (WLBP): incorporation of air pores/foams in a polyimide matrix using a low modulus sacrificial commercial polymer
363
Wafer level build-up stacking process using molten metal filling for multi-chip packaging
364
Wafer level bumping technology for high voltage LED packaging
365
Wafer level burn-in
366
Wafer Level Camera technology - from wafer level packaging to wafer level integration
367
Wafer level characterization and failure analysis of microsensors and actuators
368
Wafer Level Chip Scale Package copper pillar probing
369
Wafer level chip scale packaging (WL-CSP): an overview
370
Wafer level chip stacked module by embedded IC packaging technology
371
Wafer level circuit analysis & micro-probing on open failure of voltage regulator device
372
Wafer level compression molding compounds
373
Wafer level CSP process by VPES (vacuum printing encapsulation systems)
374
Wafer level CSP using low cost electroless redistribution layer
375
Wafer level CSP with ultra-high thermal reliability lead-free alloys
376
Wafer Level Curing of Polymer Dielectrics with Variable Frequency Microwaves
377
Wafer level defect density distribution using checkerboard test structures
378
Wafer level detecting of Idd failures in CMOS ASICs using liquid crystal techniques
379
Wafer level electromigration applied to advanced copper/low-k dielectric process sequence integration
380
Wafer level electromigration testing on via/line structure with a poly-heated method in comparison to standard package level tests
381
Wafer Level Electromigration Tests for Production Monitoring
382
Wafer level embedded System in Package (WL-eSiP) for mobile applications
383
Wafer level embedding technology for 3D wafer level embedded package
384
Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration
385
Wafer level encapsulation - a transfer molding approach to system in package generation
386
Wafer level encapsulation for system in package generation
387
Wafer level encapsulation process for LED array packaging
388
Wafer level encapsulation techniques for a MEMS microreactor with integrated heat exchanger
389
Wafer level encapsulation technology for MEMS devices using an HF-permeable PECVD SIOC capping layer
390
Wafer Level Fabrication and Packaging of Miniature Combline Filters
391
Wafer level fabrication of 3D glass-embedded components using glass reflow process
392
Wafer level fabrication of high performance MEMS using bonded and thinned bulk piezoelectric substrates
393
Wafer level forward current reliability analysis of 120GHz production SiGe HBTs under accelerated current stress
394
Wafer level glass frit bonding for MEMS hermetic packaging
395
Wafer Level Hermetic Bonding Using Sn/In and Cu/Ti/Au Metallization
396
Wafer level hermetic encapsulation of MEMS inertial sensors using SOI cap wafers with vertical feedthroughs
397
Wafer Level Hermetic Packaging of MOEMS Devices
398
Wafer level hermetic packaging with IMC-less Cu-Cu bonding for 3D microsystems (invited)
399
Wafer level high precision small size inductors for RF application
400
Wafer level high temperature reliability study by backside probing f or a 50um thin TSV wafer
401
Wafer Level High-Speed Germanium Photodiode Array Integration
402
Wafer Level IC Burn-in As A Step Towards Bir
403
Wafer Level Implementation
404
Wafer Level Integrated Antenna Front End Module For Low Cost Phased Array Implementation
405
Wafer level integration of a 24 GHz and 34 GHz differential SiGe-MMIC oscillator with a loop antenna on a BCB membrane
406
Wafer level integration of a 24 GHz differential SiGe-MMIC oscillator with a patch antenna using BCB as a dielectric layer
407
Wafer Level Integration of a 24 GHz Differential SiGe-MMIC Oscillator with a Patch Antenna using BCB as a Dielectric Layer
408
Wafer level interconnects for 3D packaging
409
Wafer Level joule-heated J-Constant EM Tests
410
Wafer level lead free solder bumping process and characterization
411
Wafer level LED packaging with integrated DRIE trenches for encapsulation
412
Wafer level LED packaging with optimal light output and thermal dissipation for high-brightness lighting
413
Wafer level measurement system for SARF characterization of metal lines
414
Wafer level metallic bonding: Voiding mechanisms in copper layers
415
Wafer Level Micropackaging for Distributed MEMS Phase Shifters
416
Wafer level monitoring and process optimization for robust via EM reliability
417
Wafer level optoelectronic testing for DFB laser diodes
418
Wafer level package by using post dicing process
419
Wafer level package for image sensor module
420
Wafer level package for the X-band microwave power sensor
421
Wafer level package of Wideband Microwave Transmission System and Integrated Microwave Antenna using BCB/Metal structure with the die embedded in Si substrate
422
Wafer level package solder joint reliability study for portable electronic devices
423
Wafer level package using double balls
424
Wafer Level Package Using Polymer Bonding of Thick SU-8 Photoresist
425
Wafer level package using pre-applied anisotropic conductive films (ACFs) for flip-chip interconnections
426
Wafer level package wafer probing shift error-proof quality control
427
Wafer level packaged cantilever array type contact force sensor
428
Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections
429
Wafer level packages (WLPs) using B-stage non-conductive films (NCFs) for highly reliable 3D-TSV micro-bump interconnection
430
Wafer Level Packages (WLPs) using Pre-Applied Anisotropic Conductive Films (ACFs)
431
Wafer level packaging (WLP): Fan-in, fan-out and three-dimensional integration
432
Wafer level packaging and 3D interconnect for IC technology
433
Wafer level packaging based on AU-AU bonding for a CMOS compatible thermal wind sensor
434
Wafer Level Packaging by residual stress evaluation using piezoresistive stress sensors for the enhancement of reliability
435
Wafer level packaging fan out thermal management: Is smaller always hotter?
436
Wafer level packaging for chambers of two different pressures
437
Wafer level packaging for GaAs optical detector using through wafer grooves (TWG) fabricated by mechanical dicing and wet etching
438
Wafer level packaging for hermetical encapsulation of MEMS resonators
439
Wafer Level Packaging for MEMS Geiger Counter
440
Wafer level packaging for RF MEMS devices using void free copper filled through glass via
441
Wafer level packaging for ultra thin (6 μm) high brightness LEDs using embedding technology
442
Wafer level packaging of MEMS
443
Wafer level packaging of micro/nanosystems
444
Wafer Level Packaging of Micromachined Gas Sensors
445
Wafer level packaging of micro-machined gas sensors
446
Wafer level packaging of RF MEMS devices using TSV interposer technology
447
Wafer level packaging solution for high performance microwave inductors on Si substrates
448
Wafer level packaging technology development for CMOS image sensors using Through Silicon Vias
449
Wafer level processing of 3D system in package for RF and data application
450
Wafer Level Processing of Integrated Passive Components Using Polyimide or Polybenzoxazole/Copper Multilayer Technology
451
Wafer Level Processing of Silicon Arrays for Implantable Medical Devices
452
Wafer level processing on re-built wafer for chip stacking
453
Wafer Level Reliability
454
Wafer level reliability (WLR) special interest group (SIG)
455
Wafer level reliability and lifetime analysis of InGaAsP/InP quantum-well Fabry-Perot laser diode
456
Wafer Level Reliability application to manufacturing of high performance microprocessor
457
Wafer level reliability assessment of stress-induced voiding
458
Wafer Level Reliability Competitiveness And Implementation Issues
459
Wafer level reliability evaluation of 120GHz SiGe HBTs
460
Wafer level reliability monitoring strategy of an advanced multi-process CMOS foundry
461
Wafer level reliability procedures to monitor gate oxide quality using V ramp and J ramp test methodology
462
Wafer Level Reliability Screens
463
Wafer level reliability testing of heterojunction bipolar transistors
464
Wafer Level Reliability Testing Physics and Modelling
465
Wafer Level Reliability Utilization and Trends
466
Wafer level reliability: process control for reliability
467
Wafer level sandwich packaging technology for three-axis piezoresistive accelerometer
468
Wafer level self-assembly of microstructures using the global magnetic lifting and localized induction welding
469
Wafer level sort programming-impact on EPROM memory retention
470
Wafer level stress data successfully used as early burn-in predictor
471
Wafer level system integration for SiP
472
Wafer level system integration: a review
473
Wafer level system packaging and integration for solid state lighting (SSL)
474
Wafer level test arrays with simple BIST to expedite process development for circuit reliability
475
Wafer level testing for semiconductor laser manufacture via spatially resolved photoluminescence
476
Wafer level testing of inter-line reliability in copper/low-k structures
477
Wafer Level Thin Film Encapsulation for BAW RF MEMS
478
Wafer level thin film encapsulation for MEMS
479
Wafer Level Thin Film Encapsulation for MEMS
480
Wafer level three-dimensional integration (3DI) using bumpless TSV interconnects for tera-scale generation
481
Wafer level tracking and control to full mini-environment line
482
Wafer level tracking enhances particle source isolation in a manufacturing environment
483
Wafer level Tungsten-Glass bonding with photosensitive BCB
484
Wafer level underfill - processing and reliability
485
Wafer level underfill entrapment in solder joint during thermocompression: Simulation and experimental validation
486
Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates
487
Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking
488
Wafer level vacuum packaged de-coupled vertical gyroscope by a new fabrication process
489
Wafer level vacuum packaged resonator with in-situ Au-Al eutectic Re-Distribution layer
490
Wafer level vacuum packaging for MEMS device by solder sealing
491
Wafer level vacuum packaging of MEMS sensors
492
Wafer level vertical interconnection method for microcolumn array
493
Wafer level warpage characterization for backside manufacturing processes of TSV interposers
494
Wafer level warpage modeling methodology and characterization of TSV wafers
495
Wafer level wireless temperatures sensing and its applications in RF plasma etch in VLSI processing
496
Wafer line productivity optimization in a multi-technology multi-part-number fabricator
497
Wafer lot release policies based on the continuous and periodic review of WIP levels
498
Wafer Map Failure Pattern Recognition and Similarity Ranking for Large-Scale Data Sets
499
Wafer mapping of bulk traps in silicon using scanning capacitance transient spectroscopy
500
Wafer Mapping of Total Dose Failure Thresholds in a Bipolar Recessed Field Oxide Technology
501
Wafer mapping using DOE and RSM techniques
502
Wafer metrology based on combined optical interferometry
503
Wafer packing for full mask exposure fabrication
504
Wafer packing for full mask exposure fabrication
505
Wafer placement repeatibility and robot speed improvements for bonded wafer stacks used in 3D integration
506
Wafer Polishing Process with Signal Analysis and Monitoring for Optimum Condition of Machining
507
Wafer position sensing and motion control in the clean tube system
508
Wafer positioning by laser scanning method
509
Wafer post-processing for a reconfigurable wafer-scale circuit board
510
Wafer preparation and iodine-ethanol passivation procedure for reproducible minority-carrier lifetime measurement
511
Wafer Probe Calibration Accuracy Measurements
512
Wafer probe process verification tools
513
Wafer probe test cost reduction of an RF/A device by automatic testset minimization — A case study
514
Wafer probe transducer efficiency
515
Wafer probing at W-band
516
Wafer Probing Issues at Millimeter Wave Frequencies
517
Wafer Probing Simulation for Copper Bond Pad Based BPOA Structure
518
Wafer process and issue of through electrode in Si wafer using Cu damascene for three dimensional chip stacking
519
Wafer Process Chip Size Package Consisting of Double-Bump Structure for Small-Pin-Count Packages
520
Wafer quality specification for future sub-half-micron ULSI devices
521
Wafer reconstitution with precision dry front-to-front registration
522
Wafer reconstruction: An alternative 3D integration process flow
523
Wafer redeposition impact on etch rate uniformity in IPVD system
524
Wafer Redeposition Impact on Etch Rate Uniformity in IPVD System
525
Wafer Reliability Evaluation and Monitoring for InGaAsP Devices
526
Wafer requirement for future power devices
527
Wafer resistivity influence over DRIE processes for TSVs manufacturing
528
Wafer sawing process characterization for thin die (75micron) applications
529
Wafer scalable growth and delamination of graphene for silicon heterogeneous VLSI technology
530
Wafer scale architecture for an FFT processor
531
Wafer Scale Assembly and Test for the Production of Opto-Electronic Components
532
Wafer scale biomolecule grafting: the first step for low cost, high throughput active biochip manufacturing
533
Wafer scale coating of polymer cantilever fabricated by nanoimprint lithography
534
Wafer Scale Encapsulation of Large Lateral Deflection MEMS Structures
535
Wafer Scale Encapsulation of Wide Gaps using oxidation of Sacrificial Beams
536
Wafer scale fabrication of carbon nanotube FETs with embedded poly-gates
537
Wafer scale fabrication of highly integrated rubidium vapor cells
538
Wafer scale graphene transfer for back end of the line device integration
539
Wafer scale integration
540
Wafer scale integration
541
Wafer Scale Integration
542
Wafer scale integration
543
Wafer scale integration (WSI) of programmable gate arrays (PGA´s)
544
Wafer Scale Integration Enabling Space Science
545
Wafer Scale Integration of CMOS Chips for Biomedical Applications via Self-Aligned Masking
546
Wafer scale integration of one- and two-dimensional linear arrays
547
Wafer Scale Integration: A New Approach
548
Wafer scale integration-a mainstream technology for the 1990s
549
Wafer scale integration-a technology whose time has come
550
Wafer Scale Interconnections for GaAs Packaging-Applications to RISC Architecture
551
Wafer scale package construction and usage for RF through millimeter wave applications
552
Wafer Scale Package construction and usage for RF through millimeter wave applications
553
Wafer scale packaging based on underfill applied at the wafer level for low-cost flip chip processing
554
Wafer scale photonic-die attachment
555
Wafer scale photonic-die attachment
556
Wafer scale profiling of photonic integrated circuits
557
Wafer Scale Texturing of LiNbO
3
558
Wafer shift promises cheaper chips for some
559
Wafer Sort Bitmap Data Analysis Using the PCA-Based Approach for Yield Analysis and Optimization
560
Wafer sort trimming of analog ICs
561
Wafer sort yield improvement by localizing and applying optical proximity correction on a metal bridging issue
562
Wafer stacking: key technology for 3D integration
563
Wafer start automation with TOC to enhance cycle time control
564
Wafer Stress Durinlg Rapid Thermal Annealing Due to Surface Geometrical Patterns
565
Wafer Surface Charging Model for Single-Wafer Wet-Spin Processes
566
Wafer surface preparation for high-efficiency solar cells
567
Wafer surface treatment for bonding GaInAsP and magnetooptic garnet
568
Wafer surface treatment for integrating laser diode and optical isolator by direct bonding
569
Wafer temperature and stress profiles in an MeV ion implanter using the finite-element method
570
Wafer Temperature Measurement and Control During Laser Spike Annealing
571
Wafer temperature measurement in conduction-based RTP systems
572
Wafer temperature non-uniformity due to volumetric absorption of radiation
573
Wafer Test Methods to Improve Semiconductor Die Reliability
574
Wafer test probe burn modeling and characterization
575
Wafer testing of thin film record and reproduce heads
576
Wafer testing with pairwise comparisons
577
Wafer thermal desorption spectrometry in a rapid thermal processor using atmospheric pressure ionization mass spectrometry
578
Wafer Thickness Sensor (WTS) for etch depth measurement of TSV
579
Wafer thinning and back side processing to enable 3D stacking
580
Wafer thinning for 3D integration
581
Wafer thinning for high-density three dimensional integration _ 12-inch wafer-level 3D-LSI program at GINTI
582
Wafer thinning solution for wafer-level-capped MEMS devices
583
Wafer thinning, bonding, and interconnects induced local strain/stress in 3D-LSIs with fine-pitch high-density microbumps and through-Si vias
584
Wafer through-hole interconnections with high vertical wiring densities
585
Wafer to wafer bonding using electroplated Co-Sn solder layer
586
Wafer to wafer direct bonding using surfaces activated by hydrogen plasma treatment
587
Wafer to wafer LED test & scanning back end semiconductor handler
588
Wafer topography measurement by fast optical scanning deflectometry
589
Wafer Topography-Aware Optical Proximity Correction
590
Wafer topology effect on the etching saturation behaviors in NF
3
/NH
3
remote plasmas
591
Wafer traveler design for an undergraduate microchip fabrication facility
592
Wafer warpage in FO-WLP — Making friends out of enemies
593
Wafer yield prediction by the Mahalanobis-Taguchi system
594
Wafer zone based yield analysis
595
Wafer/package test mix for optimal defect detection
596
Wafer2Wafer Etch Monitor via
In Situ
QCLAS
597
Wafer-applied underfill film laminating
598
Wafer-applied underfill: flip-chip assembly and reliability
599
Wafer-array Systolic Array For Adaptive Antenna Processing
600
Wafer-based nanostructure manufacturing for integrated nanooptic devices
601
Waferbond technologies and quality assessment
602
Wafer-bonded 1.55 μm vertical cavity laser arrays for wavelength division multiplexing
603
Wafer-bonded 2-D CMUT arrays incorporating through-wafer trench-isolated interconnects with a supporting frame
604
Wafer-bonded bottom-emitting 850 nm VCSELs on GaP substrates
605
Wafer-bonded bottom-emitting 850-nm VCSEL´s on GaP substrates
606
Wafer-Bonded GaInP/GaAs//Si Solar Cells With 30% Efficiency Under Concentrated Sunlight
607
Wafer-bonded Ge:Ga blocked-impurity-band far-infrared detectors
608
Wafer-bonded InGaAlP/AuBe/glass light-emitting diodes
609
Wafer-Bonded p-n Heterojunction of GaAs and Chemomechanically Polished N-Polar GaN
610
Wafer-Bonded Silicon Gamma-Ray Detectors
611
Wafer-Bonded Silicon Gamma-Ray Detectors
612
Wafer-bonded silicon gamma-ray detectors
613
Wafer-bonded, high dynamic range, single-crystalline silicon tunneling accelerometer
614
WaferCatalyst — Towards promotion of IC design in the middle east using virtual community approach
615
Wafer-chip assembly for large-scale integration
616
Wafer-chip assembly for large-scale integration
617
Wafer-chip assembly for large-scale integration
618
Wafer-compatible fabrication of thermally induced ultrasound emitters using nanocrystalline silicon layer
619
Wafer-fused 1310 nm and 1550 nm mode-locked semiconductor disk lasers
620
Wafer-fused 1550-nm band VCSELs with fundamental mode output exceeding 6 mW
621
Wafer-fused optoelectronics for switching
622
Wafer-fused thin film cooler semiconductor laser structures
623
Wafer-fused vertical-cavity bistable device at 1.55 /spl mu/m wavelength
624
Wafer-Fused Vertical-Cavity Bistable Device at 1.55/spl mu/m Wavelength.
625
Wafer-Fusion-Enabled Platforms for Mid-Infrared Integrated Silicon Photonics
626
Wafer-grown heat flux sensor arrays for plasma etch processes
627
Waferless metrology job creation
628
Waferless pattern recognition recipe creation using StatTrax
629
Wafer-level 3D integration using hybrid bonding
630
Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies
631
Wafer-level 3D manufacturing issues for streaming video processors
632
Wafer-level Accelerated Lifetesting of Individual Devices
633
Wafer-Level ANA Calibrations at NIST
634
Wafer-level AuSn and CuSn bonding for MEMS encapsulation
635
Wafer-level BCB CAP packaging of integrated MEMS switches with MMIC
636
Wafer-level calibration of stress sensing test chips
637
Wafer-level characterization of EEPROM tunnel oxide using a fast floating-gate technique and a realistic memory cell-based test structure
638
Wafer-Level Characterization of Probecards using NAC Probing
639
Wafer-level Charged Device Model testing
640
Wafer-level chip scale flexible wireless microsystem fabrication
641
Wafer-level chip scale MEMS oscillator for wireless applications
642
Wafer-level chip scale packaging: benefits for integrated passive devices
643
Wafer-level chip size package (WL-CSP)
644
Wafer-level chip-scale packaging for low-end RF products
645
Wafer-level chip-to-Wafer (C2W) integration of high-sensitivity MEMS and ICs
646
Wafer-Level Compliant Bump for 3D Chip-Stacking
647
Wafer-level compliant bump for three-dimensional LSI with high-density area bump connections
648
Wafer-Level Cu/Sn to Cu/Sn SLID-Bonded Interconnects With Increased Strength
649
Wafer-Level Defect Screening for “Big-D/Small-A” Mixed-Signal SoCs
650
Wafer-level defect-based testing using enhanced voltage stress and statistical test data evaluation
651
Wafer-level electromigration for reliability monitoring: Quick-turn electromigration stress with correlation to package-level stress
652
Wafer-level electromigration reliability test for deep-submicron interconnect metallization
653
Wafer-level electromigration tests on NIST and SWEAT structures
654
Wafer-Level Encapsulation and Sealing of Electrostatic HARPSS Transducers
655
Wafer-Level Epitaxial Silicon Packaging for Out-of-Plane RF MEMS Resonators With Integrated Actuation Electrodes
656
Wafer-level fabricated micro beam splitter based on 45-degree saw dicing of glass substrate
657
Wafer-Level Fabrication of a Fused-Quartz Double-Ended Tuning Fork Resonator Oscillator Using Quartz-on-Quartz Direct Bonding
658
Wafer-level fabrication of a triboelectric energy harvester
659
Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique
660
Wafer-Level Fabrication of Microcube-Typed Beam-Splitters by Saw-Dicing of Glass Substrate
661
Wafer-level fabrication of nanoscale patterned sapphire substrates with broadband optical transmittance
662
Wafer-level fabrication of polymer microsensors with integrated heat control
663
Wafer-level fabrication of strain gauges on PDMS membranes for low-pressure sensing
664
Wafer-level fault isolation approach to debug integrated circuits JTAG failures
665
Wafer-Level Film Selection for Stacked-Die Chip Scale Packages
666
Wafer-Level Flip Chip Packages Using Preapplied Anisotropic Conductive Films (ACFs)
667
Wafer-Level Glass Capping as Drop-in for Miniaturized, Advanced Optical COB Packaging
668
Wafer-level glass capping with optical integration
669
Wafer-level glass-caps for advanced optical applications
670
Wafer-level glass-caps for advanced optical applications
671
Wafer-Level Hermetic All-Glass Packaging for Microalkali Vapor Cells of Chip-Scale Atomic Devices
672
Wafer-Level Hermetic Bonding Using Sn/In and Cu/Ti/Au Metallization
673
Wafer-level Hermetic Packaged Dual-axis Digital Microaccelerometer
674
Wafer-level hermetic packaging technology for MEMS using anodically-bondable LTCC wafer
675
Wafer-level hermetic vacuum micro-packaging technology for IR detector applications
676
Wafer-level heterogeneous 3D integration for MEMS and NEMS
677
Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS
678
Wafer-Level Heterogeneous Integration of GaN HEMTs and Si (100) MOSFETs
679
Wafer-level heterointegration process of SAW devices and LSI
680
Wafer-level high density integration of surface mount technology components in through-silicon trenches
681
Wafer-level hybrid bonding technology with copper/polymer co-planarization
682
Wafer-level in-registry microstamping
683
Wafer-level inspection system for the automated testing of comb drive based MEMS sensors and actuators
684
Wafer-level integrated electrospray emitters for a pumpless microthruster system operating in high efficiency ion-mode
685
Wafer-Level Integration of High-Quality Bulk Piezoelectric Ceramics on Silicon
686
Wafer-level integration of micro-lens for THz focal plane array application
687
Wafer-level integration of NiTi shape memory alloy wires for the fabrication of microactuators using standard wire bonding technology
688
Wafer-level integration of on-chip antennas and RF passives using high-resistivity polysilicon substrate technology
689
Wafer-Level Integration Technique of Surface Mount Devices on a Si-Wafer With Vibration Energy and Gravity Force
690
Wafer-level integration technology for multi emitter high power fiber coupled lasers
691
Wafer-level integration technology of surface mount devices using automatic parts alignment technology with vibration
692
Wafer-level Jramp and J-constant electromigration testing of conventional and SWEAT patterns assisted by a thermal and electrical simulator
693
Wafer-level light emitting diode (WL-LED): An innovative approach for cost-effective very high power lighting
694
Wafer-level low temperature bonding with Au-In system
695
Wafer-level magnetotransport measurement of advanced transistors - making a powerful technique even more powerful
696
Wafer-Level Measurement of Thermal Conductivity on Thin Films
697
Wafer-level mechanical and electrical integration of SMA wires to silicon MEMS using electroplating
698
Wafer-level mechanical characterization of silicon nitride MEMS
699
Wafer-level MEMS package and its reliability issues
700
Wafer-level microfluidic cooling interconnects for GSI
701
Wafer-Level Modular Testing of Core-Based SoCs
702
Wafer-level non conductive films for exascale servers
703
Wafer-level optical packaging for chip-scale atomic magnetometers
704
Wafer-level package interconnect options
705
Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device
706
Wafer-Level Packaged Accelerometer With Solderable SMT Terminals
707
Wafer-Level Packaged Light-Emitting Diodes Using Photodielectric Resin
708
Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab
709
Wafer-level packaged SAW filters with resistance to transfer molding
710
Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections
711
Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn–Ag Microbump Interconnection
712
Wafer-level packaging based on uniquely orienting self-assembly (the DUO-SPASS processes)
713
Wafer-Level Packaging Design With Through Substrate Grooves as Interconnection for GaAs-Based Image Sensor
714
Wafer-level packaging for harsh environment application
715
Wafer-level packaging method incorporating embedded thermal management for GaN-based RF front-ends
716
Wafer-level packaging of aluminum nitride RF MEMS filters
717
Wafer-Level Packaging of MEMS Accelerometers with Through-Wafer Interconnects
718
Wafer-Level Packaging of Micromechanical Resonators
719
Wafer-level packaging of optoelectronic chips using sea of leads electrical and optical I/O interconnections
720
Wafer-level packaging of three-dimensional MOEMS device with lens diaphragm
721
Wafer-Level Packaging Technology for 10 Gbps TOSAs
722
Wafer-level packaging technology for extended global wiring and inductors
723
Wafer-level packaging technology for high-Q on-chip inductors and transmission lines
724
Wafer-level packaging technology for MEMS
725
Wafer-Level Packaging With Soldered Stress-Engineered Micro-Springs
726
Wafer-Level Parylene Packaging With Integrated RF Electronics for Wireless Retinal Prostheses
727
Wafer-Level Process for Single-Use Buckling-Film Microliter-Range Pumps
728
Wafer-level processing for polymer-based planar micro cryogenic coolers
729
Wafer-level pulsed-DC electromigration response at very high frequencies
730
Wafer-level quartz dry etching technology
731
Wafer-level radiation testing for hardness assurance
732
Wafer-level reliability assessment of SiGe NPN HBTs after high temperature electrical operation
733
Wafer-level RF test and DfT for VCO modulating transceiver architectures
734
Wafer-level sandwiched packaging for high-yield fabrication of high-performance mems inertial sensors
735
Wafer-level selective transfer method for FBAR-LSI Integration
736
Wafer-level technologies for computational cameras
737
Wafer-level technology for sub-mm wave focal plane arrays
738
Wafer-level testing of thermopile IR detectors
739
Wafer-level testing with a membrane probe
740
Wafer-level thin film vacuum packages for MEMS using nanoporous anodic alumina membranes
741
Wafer-level three-dimensional monolithic integration for heterogeneous silicon ICs
742
Wafer-Level Transfer of Thermo-Piezoelectric Si
3
N
4
Cantilever Array on a CMOS Circuit for High Density Probe-Based Data Storage
743
Wafer-Level Transfer Technologies for PZT-Based RF MEMS Switches
744
Wafer-Level Transmission Line Pulse Testing for Optimization of Output Transistor ESD Resistance
745
Wafer-level TSV connectivity test using ring oscillator scheme
746
Wafer-level two-step bonding process for combined sensor with two different pressure chambers
747
Wafer-level uniaxially strained s-SOI by direct mechanical stress
748
Wafer-level vacuum package with vertical feedthroughs
749
Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding
750
Wafer-Level Vacuum Packaging for Microsystems Using Glass Frit Bonding
751
Wafer-Level Vacuum Packaging of Micromachined Thermoelectric IR Sensors
752
Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generators
753
Wafer-Level Vacuum Sealing by Coining of Wire Bonded Gold Bumps
754
Wafer-Level Vacuum-Encapsulated Lamé Mode Resonator With f-Q Product of
Hz
755
Wafer-level vacuum-packaged triaxial accelerometer with nano airgaps
756
Wafer-level waveguide filter realization using simplied 3D fabricaiton process
757
Wafer-level wet etching of high-aspect-ratio through silicon vias (TSVs) with high uniformity and low cost for silicon interposers with high-density interconnect of 3D packaging
758
Wafer-level-package for Bulk Acoustic Wave (BAW) filters
759
Wafer-mapping of hot carrier lifetime due to physical stress effects (MOSFET)
760
Wafer-on-wafer (WOW) stacking with damascene-contact TSV for 3D integration
761
Wafer-on-Wafer Stacking by Bumpless Cu–Cu Bonding and Its Electrical Characteristics
762
Wafer-package test mix for optimal defect detection and test time savings
763
Wafer-scale 0-level packaging of (RF-)MEMS devices using BCB
764
Wafer-scale 3D integration of InGaAs image sensors with Si readout circuits
765
Wafer-Scale 3D Integration of Silicon-on-Insulator RF Amplifiers
766
Wafer-scale BCB resist-processing technologies for high density integration and electronic packaging
767
Wafer-scale characterization of carrier dynamics in graphene
768
Wafer-scale coplanar waveguide slot-coupled K
a
-band patch antenna for electronic scanning array of a future satellite communications system
769
Wafer-scale diagnosis tolerating comparator faults
770
Wafer-scale embedded-MPC modules for cost-effective image processing systems
771
Wafer-scale etch process for precision frequency tuning of MEMS gyros
772
Wafer-scale fabrication of scanning thermal probes with integrated metal nanowire resistive elements for sensing and heating
773
Wafer-scale fabrication of ultra-thin silicon nanowire devices
774
Wafer-scale film encapsulation of micromachined accelerometers
775
Wafer-scale flexible graphene loudspeakers
776
Wafer-scale flexible graphene strain sensors
777
Wafer-scale graphene synthesis, transfer and FETs
778
Wafer-scale graphene technology and GHz nanoelectronics (invited)
779
Wafer-Scale Growth and Transfer of Aligned Single-Walled Carbon Nanotubes
780
Wafer-scale growth of silicon microwire arrays for photovoltaics
781
Wafer-Scale Growth of Silicon Microwire Arrays for Photovoltaics and Solar Fuel Generation
782
Wafer-Scale hermetically packaged MEMS switches with liquid gallium contacts
783
Wafer-scale integration as a technology choice for high speed ATM switching systems
784
Wafer-scale integration defect avoidance tradeoffs between laser links and Omega network switching
785
Wafer-scale integration of analog neural networks
786
Wafer-scale integration of carbon nanotube transistors as process monitors for sensing applications
787
Wafer-scale integration of GaAs pHEMT on Silicon by epitaxial layer transfer
788
Wafer-scale integration of systolic arrays
789
Wafer-Scale Integration of Systolic Arrays
790
Wafer-scale integration using restructurable VLSI
791
Wafer-scale integration-a fault-tolerant procedure
792
Wafer-scale integration-an international perspective
793
Wafer-Scale Manufacturing of Bulk Shape-Memory-Alloy Microactuators Based on Adhesive Bonding of Titanium–Nickel Sheets to Structured Silicon Wafers
794
Wafer-scale massively parallel computing modules for fault-tolerant signal and data processing
795
Wafer-scale microdevice transfer/interconnect: from a new integration method to its application in an afm-based data-storage system
796
Wafer-scale microdevice transfer/interconnect: its application in an AFM-based data-storage system
797
Wafer-Scale Microtensile Testing of Thin Films
798
Wafer-Scale Millimeter-Wave Phased-Array RFICs
799
Wafer-scale monolithic integration of Al
2
O
3
:Er
3+
Amplifiers with si waveguides
800
Wafer-scale optimization using computational availability
801
Wafer-scale oxide fusion bonding and wafer thinning development for 3D systems integration: Oxide fusion wafer bonding and wafer thinning development for TSV-last integration
802
Wafer-Scale Packaged RF Microelectromechanical Switches
803
Wafer-Scale Packaged RF-MEMS Switches
804
Wafer-scale packaging for FBAR-based oscillators
805
Wafer-scale packaging of RF MEMS for 50-90 GHz
806
Wafer-scale processed, low impedance, neural arrays with varying length microelectrodes
807
Wafer-scale processing of aligned carbon nanotubes for future integrated circuits
808
Wafer-scale processing, assembly, and testing of tunneling infrared detectors
809
Wafer-scale production of LEDs via wafer-bonding: achievements and challenges
810
Wafer-scale replication of optical components on VCSEL wafers
811
Wafer-scale room-temperature bonding between silicon and ceramic wafers by means of argon-beam surface activation
812
Wafer-scale silica optomechanical oscillators with low threshold power and low phase noise for monolithic optical frequency references
813
Wafer-scale silicon antireflection by realizing tapered silicon nanowires with simple wet etching
814
Wafer-scale synthesis and transfer of high quality monolayer graphene for nanoelectronics
815
Wafer-scale synthesis and transfer of monolayer graphene
816
Wafer-scale systolic array for adaptive antenna processing
817
Wafer-scale systolic array for adaptive antenna processing
818
Wafer-scale transducer arrays
819
Wafer-scale uniformity of vertical-cavity lasers grown by modified phase-locked epitaxy technique
820
Wafer-scale W-band power amplifiers using on-chip antennas
821
Waferside Analysis Technique for GaAs-Based Circuits
822
Wafer-specific centering of compact transistor model parameters for advanced technologies and models
823
Wafer-Testing of Optoelectonic–Gigascale CMOS Integrated Circuits
824
Wafer-to-Wafer Alignment for Three-Dimensional Integration: A Review
825
Wafer-to-wafer bonding for microstructure formation
826
Wafer-to-Wafer Bonding Techniques: From MEMS Packaging to IC Integration Applications
827
Wafer-to-wafer hybrid bonding technology for 3D IC
828
Wafer-to-wafer selective flip-chip transfer by sticky silicone bonding and laser debonding for rapid and easy integration test
829
Wafer-to-wafer transfer process of barium strontium titanate metal-insulator-metal structures by laser pre-irradiation and gold-gold bonding for frequency tuning applications
830
Waffle mode mitigation in adaptive optics systems: A constrained Receding Horizon Control approach
831
Waffle-grid polariser
832
Waffle-iron filters with oblique boss patterns
833
Waffle-Iron Harmonic Suppression Filter (Correspondence)
834
Waffleline packaging techniques for millimeterwave integrated circuits
835
WaFS: A Workflow-Aware File System for Effective Storage Utilization in the Cloud
836
WAFTL: A workload adaptive flash translation layer with data partition
837
WAG: Web-At-a-Glance
838
WAGA: A Flexible Web-Based Framework for Grid Applications
839
WAGBIR: Wavelet and Gabor Based Image Retrieval Technique for the Spatial-Color and Texture Feature Extraction Using BPN in Multimedia Database
840
WAGCoE Data Catalogue for Geothermal Exploration
841
WaGe 2008 Committee Lists
842
Wage demands
843
Wage incentives in printing-incentives committee of the british federation of master printers
844
Wage increment problems and fuzzy inference approach
845
Wage rates and average earnings
846
Wage structure
847
Wage System Innovation in Small and Middle Manufacture Enterprise
848
WAGE: Weighting with AHP, Grey Numbers, and Entropy for Multiple-Criteria Group Decision Making Problem
849
Wages through the Ages: The Influence of Technology on the Standard of Living
850
Wagging Logic: Implicit Parallelism Extraction Using Asynchronous Methodologies
851
Wagging Wikipedia´s long tail
852
Waging a Battle for Gender Equity: Swiss Advocates Balancing Male and Female Strengths
853
Wagner-like decoding for noncoherent PPM based ultra-low-power communications
854
WA-ICP algorithm for tackling ambiguous correspondence
855
WAID: wavelet analysis intrusion detection
856
WAIN: Wireless Ad Hoc in Infrastructure Network
857
WAIN: Wireless Ad Hoc in Infrastructure Network
858
WAIO: Improving Virtual Machine Live Storage Migration for the Cloud by Workload-Aware IO Outsourcing
859
WAIRS: improving classification accuracy by weighting attributes in the AIRS classifier
860
WAIS 2010 Organizing Committee
861
WAIS 2010 reviewers
862
WAIS 2011 Organizing Committee
863
WAIS 2011 Reviewers
864
WAIS 2012 Organizing Committee
865
WAIS 2013 Organizing Committee
866
WAIS 2015 Reviewers
867
WAIS 2015 Workshop Organization
868
WAIS Organization Committee
869
WAIS Program Committee
870
WAIS reviewers
871
WAIS-2012 reviewers list
872
WAIS-2013 Reviewers List
873
Waish Processing of Random Signals
874
Waish-Hadamard Power Spectra Invariant to Certain Transform Groups
875
Waist mounted Pedestrian Dead-Reckoning system
876
Waisted-rib optical waveguides in GaAs
877
Wait and Watch Technique: Removing Time synchronization overhead in Wireless Sensor Network
878
Wait depth limited concurrency control
879
Wait for It: Determinants of Pull Request Evaluation Latency on GitHub
880
Wait on Cost of Arc Lighting
881
Wait time for multi-messages polling system under mixed service
882
Wait Time Management for Efficient Web Service Discovery Service with P2P Architecture
883
Wait´s complex-image principle generalized to arbitrary sources
884
WAITER: A Wearable Personal Healthcare and Emergency Aid System
885
Wait-free cache-affinity thread scheduling
886
Wait-free consensus in “in-phase” multiprocessor systems
887
Wait-free deflection routing of long messages
888
Wait-Free Global Virtual Time Computation in Shared Memory TimeWarp Systems
889
Wait-free Hyperobjects for Task-Parallel Programming Systems
890
Wait-free objects for real-time systems?
891
Wait-free object-sharing schemes for real-time uniprocessors and multiprocessors
892
Wait-Free Primitives for Initializing Bayesian Network Structure Learning on Multicore Processors
893
Wait-free Programming for General Purpose Computations on Graphics Processors
894
Wait-Free Queue Algorithms for the Real-time Java Specification
895
Wait-Free Reference Counting and Memory Management
896
Wait-Free Shared-Memory Irradiance Caching
897
Wait-free snapshots in real-time systems: algorithms and performance
898
Waiting and waiting for the next killer wave [tsunami early warning system]
899
Waiting blocked-tree type deadlock detection
900
Waiting characteristics of queueing system Geo/Geo/1/∞ with negative claims and a bunker for superseded claims in discrete time
901
Waiting cycle analysis on H.246 decoder run in PAC Duo platform
902
Waiting false path analysis of sequential logic circuits for performance optimization
903
Waiting for Anonymity: Understanding Delays in the Tor Overlay
904
Waiting for Delivery of Disk Systems? [advertisement]
905
Waiting for Godot? [AP-S Turnstile]
906
Waiting for gravity [gravitational wave detection]
907
Waiting for nano
908
Waiting for nowait - [engineering transport]
909
Waiting for the Data Base
910
Waiting for the drop
911
Waiting for the rapture
912
Waiting for the Telecommunications Act to deliver
913
Waiting for the web
914
Waiting in line [queuing theory]
915
Waiting or writing?
916
Waiting or writing?
917
Waiting Probability Analysis for Dynamic Spectrum Access in Cognitive Radio Networks
918
Waiting Queue Based Bandwidth Allocation Architecture for nrtPS and BE Services in IEEE 802.16 PMP Network
919
Waiting time analysis for an OFDMA wireless cellular system with finite buffering and AMC
920
Waiting Time Analysis for Delay Sensitive Traffic in Internet of Things
921
Waiting time analysis for the generalized PEDF and HOLPRO algorithms in a system with heterogeneous traffic
922
Waiting time analysis in a single buffer DQDB (802.6) network
923
Waiting time analysis in a single buffer DQDB (802.6) network
924
Waiting time analysis of foreign currency exchange rates: Beyond the renewal-reward theorem
925
Waiting time and queue length distributions for go-back-N and selective-repeat ARQ protocols
926
Waiting time distribution for the M/M/m queue
927
Waiting time distribution in M/D/1 queueing systems
928
Waiting time distribution in real-time integrated service systems
929
Waiting time distributions for token-passing systems with limited-one service via discrete Fourier transforms
930
Waiting time distributions in buffers with batch service
931
Waiting time estimates in symmetric ATM-oriented rings with the destination release of used slots
932
Waiting time estimation with pre-specified accuracy in a single-server queueing system
933
Waiting Time for Packet-based Networks with Slow and Fast Servers
934
Waiting time in common-control queuing system
935
Waiting time jitter in FDDI to SONET payload mapping
936
Waiting time jitter reduction
937
Waiting time jitter reduction by fill locking
938
Waiting time jitter reduction by the optimum random stuff threshold modulation
939
Waiting time jitter results for a reduced complexity SONET interface circuit
940
Waiting time of handoff calls for the wireless mobile networks with dependent calls arrival processes and impatient calls
941
Waiting time optimization of non-deterministic tests at ATE
942
Waiting time prediction: an enhancement for call admission control of mobile system using neural networks
943
Waiting time predictors for multi-skill call centers
944
Waiting time probabilities in a statistical multiplexer with priorities
945
Waiting Time Sensitivities of Social and Random Graph Models
946
Waiting Times at Very Fast, Constant Service Time Merger Nodes
947
Waiting times in discrete-time cyclic-service systems
948
Waiting times in quality of experience for web based services
949
Waiting with Jose, a vision-based mobile robot
950
Waiting-time approximations for service systems with star polling sequence and mixed service strategies
951
Waiting-time distribution in computer-controlled queuing system
952
Waiting-Time Distributions and Buffer Overflow in Priority Queueing Systems
953
Waiting-Time Prediction and QoS-based Pricing for Video Streaming with Advertisements
954
Wait-time effects in CIGS PV module production
955
Wait-to-pick-as-available (W2PAA): A new MAC protocol for uplink multi-users transmissions in WLAN
956
W-AKA: Privacy-enhanced LTE-AKA using secured channel over Wi-Fi
957
Wake and cluster research: past, present and future
958
Wake and performance measurements on the Lawson-Tancred 17 m horizontal-axis windmill
959
Wake computations for undulator vacuum chambers of PETRA III
960
Wake detection in polarimetric SAR images
961
Wake detection: a multichannel approach [SAR image]
962
Wake field and the diffraction model due to a flat beam moving past a conducting wedge
963
Wake field calculation for the TTF-FEL bunch compressor section
964
Wake field computations for the PITZ photoinjector
965
Wake Field Effect on the Sase Performance of PAL XFEL
966
Wake Field Work at DESY
967
Wake fields of a bunch on a general trajectory due to coherent synchrotron radiation
968
Wake Flow Theories and Model Development for Wind Turbines
969
Wake force computation in time and frequency domain for cylindrically symmetric structures excited by bunches of electrons at the speed of light
970
Wake formation behind a finite-size dust grain in a plasma
971
Wake homing torpedo confronts with warship based on game theory
972
Wake IQ: Using a smartphone to reduce sleep inertia
973
Wake measurement behind a loaded vertical axis hydrokinetic turbine in field test
974
Wake modeling and simulation of tilt rotor UAV shipboard landing
975
Wake on LAN over Internet as Web Service
976
Wake on LAN Over the Internet as Web Service System on Chip
977
Wake potential due to a pair of dust particles in a plasma
978
Wake Potentials of a Relativistic Point Charge Crossing a Beam-Pipe Gap: An Analytical Approximation
979
Wake properties of a stripline beam kicker
980
Wake removal for clear side-scan images
981
Wake stabilization using POD Galerkin models with interpolated modes
982
Wake structure measurements at the MOD-2 cluster test facilty at goodnoe hills, Washington
983
Wake tracking with particle filter
984
Wake Transition Decision algorithm for energy saving in OBS network with LPI
985
Wake turbulence avoidance automation: Evaluation of feasibility and impact
986
Wake up MEMS for inertial sensors
987
Wake up to the future!
988
Wake vortex detection & monitoring by X-band Doppler radar : Paris Orly radar campaign results
989
Wake vortex detection, prediction and decision support tools in SESAR program
990
Wake vortex detection, prediction and decision support tools in SESAR program
991
Wake Vortex Profiling by Doppler X-band radar : Orly trials at Initial Take-Off & ILS interception critical areas
992
Wake vortex transport in proximity to the ground
993
Wake vortex X-band radar monitoring: Paris-CDG Airport 2008 campaign results & prospectives
994
WAKE: Key management scheme for wide-area measurement systems in smart grid
995
Wakefield Acceleration in a Dual-Grating Waveguide
996
Wakefield Acceleration of Quasi-Monoenergetic 200 MeV Electrons in Nitrogen and Helium Gas Targets
997
Wakefield acceleration of quasi-monoenergetic 200 MeV electrons in nitrogen and helium gas targets
998
Wakefield accelerator driven by a relativistic electron beam in a ferromagnetic waveguide
999
Wakefield and beam centering measurements of a damped and detuned X-band accelerator structure
1000
Wakefield dynamics in quasi periodic structures
